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Kinsus lands FC CSP substrate orders from Intel, says paper

Commercial Times, May 17; Steve Shen, DIGITIMES Tuesday 17 May 2011 0

IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial Times report. Kinsus declined to comment, the paper said.

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