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Kingpaq Technology sells chip-scale BGA to SST

Amber Chiu, Taipei; Noah Sauve, DIGITIMES Asia Wednesday 21 February 2001 0

Kingpaq Technology has signed an agreement with US-based Silicon Storage Technology, whereby it will provide the technology for chip-scale BGA (ball grid array) packaging. The technology transfer will contribute NT$100 million to NT$200 million in revenues,...

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