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Nanya Technology unveils 8Gb QDP DDR3 based on TSV 3D IC technology

Josephine Lien, Taipei; Adam Hwang, DIGITIMES Asia Thursday 19 July 2012 0

Nanya Technology debuted prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D IC technology at a July 18 investors conference.

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