Within the field of optical sensors, vendors are dedicated to using CMOS process to develop all kinds of smart sensors for detecting ambient background lighting, LED colors, personnel distance and UV, which not only allows smartphones, tablets, smart TVs and displays to have more interactions with people, but also reduces energy consumption and carbon emissions.Speaking at the recent DTF 2012 Ultra Mobile & Ecosystem Forum, Campella Microsystems president and CEO, Dr. Cheng-chung Shih, first introduced the company stating that it was established in August 2002 and that it has focused mostly on ambient light sensors (ALSs), infrared data transmission, optical encoders, PDICs, proximity sensors, color sensors and UV sensors.At present, Campella's ambient light sensors and proximity sensors are used in communication products, mobile phones, smartphones, digital cameras, notebooks, desktop computers, LED backlight modules, automated office products, household appliances and automotive electronics. The company's products are mostly found in mid-range and high-end market segments and are being used by Dell, LG, Taiwan- and Korean-based smartphone vendors' supply chains and its lights sensors have also been certified for Windows 8.Campella was originally involved with optical fiber and optical communication sensor components. In its early stages it developed integrated photo diode and I/V amplifiers (PDICs) that used analog IC designs combined with CMOS process and optoelectronic system technology. It create high-speed, high-sensitivity and high-bandwidth PDICs such as CM1212P2SA, CM1277P2ZM and CM1286P2SA (PD+TIA) for use in CD-ROMs, DVD-ROMS, CD-RWs and combo drives and later in IrDA (Infrared Data Association) transmissions, plastic optical fibers and ambient light sensors.Optical encoders such as CM7020W1, 7150/7151/7152W1, CM7181/7182W1, CM7300AW1 and CW7300 276LPI can be used for motor speed detection and positioning control. IrDA components such as CM2811W1 have allowed PDAs, smartphones and notebooks to act as remote controls and low- to mid-speed data transmission applications, making it a popular and low-cost data transmission technology for early mobile devices.Smart color adjustment for TV and better UV protection Campella's color sensor chips such as the CM3320 are used in LCD TVs and monitors and the color sensor chips made using advanced CMOS process not only sense color temperature changes, but also automatically adjust to the best color temperatures available for a screen, allowing it to reach the most optimal white balance. This gives LCD TVs and monitors the best white balance and color performance no matter what the conditions may be. Take 22-68W as an example, the color sensors can help smart TVs save 67% on power consumption, which is why Campella's color sensor is used in Japan- and Korean-made LCD TVs.Campella has also developed the CM3512 UV sensor for cell phones. Very often the outdoor light does not seem very bright, but the UV level may be already very high. Ordinary light sensors may not be able to determine the accurate UV levels. Campella uses an CMOS process to provide high-quality and low-cost UV monitor solutions that are able to accurately measure UV levels in terms of the UV Index, which is good for reminding customers, especially female ones, to take appropriate UV protection. These solutions have been adopted by several major smartphone vendors.Ambient light sensor technology and smart adjustments for display panel backlighting Shih said ALSs form the biggest segment of the company's light sensor product portfolio. ALSs can automatically adjust a display panel's backlighting brightness in accordance with changes in an environment's lighting and can maintain the most optimal lighting levels along with lower power consumption for LCD displays. Campella's existing CM3202, 3204, 3206, 3212, 3213, 3217, 3218, 3220 and the latest CM3232 ALS chips all use Filtron patented technology that provides linear output and temperature compensation to avoid outside ambient light interference. Shih added that ALSs are slowly becoming components that all cell phone makers are using, and that proximity sensors are also being used in cell phones. When the user is talking on the cell phone, the proximity sensor will turn off the cell phone screen and its touch capabilities, which saves power and extends battery life, added Shih. Long distance proximity sensors (LDPSs) on the other hand are used in LCD TVs, monitors, all-in-one (AIO) PCs, and can even detect personnel attendance as well as hand and body movements. Without any connections or contact, the LDPSs can automatically turn on and off devices, have dynamic control of speaker volume and keyboard backlighting. If a person leaves a device, it will automatically turn off by itself and will turn back on once that person is back near it. The speaker volume can be adjusted through an earpiece sensor via this technology as well. Campella also provides software programming, which greatly reduces clients' time for product development.Smart optical sensors for tabletsMost tablet users, whether they are holding a tablet in a landscape or portrait position, will inevitably have their fingers touch the sides of the tablet or even cover the sensor. If the tablet's sensor is not advanced enough, it will assume that it is being covered with a case and will then turn off. Therefore, the smart Lid Cover Sensor (LCS) is the best solution.Campella's LCSs use the company's patented technology which can detect the difference between the thin lid of a table that completely blocks off light, and the finger that still allows a small amount of light to pass through. With Campella's smart LCS, a device, such as the iPad, can be switched off quickly when the lid is closed, and will not be switched off inadvertently when touched by a finger. The CM36262 combines the functions of the ambient light sensor, proximity sensor and smart optical lid sensor using Campella's patented Dual Filtron technology to directly transmit digital signals to the digital signal processor through embedded 8-bit or 16-built digital converters. There is also a built-in low-pass filter to avoid external interference from affecting product performance.It can read wavelengths of 450-650nm, simulate the light sensory levels in the human eye, and automatically adjust backlighting to make peoples' eyes feel comfortable as well as saving energy. The proximity sensor can accurately detect objects nearby, which are applied in cell phones for turning off the screen and touch functions during a phone call. In addition, smart LCSs used on tablets can differentiate finger touch and hand grips from the devices' lids, allowing smart automatic control of the power.Optical sensors for smart LED lighting Shih also noted that Campella has developed a DC/DC RGBA LED controller chip enabling direct lighting feedback in LED lighting fixtures and lighting equipment. It uses the highly-integrated, wafer-level Filtron technology. Through I2C smart control it is able to directly make adjustments and feedbacks directly based on the light source to create the best energy efficiency. Aside from possessing accurate color adjustment and lighting levels as well as having O-Trim for consistency, it is able to avoid overheating and aging.Shih concluded that with its most advanced CMOS process technology, Campella is able to provide superb color reactions, 2000-6500K color temperature compensation, excellent linear output signals, and avoids light flickering. It is the best CMOS process solution ready for volume production. Shih added that the next industrial revolution will create a new era where sensors are found in all smart connected devices. Campella is on the forefront of the sensor field, and it will go beyond optoelectronics to create all kinds of sensors.Campella Microsystems president and CEO, Dr. Cheng-chung Shih

In order to create light and ultra-thin ultra-mobile devices, panel makers are looking to thin down their LCD and touch displays to as small a mere 0.1mm, which is a major task. In addition, when ultra-thin, transparent and flexible OLED panel technology becomes more common, mobile device designers will be able to utilize the thin panels to look even more different.Speaking at the recent DTF 2012 Ultra Mobile & Ecosystem Forum, AU Optronics (AUO) vice president & mobile product career group general manager, Wu Dagang, first played a short film depicting the future of display technology applications. In the film, a group of students sitting at an outdoor and discussing academics. One of students takes out a display device that resembles a transparent plastic plate. Not only can the device display clear images and videos, it is also flexible and bendable. A burst of wind then blows the display device together with a pile of paper to the ground; however, because of its thin, flexible and tough material, the device doesn't break. Another student comes to the intersection on a bicycle where the device has flown to, picks it up, clicks on the panel GPS's navigation option and gets directions. This is the new generation of flexible displays that AUO would like to introduce.Returning back to his presentation, Wu talked about handsets and how they compare with present ones, saying that handsets were invented only 20 years ago and were as large as a kettle, whereas today, they can be held and controlled with one hand and can easily fit into a pocket. When a device's limitation has been changed, its technology creates many new demands, added Wu.Device requirements: From movable, to mobile to 'pocketable'Wu said