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Altera-TSMC tie-up to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Steve Shen, DIGITIMES, Taipei 0

Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20nm Arria 10 FPGA and SoC solutions, according to the two comp...

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