As Intelligent Transportation Systems (ITS) becomes a global trend, abundant opportunities lie ahead. In response to these demands NEXCOM has developed a complete range of total solutions for in-vehicle computing which are capable of a diverse range of applications including fleet management, security surveillance and digital signage. With vast industry knowledge and proven market experience, NEXCOM was able to attract over two hundreds potential customers to its recent In-vehicle Computing Seminar, which took place in Taipei on the 6th September.During the seminar, NEXCOM highlighted the top three elements to consider when developing an in-vehicle system. These were reliability, power management, and expansion. The requirement to develop new ITS technology for homeland security, travel safety and transport productivity has never been so huge; however all such systems must be truly reliable and capable of operation in the harshest in-vehicle environments.All NEXCOM's in-vehicle systems including the VTC series of in-vehicle computer, the NViS mobile security surveillance, and the PDS series of in-vehicle digital signage players are born to be rugged. They are capable of operating over a wide temperature range, and can withstand dramatic levels of shock and vibration. The industrial-grade fanless design ensures the longevity and reliability, which assures the ultimate stability operations in business.When it comes to in-vehicle applications, power management is always vital. Without the right power ignition on/off delay control, power surges can quickly damage the system, whilst power loss can cause transmission data loss. The integrated PoE, for example widely adopted in NViS series mobile NVR/DVR, overcomes power supply limitations by offering power to in-vehicles peripheral devices such as cameras and monitors. The low-battery protection not only ensures the data transmission can be fully completed, but prevents car battery from drain out while drivers are absent. Finally, a wide range of power input is basic for multinationals operations.Systems requirements vary from vehicle to vehicle and country to country. Thus, the configuration must be expansible and timely customization can be offered. For example, in Europe, NEXCOM's VTC series in-vehicle computer is usually equipped with dual 3G SIM cards to assure seamless signal connectivity when cross borders. "NEXCOM learns a great deal from great successes as well as great failures. We gain our profound knowledge and experience from real cases," Peter Yang says, the President of NEXCOM. This valuable asset enables NEXCOM to offer market proven in-vehicle solutions through out the world.NEXCOM was able to attract over 200 potential customers to its recent In-vehicle Computing Seminar, which took place in Taipei on September 6.

In order to provide quick services for the semiconductor industry in Taiwan, Avantor Performance Materials, a global manufacturer of high-performance chemicals, has set up a Taiwan branch in Chupei City, Hsinchu County. The company held a Grand Opening Reception in the morning on September 20, with lots of distinguished guests' participation. Also, the Forum on Semiconductor Industry Trends was held in the afternoon, inviting key semiconductor VIPs to share the latest technology trends and to provide the audience with insightful opinions.The grand opening ceremony was started with a short speech delivered by Jean-Marc Gilson, CEO of Avantor, saying, "Avantor is a company of 140 years of history. We have served the electronics industry with J.T. Baker brand name for 25 years. After being acquired by the private equity firm, New Mountain Capital, last year, the company has changed its name to Avantor."He emphasized that with the resource provided by the new investor, the company now has more focused plans to target new markets and expand business scopes. In Avantor's global strategy, Taiwan, which is the manufacturing center of global electronics industries, is the essential part of it.As a high-performance materials supplier, Gilson indicated, "We must be close to our customer, in an effort to deliver the support and efficiency they require. This is why we decided to set up the Electronics Laboratory in Chupei.""As process technology keeps evolving, it is necessary to adopt new materials to achieve new technology nodes. Also, the collaboration between companies is a must to overcome the increasingly strict challenges of process shrinking.""In our global expansion plan, establishing the Electronics Laboratory in Chupei perfectly meets with our short, middle, and long-term business goals. Moreover, Avantor will keep developing critical materials, providing customized solutions, and enhancing supply chain reliability. We will make endeavors to be customers' long-term partner and create a win-win situation."To celebrate the establishment of Electronics Laboratory, a mighty lion dance and beating drum performance