中文網
Taipei
Mon, Nov 28, 2022
00:20
mostly clear
23°C
CONNECT WITH US

ChipMOS to double FBGA capacity in September

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia 0

ChipMOS Technologies, a Taiwan-based testing and packaging service provider, will double its monthly FBGA (fine-pitch ball grid array) packaging capacity to about 4,000 wafers in September compared to this month, according to company chairman S.D. Ch...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories
Global wafer foundry industry analysis and forecast, 2022
DIGITIMES Research Special Report Databases