Bits + chips
Ardentec signs NT$4 billion syndicated loan
Jessie Shen, DIGITIMES, Taipei

Wafer probing specialist Ardentec has signed a NT$4 billion (US$125.4 million) syndicated loan agreement with eight local banks in Taiwan, according to a company filing with the Taiwan Stock Exchange (TSE).

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.