was arranged, bringing a lively and exciting atmosphere at the ceremony. Officials from local and central governments, including Dr. Hwang Wang-Hsiang, Deputy Minister of Council for Economic Planning & Development, Hsu Ming-Tsai, Hsinchu City Mayor, Chiu Ching-Chun, Hsinchu County Mayor, and C.Y. Ling, Director General of Department of Investment Service, MOEA, also attended the event, expressing their welcome to Avantor's investment in Taiwan.These honorable guests indicated that Taiwan plays a pivotal role in global semiconductor industry with great industrial clusters, talents, and infrastructures. They complimented that Avantor is making the right choice at the right time, in the right place, and wish companies in the industry can work closely to drive innovations and expand business opportunities.During the Semiconductor Forum in the afternoon, Gilson also made a presentation on the topic of "From Taiwan to the World: Solutions for Industry Growth & Collaboration Challenges", further introducing Avantor, its Taiwan market expansion plan, and the technology center vision.A company known for high-purity performance materialsThe predecessor of Avantor is Mallinckrodt Chemicals, which was founded in 1867 to manufacture chemicals for the pharmaceutical industry. In 1995, the company was merged with J.T.Baker Chemical Company, which was founded in 1904 to manufacture laboratory chemicals of the highest purity, and renamed as Mallinckrodt Baker. Last year, Mallinckrodt Baker was acquired by an affiliate of New Mountain Capital and later changed its name to Avantor Performance Materials."The acquisition is just like a rebirth of the company," Gilson said, "Now, we have the resources and corporate support to achieve our vision; that is to create a leading global player in high growth specialty chemical markets including laboratory, pharmaceutical and microelectronics."At present, Avantor has approximately 1,700 employees worldwide, with several highly respected brand names, including J.T. Baker, Macron, Rankem, Diagnova, and POCH. It has built decades-long relationships with over 10,000 customers. There are eleven global locations, including four manufacturing facilities with certified capabilities"Avantor supplies very high purity materials. It's a promise from us," Gilson indicated, "With profound experiences in pharmaceutical industry, we are known for product quality, regulatory compliance, innovation, service, and advanced quality systems. We can work closely with customers to offer a wide variety of chemicals. In addition, we are very good at taking formula to make products for customers' special needs."Regarding electronics industry, Avantor has over 25 years of experiences supplying advanced surface treatment solutions for semiconductor manufacturing, solar cell manufacturing, and flat panel display manufacturing.Avantor's main products include FEOL and BEOL etching, post-etch residue removal, bulk photoresist removal, and FEOL cleaning for semiconductor manufacturing. As for photovoltaic manufacturing, there are pre-emitter and post-emitter surface modification, inline and batch process surface modification. Also, the photoresist removal for flat panel display manufacturing.Reviewing the development of semiconductor industry, Gilson pointed out that when the industry migrated to 90nm, it was considered a big technology jump at that time. But it was only 7 to 8 years ago, now we are moving to 28nm era. To survive in the highly competing market, to lead the market is the key, or will lag far behind."Avantor focuses on surface treatment solution, which is a magic to high-yield manufacturing. As process node keeps advancing, using the same chemistries is not possible. Moving ahead, adopting new material is a must. Only chemistries can help you to get there."The brand new Avantor will complete its offering of performance materials and chemistries through organic growth and acquisitions. In addition to expand manufacturing footprint, the company will also increase R&D spending 3X over historic levels, and adopt SAP Enterprise Resource Planning (ERP) to implement complete operational solutions.Gilson emphasized, "We will leverage our improved global supply chain with localized manufacturing to serve the market better. We already invested in Poland and India to get cost-effective raw materials, and are actively investigating Asia/Pacific manufacturing resource.""As a result, in terms of building supply chain, setting up Taiwan branch and the Electronics Laboratory is key to our strategic deployment, with the aim to offer one-stop shop services for customers in Taiwan."To drive innovation through collaboration"Taiwan has two of the world's largest foundries. Processes and tools are here to drive roadmaps and technologies. The answer is very obvious for us to have major investment in Taiwan," said Robert Ferguson, Executive Vice President of Electronic Materials and Northeast