Attopsemi, a pioneering provider of innovative One-Time Programmable (OTP) IP solutions, today announced a significant technological leap: its proprietary I-fuse technology has achieved silicon validation on the 7nm FinFET process. Following the previous success on 12nm process, this latest milestone reinforces Attopsemi's technical agility in scaling its proprietary solutions alongside the cutting edge of semiconductors.
Unlike conventional OTP solutions, I-fuse offers a comprehensive portfolio spanning multiple generations—from polysilicon to High-K Metal Gate (HKMG) and FinFET—without requiring additional mask layers or Boolean masking operations. This ensures seamless integration and high portability across a broad spectrum of process technologies.
Attopsemi's revolutionary I-fuse is programmed below "thermal runaway." This allows electromigration (EM) to serve as the one and only one programming mechanism, ensuring high reliability guaranteed by fundamental physics. By utilizing metal as the fuse material, I-fuse benefits from the inherent scalability of Moore's Law: as metal width and height shrink, so do programming current and overall IP footprint. This scalability makes metal I-fuse stand out among other OTP technologies.
The integration of I-fuse into advanced FinFET nodes enables a new generation of applications where small area, high reliability, low-power programming and low current read are critical. This OTP technology is poised to significantly impact the global semiconductor community, especially for AI and chiplets that need chips on very advanced nodes and from heterogeneous process technologies on the same package.
"Being able to scale I-fuse across FinFET nodes from 12nm to 7nm demonstrates I-fuse can be ported directly to 2nm GAA and beyond. The fundamental I-fuse programming mechanism for GAA is still the same, different MOS structures built by GAA are just to deliver currents." said Shine Chung, Chairman of Attopsemi.
Attopsemi continues to make significant strides in providing high-performance, cost-effective OTP technologies. Its rapid growth and technical milestones demonstrate a ready-to-deploy solution now available across an expanding range of world-class foundries.