中文網
Taipei
Sun, Oct 24, 2021
08:16
rain
19°C
CONNECT WITH US
ProMOS looks to push DDR2 sales by using low-cost TSOP packaging
Hans Wu, Taipei; Esther Lam, DIGITIMES 0

In order to increase its penetration rate in the DDR2 market, ProMOS Technologies has stared producing TSOP (thin small outline package) DDR2 in addition to traditional BGA (ball grid array) packed DDR2, as TSOP packed DDR2 attains a relatively lower...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories