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TSMC's AI chip plans remain on track; CoWoS capacity to double in 2025

Monica Chen; Vyra Wu, DIGITIMES Asia Wednesday 30 April 2025 0

Credit: DIGITIMES

TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary to recent market speculation about order reductions from key customers like Nvidia, according to industry supply chain sources...

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