when cloud computing and services become more widely accepted, all things can be shared, stored and accessed through a centralized server. More so, people will expect portable and mobile devices to be "pocketable." The most classic representation of this notion is the increase in mobility from personal desktop computers to notebook computers, and then from ordinary mobile phones to smartphones. But we still hope that devices can be even smaller, be pocketable, and able to access information anytime and anywhere.The benefits of having a slimmer display panel are that it can increase battery capacity and battery life. The progress of existing lithium battery technology is rather slow but indispensable and its power storage capacity and supply time is proportional to the battery size. If an LCD module thickness is reduced by 25%, the leftover space will allow lithium capacity to be increased by 10%. If a smartphone has a 1,200-mAH lithium polymer battery, an extra 120mAH is equivalent to adding power enough for two hours of video watching, added Wu.Another benefit is weight reduction. When a display panel's LCD module thickness is reduced by 10%, the weight of the whole device can be reduced by 15%, and will further push devices to become slimmer. Aside from Apple products having a simple-to-use interface, stylish designs are also selling points. A few years ago there was more emphasis on product features and specifications, but now that emphasis has gradually transformed into daily-life applications and even into stylish design products for women.Flexible and bendable disaplay panel designs According to statistics, 20% of mobile phones that are sent back for repair are due to screen rupture. To make display panels that are thin and not easy to break, in fact, is a challenge as the two features conflict with one another. AUO's Slim Solution targets four main areas: OLED (organic light-emitting diode) displays, slim touch solutions, flexible and bendable solutions and slim modules. Making OLEDs is a very delicate process and the thin display technology is very forward-looking and revolutionary.Wu further elaborated that since LCD itself cannot emit light, it needs a filter glass coupled with a reflective sheet, which will increase thickness by at least 1.5mm. OLED on the other hand is a self-luminous device that can be reduced the 1.5mm. LCD modules also have the possibility of becoming thinner. Slim touch solutions allow touch panels to reduce the two-glass structure to a one-piece structure, and then become in-cell touch that further reduces the thickness by 0.4-0.5mm.Ultrabook further drives panel thinness Intel estimates that 40% of laptops will use the same standards as its ultrabook in the future, and that 10% of notebooks sold in 2012 will be ultrabooks.Generally a notebook's cover thickness is 19-30mm, whereas the ultrabook's has dropped to 18-19mm and has a total body thickness of 21mm for 14-inch and above models and 18mm for models below 14 inches. The display module has also been significantly reduced in thickness to 3mm and is expected to drop to 2.8mm by 2013.Taiwan-based companies have a positive attitude toward the ultrabook. Asus, Lenovo, Toshiba, along with other vendors have ultrabook products, indicating that the ultra-thin notebook will be an important selling point in the second half of this year.The iPad is also becoming thinner. The first generation iPad had a thickness of 13.4mm, with a 3mm thick display panel; the second generation iPad2 saw the body thickness reduced to 8.8mm with a 2.5mm ultra-thin panel.Key components of ultra-thin display panelsA display panel is composed of ITO, CF and TFT array glass on the upper layer, and film, LED/LGP components on the lower layer. First, the glass thickness has gone from 1.1mm 25 years ago all the way to 0.5mm at present and is predicted to drop to 0.3mm for tablets and 0.2mm for mobile phones in the future. In addition, light guide plates (LGPs) used in notebooks will have a thickness of 0.6mm from the present 0.8mm, whereas LGPs used in tablets will drop to 0.4mm. Notebook LED backlights will drop from 0.8mm to 0.6mm as well while tablet-use LED backlights will have a thickness of 0.4mm, a drop from 0.6mm.AUO has key technology to solve the problem of luminosity when the current density is increased. AUO can reduce the thickness of LGP/LED components without increasing the current density.In terms of touch panels, older cell phones adopted the glass-film (G/F) structure and tablets adopted a glass/glass (G/G) one. What once was G/G later became the one-glass solution (OGS) and then in-cell touch, with the sensor layer located between the CF and TFT array.At present, AUO's thinner G/G structure has a cover glass of 0.7-0.55mm and sensor glass of 0.4mm, reducing the overall thickness by 1.2mm, and can be used in notebooks, all-in-one PCs and tablets. OGS can be reduced to a thickness of 0.4mm and can be used in tablets and 27-inch flat-panel displays. Wu estimates that 5 to 10% of ultrabook shipments this year will have built-in touch.Wu added that designs of flexible displays and touch screens, as well as notebooks and digital cameras that have no protective glass, must adopt in-cell touch. The technology is compatible with existing TFT panel processing and only a few more steps need to be added for producing the sensor layer. However, currently it will be more suitable for touch panels of six inches and smaller due to the noise issue of in-cell technology.AUO displays AMOLED panels, challenging Samsung's dominance of the technologyWu also mentioned that last year the Samsung Galaxy S2 used an 8.49mm AMOLED panel to make the world's thinnest cell phone; but this year at the CES 2012 exhibition, China-based Huawei and Japan-based Fujitsu exhibited their Ascend P1S and F-07D handsets that are 6.68mm and 6.7mm in thickness, respectively, due to AMOLED panels that were used in the designs. According to data from DisplaySearch and TSR, up to 127-201 million AMOLED panels will be shipped in 2012, and approximately 320-455 million panels by 2016.Last year at the FPD 2011, AUO exhibited its 4.3-inch qHD (540x960, 257ppi) high-resolution AMOLED panel, its 4-inch WVGA (800x400) AMOLED with on-cell touch, and its 6-inch transparent AMOLED panel. Technology for thinning AMOLED panels has gone from 1.2 mm in the form of encapsulation glass coupled with TFT OLED glass, to 0.6mm in the single-glass type that has an encapsulation film and TFT OLED glass, and further to only 0.3mm in a bendable, water-proof and anti-shock form adopting TFT OLED films. Moreover, at the FPD 2011 AUO displayed a plastic film-designed 4-inch VGA (640x480) high-resolution flexible AMOLED display that is 0.3mm thick.Wu concluded that AUO offers a full range of thin panels and modules, and provides a full range of 3-27 inch OGS touch panels. He also said flexible AMOLED is the future trend for smartphones, and that embedded touch technology will add to the flexibility of displays.Photo: AU Optronics (AUO) vice president & mobile product career group general manager, Wu Dagang

It was hard to imagine in the past of ultra-mobile devices. But as panels, storage devices, batteries, chassis, and cooling modules have become lighter and thinner along with their appearances and contour becoming more refined, we are looking forward to a future where various kinds of mobile devices can be presented to the market.From bulky computer to mobile cloud computingSpeaking at the recent DTF 2012 Ultra Mobile & Ecosystem Forum, Asustek deputy general manager, Shubin Hu, started his presentation by showing an oxcart pulling the first computer ever in Taiwan in 1957. The computer had a memory capacity of 2KB. Hu said any of the present smartphones or mobile devices is much superior to that in terms of efficiency or memory.In the 1980s, PCs worked independently, whether it was word processing or engineering computing, and file transferring had to be done through floppy disks, a modem, or a LAN that connected them. In the 90s, PCs were able to get on the Internet when Web 1.0 first came out, which set off an era of one-way information collecting.The Web 2.0 era came around 2004-2005. The appearance of YouTube and Facebook allowed people to share pictures, video and other information in multiple interactions with their peers on the Internet. After Web 3.0 came in 2006, there has been more of an emphasis on more diversified mobile devices with notebooks, tablets, smartphones, e-book readers and TVs able to connect to cloud computing servers.Thinner and lighter mobile devices are accelerating IT development cyclesAccording to Gartner statistics, desktop computers will increase to 156 million units by 2016 from 144 million in 2010 while notebooks will increase to 423 million units from 204 million during the same time, creating a 13% compound annual growth rate. Tablets meanwhile will increase to 369 million units by 2016 up from 17 million in 2010, for a compound annual growth rate of 66%.Overall desktop computer shipments have remained stable at yearly sales of around 150 million units, while notebook shipments began surpassing desktops in 2009, and tablet sales will surpass notebooks from 2013 onward, indicating a continued trend with mobile computing.Since mobile devices are becoming thinner and more diversified, IT products are being replaced faster and faster. It took 26 years from 1975 to 2000 to reach the 100 million shipment mark for desktop computers while it took 23 years from 1985-2007 for notebooks to do the same.More so, it took feature phones 15 years from 1983 to 1997 to reach the 100 