Taiwan IC designers in rack-level AI delivery

Joyce Chen

Joyce Chen, Analyst

Rack-level delivery becomes a mainstream trend in cloud AI compute; MediaTek joins TPU design, influencing Taiwan's IC design status.

Table of contents

Introduction
System-level delivery and Google TPU
Cloud AI compute delivery goes from singlechip to rack-level system
Chart 1: Nvidia and AMD latest rack product and chip specifications at CES 2026
Chart 2: Global market share of high-end cloud AI ASIC vendors, 2026
TPU bottleneck expands to system end; solved with design services
TPU player movements
Broadcom
MediaTek
Chart 3: Designers, specifications and techs of Google TPU v7 series chips
Restructuring of IC design service roles
Chart 4: Taiwan and global top-10 IC designer revenues, 2024-2025 (US$m)
Summary
Chart 5: Partnership diagram of Taiwan IC designers and ASIC ecosystem players

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Published: March 12, 2026

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