Asia, "Also, we can see great opportunity for productive collaboration and technology innovation here."The new electronics applications laboratory is planned to open by the end of 2011, which will provide applications support to high-volume manufacturing customers, while furthering research and development. It will be used to conduct customer demonstrations, perform process of record (POR) development and support Avantor's global electronics technologies development."Our goal is to set up an all-in-one 'virtual fab' to support global customers more quickly with access to advanced 300mm process tools and latest generation metrology tools for customers. It's a unique way in the industry. In this lab, the combination of research and development, applications engineering and small volume manufacturing resources will speed collaboration with customers, leading to faster and more efficient technology development."The lab will be equipped with full suite of state-of-the-art systems. Customers will be able to use the systems to test chemistries and materials in a class 100 clean room fab environment, rather than disrupting operations by taking their own production equipment off-line for testing purposes."Simply put, it's all about collaboration. We got to be close to our customers, rather than imagine their requirements from hundreds or thousands kilometers away," Ferguson stressed, "The investments aims to help customers achieve aggressive technology roadmap targets. We will move forward together with customers from providing high quality product, increasing performance and faster time to market, to achieve next generation advances."Avantor is expanding staffing in Taiwan branch. According to Ferguson, "We have built a professional and passionate team. Also, along with our resources in China and Korea, we will be able to bring real-time support and service to customers in Taiwan and Asia. Either solving routine operational problems or joint developing new materials, we will be customers' best partner."TSMC leads innovations to keep Moore's Law aliveReviewing the progress of technology industry, Dr. Bing J. Shue, Senior Director of TSMC, said, "Starting from PC, the industry has been quickly moving towards consumer electronics with 3C or even 4C integrations. Now, as mobile computing is sweeping the planet, smartphones and tablets have replaced PC becoming the major computing devices. Moreover, the emergence of cloud computing will also bring radical changes to the industry."He believed that the continuous paradigm shifts of the industry can benefit the IC industry at large. However, the increasingly demands for more functionality integrated in handheld devices have pushed the chip design trend from SoC to heterogeneous integration at product level. This will bring strict technical challenges for semiconductor industry."Take process shrinking as an example, 90nm node started in 2004, then moved to 65nm in 2006, 40nm in 2008. Now, 28nm is in mass production, and 20nm will be in pilot run next year. The design complexity and cost are getting escalating."Even though challenge ahead, Dr. Shue is still optimistic, saying, "Semiconductor industry is good at coping with challenges. We have been overcome many difficulties that were considered impossible at first. Therefore, as Moore's Law is pushed to limit, leading semiconductor companies still be able to make challenges as their opportunities."However, as design complexity and cost keep rising, only fewer companies can continue investments to drive the road map. And the gap between processing cost and design cost is getting bigger from 45/40nm. According to Dr. Shue, the cost for developing 20nm process may be up to USD 100M, and only mask cost will account for USD 10M. Therefore, the economical benefit that resulted from process shrinking is no longer valid. This is why TSMC needs to build 450mm fab, which will be a few years down the road.The semiconductor industry has built an increasingly higher cost barrier. He estimated that there are 17 companies offering 65nm technology. The number is reduced to 13 in 45/40 nm node, and 6 in 32/28 nm node. Furthermore, the number will only be 3 in 22/20nm. Under this development trend, commitments, collaboration, and robust ecosystem are required to increase the success opportunity.TSMC's capex this year is USD 7300M, leading other companies. Its 28nm begins to ramp up and 20nm is in test. It will adopt FinFET 3D transistor structure in 14nm node, and the roadmap for 10nm and beyond is also planned."From FinFET, 3D IC, to advanced lithography, we will enable more innovative technologies to achieve the future generation process advances," said Dr. Shue, "We need to establish a strong platform enabling the collaboration among different companies. With our OIP, Open Innovation Platform, we will co-work with customers and third-party vendors, including EDA/IP providers, to push the continuous development