million shipment mark and the same was for PDAs from 1993 to 2007. But it will only take three years from 2010 to 2013 for tablets to reach that mark.In the past PC meant "personal computer," but now it means "personalized computing" for each individual person. In today's SoLoMo (social/ location/ mobile) era, people use location signaling such as GPS, digital compasses and Google Maps along with social networking sites such as Facebook, YouTube, Twitter, Google+ along with many others. Moreover, system platforms have gone from Wintel's PCs to using ARM and x86 SoC designed dual-core or quad-core smartphones and tablets.There is cloud computing everywhere in the world and people are accustomed now to being "always on and always connected." Ultrabooks/notebooks, Eee PCs/netbooks, tablets, smartphones and a variety of mobile devices are connected to cloud computing services via different transmission technologies, from the earliest Wi-Fi, to 3G and to LTE. Now there must be an even faster wireless network to accommodate the growingly diversified content.In an era where people are constantly mixing work and life and are even checking their email via a smartphone, tablet or notebook while on vacation, everyone needs an ultra-mobile device in order to keep up with their work and leisurely lives.Reacting to ultra-mobile trends: Asus' design and product solutionsAt last year's Computex, Asus and Intel released the Asus Zenbook, which had an 11.6-inch screen, was 7mm thick, weighed 1.1kg and had an Instant On time of two seconds. In December of 2011 the EeePad Transformer Prime tablet was released, which was 8.3mm thick and weighed 586g. Also, after adding a keyboard and battery it is able to become a notebook. At CES 2012, Asus also released a PadFone that combines cell phone, tablet and notebook functions all into one.PCB and IC packaging has gradually gotten smaller from DIP in 1985 to QPF in 1995 followed by BGA in 2000. It then went to CSP by 2005 and then to SIP in 2009. PCB has gone from the traditional 2- and 4-layer structure towards HDI as well. Asus's Transformer Prime and UX21 use SIP and HDI design, which is as small as the area of only two name cards. Improvements in computing performance have followed the development of semiconductor processes, which are increasing mobile devices cloud computing capabilities.The progression of key components and materials technology: Reshaping the new style of ultra-mobile devicesIn the past the development of systems went from CPU, Northbridge and Southbridge chips; then there was an additional GPU chip or graphics card, followed by Northridge chips, GPU and CPU chips bound together. At present a CPU's entire Northridge chip and GPU function only need two chips within its system. In the future when we enter the SoC era, the entire system will only need one chip. In addition, there have been chip packaging improvements with MCPs and POPs, LCD thickness has gone from 13mm in CCFL backlighting to 7mm in LEDs, and since 2011 when the Ultrabook used LED with open cell assembly the thickness has dropped to 5.5mm.Storage devices on the other hand have gone from 3.5-inch hard drives in 1983 to 2.5-inch (7mm) ones in 2009 and then to 3.8mm-thick SSDs in 2011. Batteries have also gone from traditional 18650 lithium batteries that are 18mm in diameter and 65mm long to lithium polymer ones. Chassis materials have also transformed from traditional plastic, to metal and CNC metal, as well as fiberglass. CPU cooling modules have gone from a thickness of 10mm to 5.5mm for use in the Ultrabook and the connectors have been changed into FPC to reduce thickness. Through changes in these modules and components, ultra-mobile devices are able to become even lighter and thinner while not sacrificing efficiency.Looking at the digital convergence trend and providing user-friendly products and serviceUsing the Eee Pad Transformer Prime as an example, it has a thickness of 8.3mm, weighs 586 grams, and has warm vocal and balance tone sound experience, providing 600nits of luminance and a wide viewing angle. It also has a built-in eight mega-pixel camera with a F.24 lens and LED flash, providing continuous AF shooting, full HD recording and nighttime recording mode. Stand-by time is 50 days.Semiconductor processes are evolving, display panels are becoming thinner and bendable with high resolution, batteries are getting denser along with the growing adoption of solar cells; and chassis are becoming slimmer and more robust. The evolution of these components will further change the size and look of digital devices.After desktops, notebooks, PDAs, smartphones, padphones, netbooks, tablets and the Ultrabook, the future will see "touch on clamshells." So what is the nest wave of mobile devices? Hu said within the current wave of digital convergence of PC/notebooks, tablets and smartphones, Asus will provide consumers with user-friendly products and services.Asustek Computer deputy general manager, Shubin Hu

In response to enthusiasm for lighter and thinner ultra-mobile devices (UMDs) like smartphones, tablet PCs and ultrabooks, memories inside these devices (DRAM, flash) have also evolved in terms of speed, interface standards and forms of packaging toward a future convergence of system software and data storage applications.Speaking at the recent DTF 2012 Ultra Mobile & Ecosystem Forum, Kingston's director of product marketing Allen Yu said UMDs, be it smartphone, tablet or ultrabook, feature slim exterior/light weight, the "always on, always connect" function, long-life batteries and multitasking. All of these characteristics require high-performance, low-power, multi chip package (MCP) and cost-efficient memories.Current trends in UMD memory marketYu pointed out that most smartphones, tablets and ultrabooks adopt eMMC, eMMC/SSD and SSD/HDD for data storage, while LPDDR, LPDDR/DRAM, DRAM are used for DRAM. For hardware and platforms, most smartphones adopt ARM plus Android or the upcoming Windows on ARM (WOA), and tablets can choose among ARM plus Android, Wintel and WOA.As for the development of memory/storage technology, the 200MB/s eMMC 4.5 will be upgraded to eMMC4.51 (still 200MB/s) with enhanced information security capability for future serialization of UFS 3Gbps (upgraded to 300MB/s). Mobile DRAM will move from 3.2 GS/s of LPDDR2 to 6.4 GS/s of LPDDR3 before ushering in 6.4GB/s from the Wide I/O interface. SSD will advance from existing SATA2 3Gbps and SATA3 6Gbps to multi lane PCIe interface design.In terms of UMDs' storage capacity, the average capacity of NAND flash in smartphones will increase all the way from 5.5GB, 7.6GB, 10.8GB, 14.9GB, 19.7GB to 25.1GB while the worldwide number of smartphones is expected to grow from 300 million to 1.2 billion from 2010-2015. The average capacity of NAND flash in tablets will rise gradually from 30.1GB, 37.6GB, 56.8GB, 76GB to 96.1GB as the worldwide shipments of tablets are seen rising from 20 million units in 2010 to 240 million in 2015. By 2012, 450 million UMDs (including smartphones and tablets) around the world will use eMMC.eMMC specs and technology evolutionYu started with an introduction to eMMC (embedded MultiMediaCard), a low-cost set of data storage media specifications launched by JEDEC, which is also devoted to DRAM and NAND flash specs. By adopting multi chip FBGA package for NAND flash and MMC controller chips, eMMC can achieve the light and thin exterior required for UMDs. As its electric specs place greater emphasis on energy saving, information security and random access speed as compared to MMC/SD cards, eMMC is suitable for applications such as smartphones, tablets, digital still cameras, MP3 players, GPS, e-books, e-toys and game consoles.Yu pointed out that in addition to light weight and thinness, cost competitiveness is the biggest consideration for wide application of NAND flash in consumer electronics products. The evolution of semiconductor manufacturing processes reduces the unit cost year by year. A new process appears nearly every year: last year's mainstream 3xnm process for NAND flash is migrating to 2xnm and even 1xnm in an evolution even faster than Moore's law. Moreover, the introduction of multi-level cell (MLC) technology is leading the cost down further. 