CONNECT WITH US

Samsung’s Broadcom AI chip pact expected to top US$200 billion as Hyundai expands robotics push

, DIGITIMES, Taipei
0

Samsung’s Jay Y. Lee, Broadcom CEO Hock Tan and Hyundai’s Euisun Chung attend the San Francisco AI Summit. Credit: Nvidia

Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion plans spanning semiconductors, autonomous driving and robotics.

The article requires paid subscription. Subscribe Now