of Moore's Law."The multi-platform stage: a new era for the Asian semiconductor industryColley Hwang, President of Digitimes, also spoke at the Forum, saying, "Shaky PC demands, emergence of new technology platforms, and the influences of emerging markets and China are the key topics in the ICT industry currently."He pointed out, "It is undoubted that Asia will be the center of technology industry in the future. For example, China's PC market already surpassed the State, becoming the largest market in the world. And Taiwan plays an important role in the global ICT manufacturing."There are 735 listed ICT companies in Taiwan, ranging from ICT manufacturing, semiconductor, optical, networking, components, distribution, IT service, and others. Their total revenue in 2009 was USD 312,794M, and the number increased to USD 424,581M in 2010, with annual growth rate 35.7%. It fully shows the strong ecosystem and infrastructure built in Taiwan.In addition to the strong manufacturing capability in worldwide notebook market, Taiwan also plays an important role in Apple's iPad, in terms of components and manufacturing, such as touch panel, mechanism components, and assembly. According to Hwang, Taiwan already accounts for 88% of worldwide tablet shipment.Therefore, behind those world-famous brand names, such Asus, Dell, HP, Lenovo, Samsung, Apple, and Acer, there is a huge ecosystem under the iceberg, covering from the upstream foundries TSMC, UMC, IC houses MediaTek, Realtek, components providers TPK, Catcher, distributors WPG, Synnex, to ODMs Quanta, Wistron, Hon Hai. The profound influences of Taiwanese technology makers can't be overemphasized.However, as Wintel architecture no longer dominates and Apple sweeps the market, the profit and business models that tech vendors used to be familiar with have encountered huge challenges. "The overall values of products have expanded from patents, market share to manufacturing and ecosystem, which further demonstrates the importance of Asia," said Hwang.He explained the reason why Samsung could be successful in the new era, saying, "The way Samsung leads the market is that they are brave to take the initiative to invest. Therefore, they can enjoy the benefits of being an early technology provider, and then take the advantages of cost reduction later on."Hwang indicated, "Willing to take risk is the key to Samsung's success. In light of this, Taiwanese makers should reconsider their operational model and strategy, in order to leverage existing strong foundation and create a new wave of growth."He stressed, "It's the end of Play Safe stage. Companies can't just develop one or two products and expect to earn long-term success. It is simply not enough. Platform strategy and thinking are required to gain the sustainability. As a result, Taiwanese companies should closely work with platform providers like Google, develop their own second core business, and strengthen application capabilities to have the long-term prospects."At the end of the Forum, Gilson said, "Dr. Shue and President Hwang's talks further prove the key roles that Taiwan and Asian will play in the future technology industry. Avantor comes here for the ecosystem and collaboration opportunities. We sincerely hope that we could have great developments here and grow with Taiwanese companies together," wrapping up the full-day event with a perfect closing remark.Jean-Marc Gilson, CEO of AvantorRobert Ferguson, Executive Vice President of Electronic Materials and Northeast Asia of Avantor

LSI announced on September 14 that it is working with Microsoft on the development of low-cost, Windows-based, high-availability (HA) server clustering solutions for Cloud datacenters and small and medium business (SMB) environments. The solutions will combine Microsoft's experience in managing clustered server environments through the Windows operating system with LSI's expertise delivering highly scalable storage and RAID interconnect technology.The result of this effort is intended to lower the cost and complexity of HA systems clustering for server platforms based on Microsoft's next-generation OS, codenamed Windows Server 8, by providing fully redundant shared-node storage and application failover without requiring additional networking hardware. The solutions are designed to provide both clustered DAS for application servers and clustered NAS when used for file serving environments.The combination of HA-DAS with Windows Server will allow Cloud datacenter providers to support a wider array of applications and enable scale-out to larger server clusters while preserving low latency. For SMBs running local applications, HA-DAS will offer a more cost-effective and easier to deploy and manage solution for avoiding application downtime and the associated lost productivity and revenue. The solutions will also help to increase storage utilization and reduce power, cooling and space requirements for a lower total cost of ownership.For more information about the LSI and Microsoft co-development work on HA-DAS solutions, please visit http://www.lsi.com/about/newsroom/Pages/20110914pr.aspx

