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ASE forges ahead with Sandwich SCSP, SiP packaging technologies

Huang Kung Tien, Taichung; Noah Sauve, DIGITIMES Asia Monday 4 June 2001 0

Advanced Semiconductor Engineering (ASE) initiated volume production of Sandwich SCSP (stacked die chip-scale package) and SiP (system-in-a-package) products in the first quarter and is now hoping to land big orders from IDMs (integrated device manuf...

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