Realtek sues MediaTek for patent bounty arrangement

Jay Liu, Taipei; Jessie Shen, DIGITIMES Asia 0

Exterior of the United States District Court House, Northern District of California. Credit: AFP

Realtek Semiconductor has filed a federal lawsuit in the Northern District of California against MediaTek, Future Link Systems, and Future Link's parent company, IPValue Management, alleging that patent assertion entities (PAE) Future Link and IPValue...

The article requires paid subscription. Subscribe Now