Applied Materials, Inc. advanced the state-of-the art in photomask technology with its new Applied Centura Tetra EUV Advanced Reticle Etch system. Overcoming a major hurdle to the adoption of EUV (extreme ultraviolet) lithography, the new Tetra EUV system solves the critical and unmet challenge of etching the new EUVL photomasks with nanometer-level accuracy and world-class defect performance to enable the fabrication of multiple new generations of high-performance semiconductor chips."Our new Tetra EUV system expands the capabilities of Applied's industry-standard Tetra etch platform, which is used by the great majority of advanced mask makers today," said Ajay Kumar, vice president and general manager of the Mask and TSV (through-silicon via) Etch product division at Applied Materials. "Applied continues to invest in technologies that are important to our customers and will enable next-generation design nodes. We have already shipped multiple systems and we are working closely with virtually every leading mask maker to help the semiconductor industry accommodate this significant technology inflection."EUVL photomasks are fundamentally different than conventional photomasks that selectively transmit 193nm wavelength light to project circuit patterns onto the wafer. At the 13.5nm wavelength used by EUVL, all photomask materials are opaque, so the mask contains complex multi-layer mirrors to reflect circuit patterns onto the wafer instead. The Tetra EUV system is designed to etch new materials and complex layer stacks to meet the stringent pattern accuracy, surface finish and defectivity specifications required to achieve high lithography yields when operating in this reflected mode.The Tetra EUV system is part of Applied Materials' comprehensive portfolio of solutions to optimize the productivity and yield of its customers' photomask and lithography operations. The system is supported by Applied Global Services, the industry's most comprehensive service and support network, to maximize system uptime - a vital priority for mask etch tools. For more information on Applied Materials' lithography-enabling solutions, visit www.appliedmaterials.com/advanced-litho.Applied Materials Tetra EUVPhoto: Company

Sony on September 15 unveiled its Handycam PJ5 camcorder for immediate launch and two Walkman series, A860 and A760, for launch on September 23 in the Taiwan market.Handycam PJ5 features a 1/8-inch CCD image sensor, 57x optical and 1,800x digital zoom, a 2.7-inch 16:9 LCD screen, dimensions of 58.5(W) by 55.5(H) by 124.5(D)mm, a weight of 280g (not including memory card and battery) and a built-in pico-projector, and sells at NT$14,900 (US$514).The recommended retail prices for the A860 are NT$10,990 for the 32GB model, NT$8,990 for 16GB, and NT$6,990 for 8GB, and those for the A760 are NT$7,490 for 16GB and NT$5,990 for 8GB, Sony Taiwan indicated.Sony Handycam PJ5 Photo: CompanySony Walkman A860 series Photo: Company

Memoright will showcase its latest ruggedized, extended temperature SSD solution, GTR II, as well as a range of SSDs for industrial PCs, business servers and storage systems at DSEi to be held in London from September 13-16 at Booth S10-263.Memoright's self-developed circuit design and close-examination manufacturing process for the GTR II provides high performance and 100% constant speed, the company claimed. GTR II supports SATA II and is available in 32GB, 64GB, 128GB and 256GB capacities.Memoright GTR II supports Secure Erase & Destroy functions and satisfies all military standards under "MIL-STD-810F", which is the standard test method approved for use by all Departments and Agencies of the US Department of Defense (DoD), the company claimed.The Memoright GTR II also features Memoright's proprietary and unique "In-Drive UPS", which ensures 100% data integrity at all times. This avoids abnormal bad blocks and prolongs the useful life of SSDs.As one of a few SSD suppliers that are capable of providing customized services for ruggedized SSD solutions, Memoright is proud of being able to participate at DSEi to share its latest technology development and product roadmap with thousands of engineers and R&D specialists that are visiting DSEi, Memoright president Alex Kuo stated.Memoright's ruggedized SSD solutions have made inroads into the specialized application segment in an array of industries including military, industrial control system, aviation, business server and storage system with major clients spreading across North America, Europe and Asia Pacific. Optimizing its in-house developed SSD controller chips and integrated firmware development capability, Memoright offers customized services that meet the stringent demand for the establishment of reliable and efficient systems.

