STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.
The article requires paid subscription. Subscribe Now
STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.