2-bit-per cell is the mainstream now, while the even cheaper 3-bit-per-cell is already used in some applications.Secondly, specs of each generation of NAND flash are constantly changing. The new generation of NAND flash has a higher bit error rate, larger page and block, different AC clock signals, and more new commands. Managing these new specs requires new CPUs, as conventional host CPUs cannot update each year f due to cost efficiency problems. Flash controllers are therefore used as a bridge between NAND flash and host CPUs. However, conventional host CPUs are still responsible for flash translation layer (FTL), drivers and ECC recovery despite already having flash controllers to communicate with NAND flash. By packaging MMC controllers and NAND flash into one single chip, eMMC can deal with FTL, driver and ECC by itself so that conventional host CPUs can process data directly through MMC bus and save much effort for CPUs.Yu also mentioned that there are two types of eMMC packages defined by JEDEC, 169 ball and 153ball FBGA, and the size comes in 11.5 x 13 x 1.3 (153ball), 12 x16 x 1.4 (169ball), 12 x 18 x 1.4 (169ball) and 14 x 18 x 1.4 (169ball), with all signal pins being compatible with each other. eMMC has been capable of boot operation since v4.4, saving SRAM and NOR flash components from smartphones.The sleep mode offers a switch between standby and sleep modes to save energy. With the reliable write feature, data can be secured even during power outage. Replay protection memory block (RPMB) offers code protection that requires passwords and keys for access. The multiple partitions function can help switch between different OS boots for different partitions and designate a specific partition for RPMB protection.Background operations and high priority interrupt (HPI), the eMMC features that started with v4.41, help eMMC execute commands with greatest priority in order to solve NAND flash's problems for simultaneous read/write. The feature is specifically designed for smartphones.eMMC v4.5 also feature new functions like HS200, discard, sanitize, packed commands, context IDs, power off notification, data tag and RTC. HS200 retains compatibility with eMMC's transmission speed of 26/52/104MB/s, with an additional 200MHz operating clock.As for other additional commands, discard can help the host define invalid blocks of memory; sanitize commands can completely erase the physical blocks where the data is stored in order to avoid information outflow even after deleting personal data; packed commands can categorize to-be-executed commands according to their operating characteristics, and put them into packets for efficient batch execution in a bid to enhance overall operating efficiency of the system; data tag can tag storage data according to access and hit frequency and enhance the system's process efficiency; with power off notification, the host controller will inform the eMMC controller chip when devices are about to suffer a power outage, so that the controller chip can respond in advance before the outage.UFS: A technology integrating eMMC and SSDYu pointed out that universal flash storage (UFS) has integrated eMMC's safe, low-power, and small-size packaging applications with SSD serialization high-speed interface, SCSI command format and high-performance applications. There will be UFS card products in UFS specs or eUFS memory chips that are suitable for embedded applications.In terms of UFS frameworks, the M-PHY physical layer of Mobile Industry Processor Interface (MIPI) followed by vendors ranging from cell phone makers to supply chain suppliers has achieve backward integration with UniPro interface (CSI-3, DSI-2, UFS) as well as support and processing capability for SCSI command set that is currently available for SATA SSD only. UFS integrates all benefits of SSD and eMMC, and its specs are especially developed for high-performance UMDs. Now UFS 1.1 specs can achieve 3Gbps transmission speed, and the upcoming UFS 2.0 will go further to reach 6Gbps.As UFS is totally different from and incompatible with existing eMMC interfaces, related supply chains are still incomplete despite UFS 1.0 was released way back in 2011. Yu forecast that eMMC will remain mainstream in the market by 2013, while UFS in engineering samples/prototypes is expected to appear by the end of 2013 before appearing in small amount in the market by 2014. As UFS is targeting the high-end market due to the cost factor, UFS and eMMC will co-exist in the market for a while.Concluding with Kingston's roadmap for UMD memories, Yu said his company is scheduled to launch a series of comprehensive memory solutions for smartphones and tablets in 2012. For high-end smartphones and tablets, eMMC v4.5 products will be released in 2012 in capacity ranging from 4GB to 64GB before upgrading to eMMC v4.51 with 4-128GB capacity in 2013. UFS 1.1 or 2.0 products will be officially launched in 2014 with capacity ranging from 64 GB to 256 GB.As for mid-end smartphones and tablets, since mid-end smartphones' CPUs are not suitable for package on package (PoP) and using independent eMMC chips and LPDDR chips will take up too much space, Kingston will use the MCP packaging method and provide in 2012 or 2013 chips (eMMC 4.5 + LPDDR2 MCP) where eMMC v4.5 and low-power DDR2 are packaged together. The product line, specifically designed for Android 4.0 mid-end smartphones, can simultaneously achieve cost efficiency and performance. In response to China's demand of nearly 120 million low-end, entry-level smartphones in 2012, Kingston is offering NAND+LP DDR MCP products that package NAND flash chips with low-energy DDR from 2012 to 2013. The products have been validated by major smartphone chip vendors and already start shipping in May.Kingston director of product marketing, Allen Yu Ph.D

Since 2011 Intel has been aggressively promoting ultrabooks with a new processor platform for rapid boot to log-on , in conjunction with smart connection, smart response, personal identity identification, and anti-theft technology. Ultrabook is also supported by a venture capital fund that invests in relevant component and part industries. The investment attempts to drive the whole laptop ecosystem and make devices even slimmer, lighter, and mobile.Ken Lau. managing director of advanced technical sales and service, Intel APAC, noted that there are more users, a wider variety of devices and network connections in today's cloud computing era to create higher data traffic as well as even more diverse online applications and experience options, during the recent DTF 2012 Ultra Mobile & Ecosystem Forum. For example, desktops, laptops, netbooks, personal devices, smart phones, smart TVs, in-vehicle infotainment (IVI), and embedded devices are able to easily access cloud services via Wi-Fi, 3G, Ethernet, and so forth.New experiences created by more cloud-based devices and applicationsAs for the industry vision for cloud applications, by 2015 a client aware cloud will access private clouds and public clouds via open networks to securely access information in private clouds. The automation associated with cloud computing will reduce administration costs; as a result, IT departments of various organizations will be able to focus on developing new applications and service innovations.At present, data traffic resulting from cloud access is very high. Two billion Internet users around the world send an average of 247 billion emails daily; approx. two billion videos on YouTube are viewed daily; and 2.5 billion photos are uploaded to Facebook or updated there daily. This will drive new behavior and new expectations among end users, whose expectations for digital devices are changing, too. People are willing to pay for the user experience that they need and want.Creation of relevance of ultrabook by renovating existing product functions and user experienceAccordingly, Intel has adjusted its user experience-related product planning. In the past, bottom-up planning started from CPUs and hardware to aggressively promote higher processing speed and add more computing power in order to strengthen the performance of middle ware, i.e., the OS and Apps. Such efforts created the user experience in the past. However, when CPU power consumption became too strong while clock speed enhancement reached a limit, Intel adopted top-down planning to first identify and create the best user experience targeting the largest user group, based on which middleware would be developed and then only one CPU or hardware product or a few of them would be created.According to Lau, Intel conducted a user survey when evaluating whether touch control should be added to ultrabooks. Some respondents like touch-control notebooks because touch control is fun, modern, and immediately responsive. Some are already used to a track pad on conventional notebooks but think touch screens are good, too, because they enable rapid real-time interaction. Some note that touch control helps decrease carpal tunnel syndrome. Some love touch control but are used to keyboard input for typing.Analyzing the opinions provided by users, Intel has categorized the market of consumer notebooks into five: Gaming, content creation, entertainment, on the go, and basic. Ultrabook first targets the on the go and entertainment categories and will then expand into the content creation and gaming categories.At Computex in June 2011, Intel introduced the concept of the ultrabook. In August, Intel conducted an Ultrabook symposium on a non-disclosure agreement basis for relevant partners; 120 companies and 1,000 engineers were present. A US$300 million Ultrabook fund established by Intel Capital has been actively investing in various new, strengthened user experiences, even lighter and slimmer components and parts, and innovative platform technologies to help enable an Ultrabook industry ecosystem.Intel specs for the ultrabookIntel has started with the chassis, display panels, storage, optical drivers, and batteries, seeking highly sturdy chassis while reducing production costs, adopting NAND flash and thin display panels with incorporated touch control, limiting hard disc thickness to 5 mm, and promoting battery interface standardization while using lithium polymer batteries.A conventional notebook is 1.26-inches thick from cover to bottom, but Intel limits the total thickness of a 13.3-inch ultrabook to 17.8mm, while the total thickness of any ultrabook with a screen larger than 14-inches is limited to 21mm. To do this, the thickness of a display panel needs to be decreased from 5mm to 3mm while the battery diameter needs to be decreased from 18mm to 16mm or rectangular batteries of 80mm x 60mm shall be used. Moreover, socket connections are all canceled inside th ultrabook, where all IC chips are directly soldered on board using surface mount technology (SMT).According to Lau, the ultrabook has been Intel's biggest platform change since the company launched Centrino in 2003, as the CPU, chipset, chassis, display