Ultra-high-density heterogeneous integration tech sees breakthrough under Taiwan-US academic collaboration

Bryan Chuang, Taipei; Willis Ke, DIGITIMES Asia 0

Professor Liu's team at NYCU in Taiwan. Credit: DIGITIMES

A breakthrough in ultra-high density heterogeneous integration has been achieved through an academic collaboration between Taiwan and the US as part of a research project under the "Angstrom Semiconductor Initiative" sponsored by Taiwan's National Science...

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