SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this solution.The solution's adoption in the latest smartphones reinforces SK hynix's technological excellence in the global market. ZUFS 4.1 will enhance smartphones’ powerful on-device AI capabilities, offering users an innovative experience.SK hynix successfully completed the qualification process for the solution in June this year through close collaboration with customers. In July, the company began mass production and started supplying the product.ZUFS, or Zoned UFS, is an extended specification of UFS that applies Zoned Storage technology, which stores data in different zones based on its usage and characteristics.When installed in a smartphone, ZUFS 4.1 enhances the operation speed of the operating system (OS) and improves data management efficiency. As a result, it mitigates read performance degradation over extended use by more than four times compared to conventional UFS, enabling a 45% reduction in app launch times. Unlike conventional UFS, which writes new data by overwriting existing data, ZUFS 4.1 writes data sequentially. This data storage method has resulted in a 47% reduction in AI app launch times.These performance characteristics position ZUFS 4.1 as an optimal solution for today's mobile environment, where on-device AI and large-scale data processing are essential.In addition, SK hynix has significantly enhanced the error-handling capabilities of ZUFS 4.1 compared to version 4.0 developed in May 2024. By detecting errors with greater precision and clearly communicating the necessary corrective actions to the central processing unit, the latest solution is expected to significantly improve system reliability and recovery performance.“ZUFS 4.1, which we have successfully begun to supply, is the first solution developed and mass-produced through collaboration aimed at optimizing Android OS and storage devices. Looking ahead, its applications are expected to expand,” said Justin Kim, President & Head of AI Infra at SK hynix.“We will continue to supply NAND solutions that meet customer needs in a timely manner, while strengthening partnerships with global companies to strengthen our competitive edge in the AI memory sector.”Credit: SK Hynix

In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply committed to developing high-reliability packaging equipment for power devices and modules. Over the past five years, the company's formic acid vacuum reflow oven has gained widespread acclaim from leading international IDMs and the world's largest OSATs. Its remarkable advantages—including low void rates, flux-free soldering, and post-solder cleaning-free processes—effectively resolve metal oxidation issues, establishing 3S as a leading brand for high-end power module reflow packaging.From data to prediction: AI empowers equipment3S Silicon Tech's core technology utilizes AI to build process behavior models, enabling equipment to learn from data, predict, and self-optimize. Through machine learning (ML), the system analyzes vast amounts of data from sources like MES, sales, and SQL databases to identify key process variables.This allows the equipment to learn from past experience and provide precise parameter recommendations, leading to:1. Precise process tuning: The AI model recommends optimal parameters for different product types, ensuring perfect soldering every time. For example, baseline models for heating elements in various temperature zones are established before the equipment leaves the factory. By continuously monitoring the heating elements, the AI uses predictive analysis to issue early warnings before a malfunction occurs, ensuring process stability, preventing unexpected downtime, and even predicting the lifespan of the heating element.2. Yield and quality optimization: AI analysis quantifies the interactive relationships between different parameters and variables. Using a correlation matrix model, it provides optimal parameter recommendations for power modules, effectively boosting yield and product reliability.3. Precise predictive profiling: This technology effectively prevents up to 99.99% of equipment failures, optimizing production efficiency, reducing downtime, and significantly lowering maintenance costs.Green sustainability: Achieving flux-free solderingBeyond intelligence, this new launch also emphasizes sustainability. 3S Silicon Tech's AI-empowered formic acid vacuum reflow oven features a unique flux-free soldering capability. This not only enables a clean and highly reliable soldering process without the need for post-solder cleaning, but also reduces waste by up to 99%, providing a dual benefit of environmental protection and cost control for businesses.3S Silicon Tech sincerely invites you to SEMICON Taiwan 20253S Silicon Tech's AI-empowered formic acid reflow oven offers semiconductor manufacturers a highly efficient and easily implementable solution. This technology is specifically designed to address customers' void rate concerns, clearly demonstrating the immense application value of AI in semiconductor manufacturing. It further helps companies achieve a comprehensive upgrade in yield stability, predictive analysis, and maintenance optimization.3S Silicon Tech cordially invites all industry professionals and partners to visit our Booth Q5338 at Hall 2 of the Nangang Exhibition Center during SEMICON Taiwan from September 10-12, 2025. Come experience our cutting-edge AI and formic acid reflow oven technology and witness the journey toward smart, optimized manufacturing. For more information, please visit the 3S Silicon Tech Official Website.

