SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans

Jessica Tsai, Taipei; Jingyue Hsiao, DIGITIMES Asia Friday 12 September 2025 0

Credit: Hanwha Semitech

Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to debut in early 2026.

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