Winbond slowing output cut, to equip new plant in 4Q23

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia 0

Winbond president Pei-Ming Chen. Credit: Winbond

The 30–40% reduction in output at Winbond Electronics' wafer fab in Taichung (central Taiwan) has been reduced to less than 20%, and the memory chipmaker plans to begin installing equipment at its new fab in Kaohsiung (southern Taiwan) in the...

The article requires paid subscription. Subscribe Now