中文網
Taipei
Mon, Aug 8, 2022
15:29
mostly clear
33°C
CONNECT WITH US

STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing

Press release; Jessie Shen, DIGITIMES Asia 0

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition to low volume manufacturing.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories