Bits + chips
Panel level packaging to see 51% CAGR during 2017-2023, says Yole
Rodney Chan, DIGITIMES, Taipei

Panel level packaging (PLP) is expected to reach a market scale of US$285 million by 2023, showing a 51% CAGR during the 2017-2023 period, according to Yole Developpement.

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