panel, and storage have all been changed. According to Intel's three-year plan, since the launch of Sandy Bridge (2nd generation Core) Ultrabook in June 2011, Ivy Bridge (3rd generation Core) Ultrabook will enter the mainstream market in 2012, and the CPU codenamed Haswell that is expected to be launched in 2013 would transform the existing notebook market completely.Citing a Digitimes from April 2012 and many others, Lau noted that increasing ultrabook shipments would help boost the gross margin at notebook OEMs. According to Lau, ZDNet considers 2012 the first year of the era of the ultrabook. Wired pointed out that 2012 would witness the fruition of the ultrabook while eWeek mentioned that ultrabook-based tablets would be shown at CES 2012 at the latest. At present, ultrabook models including the Acer Aspire S3, Asus ZenBook UX21/UX31, Dell XPS 13, Hewlitt Packard (HP) Folio 13 and Envy Spectre, Lenovo IdealPad U300S/U300e, LG Super Ultrabook Z330/Z430, Samsung Series 5 Ultra13 and 14, as well as Toshiba Portege Z830/Z835 and Satellite U840. In 2012, as many as 75 ultrabook models based on the Ivy Bridge (3rd generation Core) are being designed.Demo of ultrabook notebooks as well as applicationsUltrabook features Intel Rapid Start Technology, Intel Identity Protection Technology, and Intel Anti-Theft Technology. At the ultrabook notebook demo that ensued, an ultrabook that had been switched off took less than seven seconds to resume to log on mode, whereas the ultrabook models of other OEMs/ODMs are even faster.The next demo of Intel Identity Protection Technology (iPT) showed that iPT would activate a one-time password (OTP) on online transaction platforms such as PayPal in addition to the required account and password input. iPT randomly produces a six-digit password at an interval of 30 seconds as the secondary defense for online transactions, as inputting the newest OTP is required for transactions.In the US, a notebook is lost every one minute, and 20% of such incidents happen at airports, coffee shops, or on mass transport systems. During the Anti-Theft Technology demo that followed. Intel's Anti-Theft Service website was introduced. Registration with the website will lock lost or stolen laptops by using another computer or cell phone to access the website. Locked notebooks -- upon logging on -- will show a message of being locked as well as the contact information of their owners. Locked ultrabook laptops are completely inoperative except for displaying the message, and their hard discs cannot be duplicated even if they are removed. This safeguards ultrabook users' privacy.Lau concluded that the R&D at Intel now focuses on cloud-based user-end devices in order to provide unique user experiences as Intel is committed to ongoing support for an ultrabook and a successful ultrabook industry.Intel APAC, managing director of advanced technical sales and service, Ken Lau

Mobile devices are increasingly compact but the quality of their audio output is therefore affected. DTS, which is renowned for HD multi-channel audio technologies, now offers complete surround sound and decoding solutions to smart phones, tablets, ultrabook, and other ultra mobile devices based on their costs and market positioning, enabling mobile devices to produce superb audio quality.Speaking at the recent DTF 2012 Ultra Mobile & Ecosystem Forum, Mary Crebassa, vice president, strategic partnerships, DTS, first played a film "Sound Changes The Way We See" to illustrate how important sound is in the overall entertainment experience while introducing DTS as an audio technology leader.DTS' reputation: Rich details of HD audioAccording to Crebassa, DTS was founded in 1993, when Steven Spielberg was directing his masterpiece Jurassic Park. Spielberg wanted to present the delicacy of rippling and resorted to DTS, which provided the rich details of sound to crystallize Spielberg's imagination.Headquartered in Calabasas, California, DTS listed on NASDAQ in 2003. DTS is an industry standard format for digitized audio effects of DVD, DVB, DLNA, IPF (IP TV Forum), etc. and is indispensable for Blu-ray discs.According to Nielsen's 2011 annual survey, the global market share of Hollywood films featuring DTS HD audio encoding technologies was as high as 86%.High quality sound effect and feeling provided by DTS to ultra mobile devicesGiven the convenience of the Internet and popularity of ultra mobile devices, Crebassa noted that increasingly compact mobile devices restrain the space for audio circuit and component design. In particular, because of cost considerations, audio quality of mobile devices can hardly satisfy consumers if such devices are not supported by high quality audio solutions.According to the findings from a mobile media and access platform survey conducted by Parks & Associates in the third quarter of 2010, as high as 59% of mobile devise users hoped to have surround sound, 22% considered stereo quality an essential requirement, and only 18% did not consider sound effects relevant. Therefore, DTS tailors solutions to help smart phones, tablets, ultrabook, and other ultra mobile devices maximize their hardware effectiveness and improve their sound performance.Crebassa further stressed that the value of DTS lies in the onset of development, i.e., a comprehensive service that includes not only design recommendations from the perspective of audio to provide implementation and fine-tuning but also marketing and sales support. The complete solutions provided by DTS not only resolve many complaints about the sound effect quality of mobile devices but also cope with the difficulties facing OEM partners in high quality digital audio circuit development. As a result, OEM partners can rapidly respond to various emerging digital video protocols and provide the best sound experience with Codec Decoder along with post processing technologies.Crebassa also analyzed the behavior pattern of mobile device users, who listen with headsets, speakers, and docking stations; converse with microphones; receive the sound of music, movies, streamed multimedia contents, games, system sound effects, and ring tones; communicate on social media; and talk in real time on IM Chat and using pure voice software.According to Crebassa, users tend to complain about sound quality, such as the lack of bass, insufficient loudness, spatial degradation, poor quality of sound, treble aliasing, unclear conversations, and sharply increasing or decreasing loudness from different sources of sound. These issues can all be resolved by DTS Mobile Solutions for Post Processing that utilizes natural sound technologies such as a personalized equalizer to enable bass, audio frequency, and sound wave movement recovery. Loudness will be maximized while spatial degradation, contents, and loudness will be made consistent.Regarding the background echo and noise as well as inaccurate identification of voice commands associated with microphone input, DTS provides its Mobile Solutions for Pre Processing for noise suppression, echo elimination, improvement of the accuracy of voice command identification.DTS solutions to entry- and medium-level as well as high-end mobile devicesImmediately after Crebassa, Vincent Ting, director, account management, DTS, elaborated on DTS solutions to ultra mobile devices. DTS is not only a standard setter and does not only enjoy a reputation of high quality guarantee but also guided by the principle of resurrecting the original sound of high quality. DTS Ultra Mobile and DTS Premium Audio are mobile solutions for post processing specially provided to OEM partners to enable intelligent, easy-to-tune sound output of high quality.DTS Premium Audio, which will be launched in Fall 2012, targets high-end multimedia mobile devices, supporting multi-channel surround sound output, dynamic range recovery, augmentation and balance of loudness, and spectrum control. Moreover, DTS Premium Audio is capable of scenario optimization, loudness augmentation, surround sound simulation, as well as volume balance and bandwidth expansion. DTS Ultra Mobile, which is available in the market now, focuses on medium- and entry-level users who only use headsets and speakers, providing surround sound simulation to headsets as well as increased loudness to speakers.DTS also provides its DTS HD solution factoring in HD audio and video decoding that mobile devices need. The solution includes Ultraviolet, a digital rights authentication system, to decode and play multi-channel audio sources of HD films with Android Ultraviolet Player on the Android platform. The solution provides extra support to digital media libraries such as Deluxe Digital Media Library, DivX Plus Streaming, and Adobe Creative Suite 6, too.DTS HD is able to convert 5.1 channel or 7.1 channel to 2-channel stereo for output, and decode multi-channel film, music, or game content to provide genuine multi-channel surround sound that delivers a strong impact to mobile device users. DTS HD codecs implement coding and decoding at 1.5Mbps, and they are fully compatible with any TV and video recorder available in the market.In terms of the division of audio source products for mobile devices, it is DTS' recommendation that the system design of tablets and high-end video phones should adopt the combination of DTS HD and DTS Premium Audio; multimedia phones should adopt DTS Premium Audio; and entry- and medium-level phones should adopt DTS Ultra Mobile.Audio technologies that transform mobile devices into entertainment on the goTing further introduced the technologies as provided by DTS Premium Audio and DTS Ultra