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Chipbond to raise gold bumping quotes

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia Thursday 20 March 2008 0

Amid a run-up in the price of gold, Chipbond Technology plans to raise its corresponding gold bumping service quotes in the second quarter, and further adjustment will be made in the third quarter, said company chairman Fei-Jain Wu.

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