The SEMI International Standards Committee has approved the formation of a Taiwan 3DS-IC Standards Committee, which will work closely with the North American 3DS-IC Standards Committee to develop the standards urgently needed to make low-cost, high-volume manufacturing a reality. The committee will be led by Yi-Shao Lai, Advanced Semiconductor Engineering (ASE) Group; Wendy Chen, King Yuan Electronics Company (KYEC); and Tzu-Kun Ku, Taiwan Industrial Technology Research Institute (ITRI).As Ku explains, "SEMI Standards are manufacturing needs-oriented through the whole 3DS-IC industry supply chain, and based on its well-established semiconductor production experience, Taiwan is eager to actively contribute to SEMI 3DS-IC standardization." Several Taiwan-based TSV, bonding and thinning, testing, inspection and metrology, and equipment and materials companies will be contributing, with initial efforts expected to focus on testing and middle-end processes.The Test Task Force will be led by Sam Ku of KYEC, Roger Hwang of ASE, and Alex Shu of ITRI. This group will work on defining a common testing standard and methodologies for probe tests at different manufacturing stages on heterogeneous chip stacks, passive interposers, or the complexity module to enable the high yield and reliable final systems. The Middle-End Process Task Force will be led by Arthur Chen of CMPUG and Jerry Yang of SEMATECH, along with staff from ASE and ITRI, and examine 3DS-IC middle-end processes involving shared activities between wafer foundries and OSATs, including embedded via protrusion and viaed wafer thinning, and define outgoing and incoming inspection items and metrologies for intermediate viaed wafers, in-process ESD criteria, in-process inspection items and metrologies in viaed wafer thinning process.Several SEMI Taiwan members are already active in the North American 3DS-IC Committee, so communication and collaboration between the two regions has a strong head start. Yi-shao Lai of ASE, who will chair the new Taiwan Committee in addition to leading the North American Inspection & Metrology Task Force, describes his motivation, "SEMI has a strong reputation for successful standardization, which is why the Taiwan 3DS-IC industry has selected the global SEMI Standards platform to develop consensus on materials, equipment, and other manufacturing areas where standards are needed to drive down cost."

Micro-Star International (MSI) has launched two new gaming notebooks, the GT780DX and GT683DX featuring the Intel Core i7 processors and Nvidia discrete graphics chips.Both gaming notebooks feature Intel's second-generation Core i7-2630QM quad-core processor with Nvidia's high-end GeForce GTX 570M discrete graphics card, and are both equipped with gaming keyboards made by SteelSeries.The two systems support DDR3 memory up to 16GB, while the adoption of RAID 0 settings for the notebooks' hard drives help double their storage capacity, while accelerating read-write speeds by 70%, MSI claimed.The MSI GT780DX sports a 17.3-inch Full HD screen and comes with Cinema Pro technology for a crisper picture and richer colors, while the GT683DX features a 15.6-inch panel. Both devices are equipped with an 720p webcam.Both machines also use MSI's exclusive Turbo Drive Engine (TDE) and Cooler Boost technologies. MSI gaming notebooks specifications Items GT683DX GT780DX Processor Intel Core i7-2630QM Processor (6M Cache, 2.00GHz) Operating System Genuine Windows 7 Ultimate Genuine Windows 7 Professional Genuine Windows 7 Home Premium Memory DDR3 1066/1333 MHz up to 16GB Display 15.6-inch Full HD (1920×1080) 17.3-inch Full HD (1920×1080) or HD+ (1600×900) LED backlight Graphics Nvidia GeForce GTX 570M with 1.5GB GDDR5 memory Video Output 1x HDMI, 1x VGA Hard Disk Drive 750GB SATA 7200rpm + Intel 120GB SSD 500GB SATA 7200rpm + Intel 120GB SSD 750GB (4K sector) x2 750GB SATA 7200rpm x2 500GB SATA 7200/5400rpm x2 320GB SATA 5400rpm x2 Optical Disk Drive Blu-ray / DVD Super Multi Interfaces 2x USB 3.0, 2x USB 2.0, 1x eSATA, SD(XC/HC)/MMC/MS(PRO)/xD card reader 2x USB 3.0, 3x USB 2.0, 1x eSATA, SD(XC/HC)/MMC/MS(PRO)/xD card reader Sound 2.1ch speakers, Sound by Dynaudio, THX TruStudio Pro Communication 802.11 b/g/n WLAN, Bluetooth 3.0+HS, 1x Gigabit LAN Dimensions (W×D×H, mm) 395 × 267 × 55 428 × 288 × 55 Weight 3.5Kg (w/Battery) 3.9Kg (w/ Battery) Source: Company, compiled by Digitimes, September 2011MSI GT780DX gaming notebookPhoto: CompanyMSI GT683DX gaming notebookPhoto: Company

