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Indium Corporation discusses advantages of low-temperature solder alloys, Indium-, and Bismuth-based
Press release

Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and bismuth.

This brief video features the company's Indium and Bismuth Product Manager, Carol Gowans, as she explains to electronics manufacturing expert Phil Zarrow, President and Principal Consultant for ITM Consulting, the properties and applications of indium and bismuth.

"Both alloy systems, indium and bismuth, offer significant and distinct advantages based on the manufacturing process needs," Gowans said. "These alloys are available in numerous forms from paste to ribbon to wire to preforms."

This video can be found at www.indium.com/blog/phil-zarrow.

Gowans has more than 30 years of experience in sales and product management, focusing on emerging markets and technologies. Covering a variety of markets, including medical, aerospace, and electronics manufacturing, her goal is to identify the requirements of each target market and to select the right tools (including products, technical support, etc.) to meet those requirements. Gowans has authored papers on Solder Fortification and improving solder joint reliability with the use of solder preforms. She also authors a blog on engineered solders, which can be found at www.indium.com/blog/carol-gowans.

Zarrow has been involved with PCB fabrication and assembly for more than 35 years. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in surface mount reflow soldering technology, and in the design and implementation of SMT placement equipment and reflow soldering systems. His extensive hands-on experience also includes set-up and troubleshooting through-hole, and SMT processes throughout the world.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

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