Mobile that enhance the quality of audio sources and reduce noise. DTS Ultra Mobile features the technologies of Envelo and Boost, while DTS Premium Audio has four technologies -- Enhance, Symmetry, Envelo, and Boost -- all in one.DTS solutions target mobile devices with limited space, in particular, the background noise resulting from heat ventilation that inevitably incurs crosstalk interference with microphones, and high-pitched, unnatural signals. When these issues happen, DTS implements decoding at 1.5Mbps and provides analogue signals that meet the DTS 2.0 stereo specification along with digital 5.1 channel output. As a result, when stereo headsets and speakers are connected only, stereo can be used to simulate multi-channel output. When the 1.5Mbps digital signal output port is connected, the genuine 5.1 channel digital output will resume.DTS Boost processes the sound signals that do not have a sufficient range of vibration, and the technology is able to increase loudness by at least 12 decibels. DTS Symmetry balances the volume of sound as defined by users, utilizing audio psychology to appropriately increase or decrease loudness to resolve the annoyance of sharply increasing or decreasing loudness resulting from different ranges of vibration associated with different sound sources.DTS 3D is a real-time 3D recording tool for game and movie dubbing. DTS Clear Voice suppresses audio feedback from local loudspeakers and rejects contribution from undesired ambient noises, enabling dual-microphone speech dereverberation and spatial sensing. Targeting different platforms, DTS supports API function links such as OpenAL and OpenSL ES, and DTS also supports Hardware Abstraction Layer (HAL) development to provide different product design options to customers.In sum, in terms of audio sources, the encoding structure of DTS is similar to concentric circles, in which 5.1 channel data compression is the core while 6.1 channel and 7.1 channel are outer circles. Therefore, all the DTS decoders available in the market completely support 5.1 channel output. Newer DTS decoders are capable of downward compatibility to decode any DTS sound source and deliver the best audio quality. For mobile devices, DTS enables surround sound simulation to provide a multi-channel effect of a spacious sound field. DTS post processing technologies improve audio playback when there are hardware restraints, resolving all the audio-related issues. DTS, which provides complete real-time local services, is a reliable audio technology partners to manufacturers for manufacturers to effectively enhance the added value of their products.Mary Crebassa, vice president, strategic partnerships, DTS

Vendors have been devoted to providing high-performance power chips and corresponding solutions in a bid to help the industry create small-sized power supplies for ultra mobile devices (UMDs), enhance conversion efficiency and reduce standby power consumption. This will save considerable amount of energy for over 100 million consumer electronics devices, mobile devices and home appliances around the world.During the recent DTF 2012 Ultra Mobile & Ecosystem Forum, Vincent Chang, NXP senior regional product marketing manager power solutions ICs - BL power & lighting/BU HPMS, introduced latest international regulations on ultra-low standby power chargers and adapters as well as NXP's latest power IC solutions, hoping to help the industry conquer the challenges of design in the era of UMDs.NXP, the spin-off of Philips Semiconductors in 2008, offers high-performance mixed signal and standard products such as transistors and solutions for logic devices.Brief introduction on NXP power IC solutionsThe standby power consumption of NXP's power IC is ultra-low at milli-W levels and in compliance with strict requirements of Energy Star or EUP Lot 6. Chang continued by sharing information about power consumption of home appliances, PC peripherals, mobile devices and the emerging-saving market, before lecturing on ultra-low standby power solutions' indispensability and regulatory challenges. In the last part of the speech he introduced charger and adapter power solutions NXP launched for reducing standby power consumption and boosting power, and shared some case studies on product designs.Trends of low standby power consumption design for power controllersMost power supplies now are based on the second generation low power platform (with low standby power consumption and high efficiency), with a size as small as possible for better portability. USB chargers are noiseless and easy to use. Currently, USB 3.0 chargers provide for up to 0.9A (about 4-5W), while next generation USB chargers can deliver up to 9-10W. Statistics from Energy Star show that 29% of global energy consumption goes to heating, with 17% for cooling, 13% for home appliances, 12% for lightening and the remaining 11% for usage in external power supply, telecom equipment, STB, home video/audio recreation, etc. Home appliances and 3C/PC/NB products, amounting to 25% of all energy consumption, can help reduce power consumption by using power chips designed for lower power consumption and higher efficiency.Gartner forecasts that annual desktop PC shipment around the world will stay above 150 million units by 2017, but annual notebook shipment (ultrabooks included) will reach 400-450 million units. Tablet PC shipments are expected to surpass the 300 million units mark by 2015. Smartphones will enjoy significant growth, with annual shipment hitting around 500 million units in 2012 before increasing three-fold to 1.5 billion in 2015. These all represent great opportunities for charger and power supply makers.Chang demonstrated a 90W ultra-thin power adapter developed by his client, a device in an LC framework as small as a business card case. He emphasized that NXP chips can help adapter vendors break through barriers on standby power consumption and create LC-framework products with a low 0.2W power consumption. Meanwhile, NXP also offers 40-50W adapter solutions for ultrabooks, and even smaller versions of 5-10W.As for regulations on lower standby power consumption, LG, Motorola, Nokia, Samsung and Sony Ericsson in 2007 agreed on a five-star rating scheme regulating standby power consumption: zero star for consumption greater than 0.5W, one star for 0.35-0.5W, two stars for 0.25-0.35W, three stars for 0.15-0.25W, four starts for 0.03-0.15W and five stars for consumption lower than 0.03W. Energy Star requires that power supplies below 50W must consume less than 0.5W for AC-AC and 0.3W for AC-DC. Adapters in 50-250W, AC-AC or AC-DC, have to consume less than 0.5W.Starting January 7, 2009, EUP Lot 6 demands that all home alliances, PCs, consumer electronics products and even toys have to consume energy of less than 1W under standby, sleep or off modes, or 2W if including status display. Products sold after January 7, 2013 cannot consume more than 0.5W under off and standby modes, or 1W if including status display.In compliance with EUP Lot 6, NB adapters and LCD TV power supplies have to respectively meet the 0.5W and 0.25W maximum energy consumption under standby and off modes. As NBs from some major brands would need 0.5W just for chipsets alone, many solutions still fail to meet the requirements. China requires an even lower maximum of 0.5W/0.2W, and Japan is also stricter with a 0.5W/0.15W limit.Desktop PCs are under standby mode for an average of 36% of time, while NBs are on stand by 34% of time and the figure is even higher at 43% for computer monitors or TV. With 200 million notebooks and 2 billion smartphones around the world, a 50% cut in standby power consumption might save NT$20-30 billion on electricity bills each year.Case studies on design of lower standby power consumption applicationsUsing a conversion efficiency chart of switching power supply, Chang pointed out that energy losses consist of switching losses, magnetic losses and conduction losses. Conduction losses would be constant when the system is in full load,while switching losses are constant in no-load status. Synchronous rectification is adopted to reduce conduction losses at heavy load, using TEA1791/1761 as a flyback switching power supply or replacing Shottky-barrier diodes with TEA1791A/1795 linear rectification. The MOS process can also be adopted to reduce on-resistance. Higher conversion efficiency at a lower load can be achieved with the burst mode, soft switching, quasi-resonant (QR) or switching frequency.For Flyback QR to deliver high performance at a heavy load, multi-mode operation can be adopted to reduce power chip frequency at a heavy load, while QR can minimize switching losses and reduce electromagnetic interference (EMI). For flyback QR to deliver high performance at lower load, the PFC converter should be shut down under the low-load mode to reduce energy losses. TEA175X power chips will allow feedback circuits to adopt the more sensitive sense resistor IC.Next Chang showed the audience a switching power line chart with load demand as one variable, adding the power chip's power consumption into the calculation. With power chips developed by avoiding the frequency range between 22KHz and 28KHz, the burst mode, which often requires high power in dozens of milliseconds, can reduce switching losses and raise efficiency under difference load status. For example, TEA1733/1738 can reduce switching losses by lowering switching frequency, while current output is cut by 25% as compared to peak current.For low-load application environment with output power lower than 65W, active x-cap discharge circuit and high-ohm sensor