23th August 2011, Taipei, Taiwan - GlacialLight, a division of the experienced technology manufacturer GlacialTech Inc., today expanded its Capella Series of LED products with the new GL-DL08 LED Downlight. This high-performance 8-inch 18 Watt LED downlight is an all-in-one bulb and fixture for ease of installation. Just wire the GL-DL08 into an 8-inch hole in a ceiling, and fill indoor spaces with 120 degrees of light of up to 1200 lumens. This high-brightness lighting solution's slim, sleek, and fashionable circular design make it perfect for use in malls, supermarkets, showrooms, offices, hallways and all other indoor applications. With a CRI of up to 75, it is also a perfect choice for residential lighting. These LED downlights accept a wide range of power sources, from AC 100V up to 240V. Users can choose from models with color temperatures of 3000K, 4000K, or 6000K, which provide 830, 950, and 1200 lumens of light respectively. With lifespan rated at a long 30,000 hours, GlacialLight's Capella Series Downlights outlast the competition and bring years of functional, high-quality, well-designed light to users. They are a fashionable choice for commercial and residential lighting applications. As well as the currently available 8-inch and 6-inch diameter LED Downlights available in the Capella Series, GlacialLight plans to offer 4-inch and 10-inch sizes in future. With environmental protection in mind, GlacialLight has designed the Capella Series GL-DL08 LED Downlight to be RoHS compliant. Furthermore, these downlights contain no hazardous chemicals, such as mercury, and do not emit harmful UV or IR rays, making them more eco-friendly than traditional lighting fixtures. In addition, power conversion efficiency is greater than 80%, helping to reduce energy costs. GlacialLight is very excited to be bringing consumers the all new Capella GL-DL08 LED Downlight Series. LED Capella Series, GLDL08 Features- Indoor use- High power efficiency > 80%- High luminous efficiency LEDs- No UV or IR radiation- Cool light minimizes rise in ambient temperature- Energy saving and environmentally friendly- Slim, compact and fashionable design- CE and FCC certifications Excellent LED lighting products you can trust Design of LED lighting products is based on three core technologies, including: electrical design (LED drivers), mechanical design (cooling devices), and optical design (lamp holders). These roles are performed respectively by GlacialPower, GlacialTech, and GlacialLight in the GlacialTech family. With the three core technologies in hand, GlacialTech has integrated all the resources required for exceptional designs. The company manufactures excellent LED lighting products which you can trust. 18 Watt GLDL08 LED Downlight is a new high performance LED downlight for commercial or residential usePhoto: Company

Acer has announced its first Ultrabook at the IFA consumer electronics show in Berlin. Acer claims the Aspire S3 integrates the best features of notebook and mobile devices.Acer Green Instant On technology provides instant-resume functionality and ensures battery longevity, while Acer Instant Connect delivers faster Internet access. The Aspire S3 is encased in a thin, light metal design that is sturdy and aerodynamic. It will be available in select regions from September.For easy-to-carry convenience, the Aspire S3 measures 1.3cm and weighs less than 1.4kg. It is also equipped with a full-size Acer FineTip chiclet keyboard, designed for comfortable use and maximum productivity. All-day usability is assured by a super-lightweight, high-density battery that delivers up to seven hours of running time. The design of the Aspire S3 features a strong and lightweight aluminum/magnesium alloy chassis, and a lid with a fingerprint-free metal finish, the company highlighted.The 13.3-inch ultra-thin HD LED display adopts an open cell design to conserve materials by using the lid and bezel to form an aluminum frame for the screen. This creates a super-slim yet protective profile and reduces the energy required during manufacture as compared to conventional panel designs.The Aspire S3 features a vent-free bottom so the notebook rests comfortably on the user's lap. Warm components are placed away from the palmrest and touchpad area, so users will not feel any heat discomfort, Acer said. A new airflow design also dissipates warm air from the rear of the notebook, preventing air from blowing towards the user's hands. Finally, the fan motor is optimized to enhance efficiency and lower power consumption to help increase system battery life.The Aspire S3 features the latest second-generation Intel Core i3/i5/i7 processors for full computing and digital creation capability, and a choice of 240GB SSD or 320/500GB HDD with embedded SSD for ultra-fast access and media and data storage.Standard HDMI output is also included for connecting the Aspire S3 to popular HD peripheral devices. Furthermore, users can share data or download photos from their digital cameras using the 2-in-1 card reader that supports SD Card and MMC formats.On-the-go users can keep in touch with friends and colleagues with video conferences thanks to the integrated Acer Crystal Eye 1.3-megapixel camera and microphone. In addition to Wi-Fi, wireless is enhanced by the addition of latest-generation Bluetooth 4.0+HSR technology with lower power consumption.Acer Aspire S3 UltrabookPhoto: Company