TSMC reportedly has started installing 3nm process manufacturing equipment at its new Fab 18b.
TSMC is scheduled to move 3nm process technology to risk production in October, with the process output estimated at 3,000-5,000 wafers between October and December, according to a report by Taiwan's Commonwealth Magazine, quoting unspecified chipmaking equipment suppliers as saying. Intel will be the first customer adopting TSMC's 3nm process, the report also claimed.
TSMC disclosed at its earnings call conference in mid-July that the development of its N3 (namely 3nm process technology) is on track with good progress, with the process technology to get ready for risk production later this year followed by volume production in the second half of 2022.
In addition, TSMC will kick off the construction of another gigafab, dubbed Fab 20, in the Baoshan area in Hsinchu, northern Taiwan in the first half of 2022. The new gigafab will be constructed in four phases, with production in the first phase slated to begin in 2024, the Commonwealth Magazine report also cited fab toolmakers as indicating.
TSMC unveiled previously plans to build its 2nm wafer fab in the Baoshan area in Hsinchu.
Taiwan will remain the home base and major R&D center for TSMC, company chairman Mark Liu was quoted as saying in previous reports. In southern Taiwan, TSMC is already expanding its manufacturing base for advanced 5nm and 3nm process manufacturing. The foundry also has plans for further expansions at its manufacturing bases in northern and central Taiwan.