patterns can be added to replace low-power TL431 IC and achieve better precision. Moreover, TEA1733 IC only consumes 0.01W at no-load mode due to extremely low operating current for IC at 0.03W. For chargers and adapters with power output lower than 20W, the TEA172X series is recommended for burst mode with switching frequency between 400Hz and 1850Hz. Standby power consumption will be reduced and the operating current is only one fourth of peak volume. The frequency should be fixed between 22.5Khz and 51.5Khz under normal operation mode.TEA1731, which is in TSOP6 package with an average 90.55-90.9% conversion efficiency, can be applied 19.5V, 40W adapters. Components made with SOI process are recommended if further reduction of ICs power consumption is desired, as leakage will be significantly lowered with each transistor being wrapped in dielectric. For example, TEA1738 is made with the SO8 process in the same 90.55-90.9% conversion efficiency needs a merely 10μA for start-up current and 5μA operating current, which is about one third or one fourth of those required by rival products.GreenChip SR TEA1792 chips can be used as power supply for notebook adapters, chargers and LCD TV. Adoption of SO8 process, 8.5-38V ultra high working voltage and 10V high voltage output will also further raise the conversion efficiency. For EUP Lot 6-compliant power supply with over 100W output power, TEA1713 plus TEA1716 are recommended to meet the 0.25W standby power consumption requirement.The TEA172x family of power chips- from 5W TEA1721(TEA1721AT/BT/DT/FT), 8W TEA1722 to 11W TEA1723 (TEA1723AT/BT/DT/FT)- is recommend for low standby power consumption solutions on USB chargers, smartphones, tablets or even home appliances. Such solutions offer support to high c/p value design and require less than 30 components on the bill of material (BoM). Standby power consumption is below 5mW under 115V power supply, and the conversion efficiency will also be higher than EPA 2.0 requirements (an average 75-78% .in 5W). For example, a 5W (5V/1A) small-sized UBS cell phone charger based on 5W TEA1721 is only 40mm in length, 28mm in width and 14mm in height.NXP Sr. regional product marketing manager power solutions ICs - BL power & lighting/BU HPMS, Vincent Chang

High-strength mechanical parts are necessary to manufacture light and thin chassis for ultrabooks. In addition to expensive aluminum magnesium alloy, mechanical part makers can also achieve metal-like characteristics of ultra-thinness, high strength and sleekness by using plastic plus 25-50% glass fiber when making high-strength chassis. The method will also significantly reduce the cost of ultrabook's mechanical parts.Speaking at the recent DTF 2012 Ultra Mobile & Ecosystem Forum, MiTAC Precision Technology (Kunshan) president John Lin started with an introduction to the background of Getac Technology Corporation and MPT. Founded in 1989, Getac is an entity that is listed on Taiwan's Gre Tai Securities Market (TAIPEX: 3005) with a NT$5.8 billion capital. The company reported NT$15.8 billion of revenue in 2011.Getac's main business encompasses ruggedized computer, composite mechanical component, plastic and metal component module, auto mechanical component and aerospace mechanical component. Getac is now the world's second largest ruggedized computer manufacturer and supplier. The company now owns 11 manufacturing bases: one in Shunde (located in Guangdong Province, China), three in Kunshan and one in Changshu (both cities are located in Jiangsu Province, China), two in Nanchang (in Jiangxi Province, China), two in Vietnam's Bac Ninh Industrial Zones, one in Shanghai, China and one in Taoyuan, Taiwan.MPT is a composite mechanical component subsidiary of Getac founded in Kunshan in 2003, with 4,500 employees and a R&D/engineering staff of 800 people. Major injection equipments at MPT factories include 330 injection molding machines and 297 RHCM controllers, delivering a monthly capacity of 8 million pieces. The company's tooling center can produce as many as 320 sets per month with a short lead time of 15 to 35 days. MPT also owns key technologies for HCM injection, high-temperature mold, gas-assisted injection molding, IMR, IML, double injection, sputtering lines and coating lines.Light and thin chassis: An inevitable trend amid the ultrabook boomLin said Apple's decision to cut the price of MacBook Air to around NT$30,000 shook up the market. People no longer find appealing the bulky notebook computers that are at least three to four centimeters thick. That's why Intel requires a thickness below 18 mm and less than 1.5 kilograms of weight for 13.3-inch ultrabooks. Intel hopes to achieve a 43% penetration for ultrabooks by 2014, and reduce the average selling price (ASP) to below US$600 in an effort to cater to enthusiasm for thinner and lighter devices with affordable prices.In addition to specs, cost is another key problem for higher penetration of ultrabooks. And among all cost-related problems, chassis and frames are the most crucial subject. Currently more than 90% of ultrabook chassis are metal, and one single chassis item in the CNC process would cost over US$100. As one CNC machine can produce eight pieces per day and three of the items will be used in CNC machines, existing CNC machines are not enough to achieve an annual mass production of 24 million ultrabooks, and the prices of ultrabooks will remain high. Under such circumstances, high glass fiber reinforced plastic chassis, which is also light, thin, stiff and affordable, has become an alternative for ultrabook chassis.Technology development of light, reinforced glass fiber ChassisLin mentioned that mid-end notebook computer makers used to adopt PC ABS because it is quite cheap, but the material fails to achieve ultra-thinness due to poor stiffness. Glass fiber is therefore added in order to improve plastic chassis' stiffness as more plastic fiber offers higher stiffness. However, mass production would become more difficult at the same time.Due to limitations in fluidity, PC ABS can only consist up to 30% of glass fiber. Manufacturers turned to nylon later, adding up to 50% glass fiber to meet the fire-proof and heat-proof requirements. Up to 75% glass fiber can be added if not considering the fire-proof requirement, so that the chassis can be thinner with strength and stiffness greater than existing metals.Other crucial technology barriers to mass production of glass fiber chassis include the problems of warp and floating fibers, simultaneous delivery of lightness, thinness and toughness, and stronger chassis structure in order to pass drop tests.Lin said plastic chassis makers using conventional injection molding technology would melt plastic material and then inject it into molds of 40-50�J temperature before unmolding after cooling down. It would warp the item if the material fails to cool down before reaching its crystallization temperature.MPT developed a Rapid Heat Cycle Molding (RHCM) technology for plastic since 2003, employing a rapid temperature-changing molding process. Temperature of the molds will first be raised to a certain high level, and then the plastic material with high percentage of glass fiber is injected into the molds. The item is finished when the mold is set to room temperature, and the chances for warp will be significantly reduced.Flatness and stiffness close to aluminum magnesium alloyConventional plastic manufacturing process is prone to floating fibers that often cause unevenness and obvious welding lines. Getac's glass fiber reinforced plastic chassis adopts the RHCM process technology to achieve a glossy surface. The surface, plated with a 50nm layer of resin without any floating fibers and welding lines, is sleek and meets the requirement for glossiness and seamlessness. In terms of the characteristics of stiffness, lightness and thinness for a 13.3-inch notebook chassis cover, the Al alloy-6063 process (unibody, CNC) adopted by MacBook Air has a 67 GPa bending modulus, with an actual weight of 227 grams and 0.7-1.2 mm minimum wall thickness, while the PC/ABS plastic chassis has a 2.5 GPa bending modulus with a 218 gram weight and wall thickness of 1.8 mm. MPT's PA+50% glass fiber chassis has a 17.5 GPa bending modulus, with a minimum wall thickness of 1.0-1.1 mm when the actual weight is 157 grams, which is pretty close to aluminum magnesium alloy in terms of stiffness and wall thickness.Lin added that surface treatment for chassis with 50% glass fiber, with an IMR or coating, can result in great product texture and pattern transfers, satisfying the need for stylishness and environmental protection at the same time. Requirements for cost efficiency, mass production and sufficient capacity will also be met. As a leader in RHCM technology process, MPT offers clients the shortest cycle time in the industry and reasonable prices with an economic and eco-friendly (heating by steam) process.Glass fiber material is cost-competitive as its price is only one third of that for metal. With experiences in plastic molding technology and excellent control of mold temperature precision, the company offers molds with lifespan close to those of regular molding molds, and chassis with 50% glass fiber can achieve a yield of over 90% due to great command of glass fiber's characteristics. With 330 injection molding machines and 297 RHCM controllers, monthly capacity can reach 8 million pieces.Lin concluded that a chassis with 50% glass fiber is ultra-sleek, seamless and free from floating fibers and welding lines, offering great stiffness for device protection. It is also 40% thinner than plastic chassis, not to mention other features such as metal-like lightness, diversified styles with post processing, eco-friendliness (paint-free, with great product texture and pattern transfers), low costs (one third the prices of metal), potential for mass production (with over 90% yield) and sufficient capacity. All the aforementioned characteristics demonstrate that molding with high percentage of glass fiber is the best chassis solution for ultrabooks.Technology skill to collaborate with notebook industry and facilitate mass productionWith strong engineering analysis capability and powerful databanks, MPT has accumulated 307 tooling patents and 59 patents related to HCM R&D (material, manufacturing process and equipment). The company has also accumulated over 625 development projects, developing more than 1,709 sets of molds and offering solutions to covers, LCD frames, computer keyboards and bases.Taking billiard balls and combs as examples, Lin said finally, earliest products made with ivory, ox horns, rhino horns and goat horns were only affordable for aristocrats. When the plastic industry emerged, billiard balls and combs made with petrochemical material began to deliver excellent quality and durability, with prices low enough to affordable levels. Chassis with a high percentage of fiber glass consumes lesser energy but its capacity is limitless, making the mass production of ultrabooks and higher penetration rates possible.MPT Precision Technology (Kunshan) Corp. President, John Lin, Ph. D

The new SABIC Academy in Riyadh utilizes CAYIN's digital signage solutions to convey timely information throughout 38 LCD screens in the main entrance, meeting rooms, auditorium, and conference halls. Multiple state-of-the-art technologies were introduced to the new Academy to accomplish this smart building.SABIC Academy is the new learning center of Saudi Basic Industries Corporation in Riyadh. The new academy has become the benchmark of education facilities in the Kingdom. CAYIN's digital signage solution is introduced in this project by SMARTECH AV, CAYIN's premium partners in Saudi Arabia, to replace old-fashioned bulletin boards and create a speedy digital information channel."This is the first learning center in Saudi Arabia to use this technology to manage all meeting rooms completely," said Mr. Yousef Abdul Hadi Projects Manager of SMARTECH AV Co. "We are honored to be selected as the main partner to supply all AV and Digital Signage with room schedule systems for the first smart learning academy in Saudi Arabia."The new Academy contains 30 meeting rooms and hosts a wide variety of learning programs, including workshops, summits and training classes every day. Instead of using bulletin boards, SABIC deploys 17" LCD screens (Flush Mount) in the wall outside 30 meeting rooms, along with CAYIN's digital signage solutions. The screen clearly indicates the meeting topic, start time, and duration of the meeting. Therefore, enrolled trainees can locate the correct class and meeting room easily.Each screen connects to one CAYIN SMP-WEB4 digital signage player and is managed centrally via CAYIN's meetingPost software. Equipped with a room booking system, meetingPost enables administrators to process online booking for meeting and banquet rooms.Therefore, SABIC Academy can edit a meeting list for each meeting room in advance. For impromptu meetings or room changes, the administrator can also input meeting information remotely in the office without running back and forth in the building to change the post.In addition to meeting rooms, SABIC Academy also installs three 51" LCD screens in the main entrance, two for the auditorium, and two for the multipurpose hall to increase the reach of the Academy's public announcements. With the help of CAYIN lobbyPost software, SABIC can select a template, enter data, and immediately show high quality video, tickers, web pages, pictures, weather information, and even live TV programs from the satellite.SABIC Academy is an important education facility for the nation to develop industry leaders in the petrochemical industry. World-class leaders and courses, accompanied by world-class learning facilities successfully enhance the level of education and training and add a new dimension to the advancement of the Kingdom.Please download the complete case study from CAYIN's website:http://www.cayintech.com/digital_signage_applications/sabic_academy.htmlAbout SABIC AcademySABIC Academy is the new learning center of Saudi Basic Industries Corporation in Riyadh. It provides solid training courses for both SABIC employees and leaders of various government sectors in the Kingdom. The academy is constructed on an area of 11,000 square meters and can accommodate around 450 people.About CAYIN TechnologyCAYIN Technology offers a complete portfolio of appliance-based digital signage solutions, including media players, servers, and software, for various commercial applications, such as education, transportation, retail, hospitality, corporate use, and financial and public institutions. CAYIN is dedicated to being a reliable partner to its clients worldwide, and has successfully set up various application references globally. In order to best facilitate the deployment of CAYIN products, the company also provides tailored services to satisfy the ascending market demand for almost limitless applications.Instead of using bulletin boards, SABIC deploys 17" LCD screens (Flush Mount) in the wall outside 30 meeting rooms, along with CAYIN's digital signage solutions.

Advantech and L.G. Sokolov Memorial Hospital 1122 are together setting the trend in advanced mobile medical solutions in Russia. Advantech offered a complete mobile medical solution for the hospital which has now become the benchmark for other Russian hospitals. The hospital's integrated computerized nursing cart combined with Advantech's AMIS-60 medical-grade computer,PDC-170 medical-grade display and the MICA-101 mobile clinical assistant, greatly improved the efficiency and effectiveness of the hospital's workflow.Wen-Ta Chiu, Minister for the Department of Health, Executive Yuan, Taiwan, visited L.G Sokolov Memorial Hospital and was highly impressed by the high-tech deployment in a medical institution on such scale. Bronislav Gorelik, President of MCS, Advantech's medical focus channel partner in Russia also mentioned that "In recent years, Advantech has devoted a great deal of research and collaboration efforts in the medical industry, especially in the mobile solution area, and it is very gratifying that the development of hospital services and medical equipment is inspired and driven by information technology."Advantech is a leader in the mobile medical solutions market, as well as having extensive experience in providing total solutions for a diverse array of medical applications to various hospitals worldwide that include: interactive information, self check-in, smart phone clinical status inquiry, intelligent medical carts, bedside infotainment, and patient dialysis information systems.Since L.G. Sokolov Memorial Hospital 1122 is the leading hospital in Russia with more than 400 physicians and 700 mid-level health care professionals, Advantech considers it a great privilege to be able to collaborate with it. And as part of its mission of "Enabling of an Intelligent Planet," Advantech is always putting its strength into improving lifestyles and building smart solutions.About AdvantechFounded in 1983, Advantech is a leader in providing trusted, innovative products, services, and solutions. Advantech offers comprehensive system integration, hardware, software, customer-centric design services, embedded systems, automation products, and global logistics support. We cooperate closely with our partners to help provide complete solutions for a wide array of applications across a diverse range of industries. Our mission is to enable an intelligent planet with Automation and Embedded Computing products and solutions that empower the development of smarter working and living. With Advantech, there is no limit to the applications and innovations our products make possible. (Corporate Website: www.advantech.com).About Advantech Mobile Medical Solutions- AMIS-60: A highly integrated computerized nursing cart with computer inside. This unit optimizes the patient care process as a mobile point-of-care station and is seamlessly integrated into a first-class medical nursing cart. There are no external cables to get in the way, and the I/O connectors are all recessed. Health care personnel will find AMiS-60 flexible for use in a variety of environments, simple and intuitive to use, and easy to keep clean. The integrated features of the cart with PC, allows users to easily upgrade computing performance while minimizing total cost of ownership.- PDC-170: The PDC-170-B series are quality medical image displays with high contrast LCD for clinical viewing. These series are designed with an IPX1 water resistant enclosure with an additional IP65 dust-tight front panel. The PDC-170-B series have a DVI –D for reduced signal distortion during transmission and are compatible to DICOM Part 14.- MICA-101: The newest MICA-101 has the same integrated features and ergonomic design as its predecessor, but the new release has been enhanced to provide better imagery, faster storage, and better power saving, making it even more robust. MICA-101 mobile clinical assistant is suitable for EMR, HER, and Nursing Information Systems (NIS). It is a fanless system that is lightweight, portable and quiet to use, and it streamlines workflow while increasing productivity.