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of nano-precision platforms and thermal stabilization in Semiconductor automation a strategic investment.PBA Systems will debut its latest nano-precision dual gantry platform series and metrology stage series designed for CoWoS and smart manufacturing requirements, to be showcased in the 2025 SEMICON Taiwan exhibition, located at Hall 2, 1st floor, Booth Q5536 in the Taipei Nangang Exhibition Center from Sep. 10th to Sep. 12th.For semiconductor advanced packaging technologyThe technology drivers of Heterogeneous Integration Architectures in Semiconductor advanced packaging involve different materials and bump density, and drive different process equipment requirements. From 2.5D to 3D development, semiconductor advanced Packaging may require different Die Attachment Processes, from high-speed, high-accuracy to thermal compressed and hybrid bonding. These processes require highly precise, custom-designed platforms for automation.PBA's latest dual gantry nano precision platform series offers high precision solutions for flip-chip bonding, thermo-compression bonding, and hybrid bonding. Its special dual-gantry architecture facilitates special simultaneous, multi-axis motion controls for high-speed die bonding and precision assembly applications, with less floor space requirements and high yield rates. PBA offers fast custom design services.Key advantages of PBA dual gantry series include:Nanometer-level assembly accuracy to boost high throughput and yield rates.Design with controllable suppression of thermal expansion minimizes yield loss.Scalability to support heterogeneous integration and next-generation chip architectures.Custom-designed High-speed, high-precision positioning to ensure both productivity and process stability.Flexible joint design, reduction of vibrations and resonance, improved accuracyPowered by PBA motors, an advancement from traditional ball-screw or belt motors, enjoyed low cogging force with anti-cogging features.In addition to offering fast custom design solutions, PBA also offers 250,000 square feet of contract manufacturing space for flexible manufacturing plans for worldwide system partners.PBA will also showcase its Z-Axis High-Precision Positioning Stage series at the upcoming SEMICON Taiwan show. This stage series offers ideal motion solutions for vertical movement in semiconductor automation with limited space and high-precision requirements, ideal for AOI inspection and PCB pick-and-place applications.Leader in nano-precision stage and gantry solutions for automationPBA Korea specializes in high-precision stage technologies. PBA Group further merged Korea SOONHAN Engineering, Korea's leading manufacturer of precision stage systems for 31 years, powering PBA Group to become one of the world's top precision stage experts that provide dynamic custom design and manufacturing services. PBA Systems is also a technology-capable partner of Mitsubishi Electric and Applied Materials. PBA group's contract OEM manufacturing experiences for many world-renowned semiconductor equipment partners in Asia also differentiate the group from regional local vendors.Meet the expert tech talkThe SEMICON Taiwan show will feature several advanced technical talk sessions in dedicated show floor booth sections. In the Smart Manufacturing Expo section, PBA will participate in the Expert Talk session on September 12, located at Talk Booth Q5356, 1F, Nan-Gang Exhibition Hall 2. PBA will be presenting the highly anticipated speech topic: PBA's Dual-Gantry Precision Platform Series for Semiconductor Advanced Packaging and Metrology Equipment. This is a rare opportunity for industry professionals to gain smart manufacturing insights directly from the expert—don't miss it.Global reach, local serviceHeadquartered in Singapore, PBA Group has R&D and sales offices in Singapore, Taiwan, South Korea, Japan, Malaysia, China, the United States, and Europe. The Taiwan branch offers a one-stop solution, providing everything from direct drive motors and modules to custom-integrated, high-precision platform systems. This ensures fast, flexible, and innovative smart manufacturing services for both local and international clients.For system partners with product customization or procurement inquiries, please contact.PBA released their latest Nano-Precision Dual Gantry Stage Platform Series for Heterogeneous Semiconductor Advanced Packaging and Metrology Equipment. To Be Debuted at the 2025 SEMICON Taiwan. PBA

Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing.Advanced Packaging 3D Metrology Solutions - Chroma 7980/7981The Chroma 7980/7981 systems feature Chroma's patented BLiSTM technology, purpose-built for nanoscale critical dimension measurement. These systems incorporate application-optimized algorithms and user interfaces to deliver high-speed surface profiling and fast auto-focusing capabilities, along with large-area image stitching. They address key needs in advanced packaging processes such as TSV/VIA, RDL, probe mark inspection, overlay, and sub-micron surface profiling. Additionally, Chroma's inspection and in-situ AOI solutions, like the Chroma 7961, enable real-time defect detection and inline process quality control.AI-Driven Test Platform - Chroma 3680When hardware innovation meets AI-enhanced software, a new era of automated test equipment emerges.The Chroma 3680 platform is purpose-built to meet the demands of modern semiconductor testing, combining high-efficiency algorithms with a modular architecture to redefine flexibility and efficiency in test systems.This platform features a unified and intelligent system architecture that enables real-time, accurate test program conversion—reducing migration time and manpower by over 80%. It addresses key pain points such as poor portability of legacy test programs and time-consuming debugging processes, supporting diverse chip architectures with a concrete and effective solution.Chroma 3680 supports modular expansion to meet increasingly diverse future requirements, and can be equipped with the HDRF2 module for one-click activation of RF testing, greatly simplifying test setup. The overall platform is designed for high scalability and flexibility, enabling fast adaptation across different product lines, application needs, and test scales—streamlining both development and validation processes.Tri-Temp System-Level Test SolutionsChroma's 3100 and 3200 pick-and-place handler solutions, paired with the 31000R/31000K Series Temperature Forcing Systems, deliver a powerful, fully integrated platform to meet the unprecedented challenges of AI-era device testing.The advanced 3110, 3200, 3200-HD, 3210, and 3260 pick-and-place systems feature industry-leading SLT testing solutions, including a high-precision contact force system, CVOT (Chroma Virtual Operation Tools) for intelligent yield optimization, integrated device protection features, and a universal change kit design for fast, flexible device conversion. These systems ensure superior test quality through scalable architecture that integrates seamlessly into both engineering and high-volume production environments.The intelligent 31000R thermal solution provides a wide and stable temperature control range from –40°C to 150°C, with high-power dissipation capability up to 2,900 W. It features advanced thermal performance with direct phase-change cooling, intelligent power monitoring, and high-precision multi-zone control. This makes it ideal for AI, HPC, and thermally demanding automotive applications.SuperSizer Nano-Particle Monitoring SystemsPowered by advanced aerosol particle measurement technology, the SuperSizer system delivers precise monitoring of nano-sized particles ranging from 3 nm to 20 nm, overcoming the limitations of conventional optical systems, especially bubble interference.The SuperSizer II, V, VI, and VII generations have been widely adopted for real-time monitoring of critical wet chemicals such as CMP slurry, isopropyl alcohol (IPA), hydrogen peroxide/pure water, and ammonia solutions. The latest addition to the series, SuperSizer VIII, is purpose-built for hydrochloric acid monitoring—extending the system's capabilities into more aggressive chemistries.By enabling in-line and real-time particle detection, the SuperSizer platform helps minimize wafer defects, ensure chemical purity, and improve overall process yield.Visit Chroma at SEMICON Taiwan 2025From September 10–12, Chroma ATE will exhibit at SEMICON Taiwan 2025 at the Taipei Nangang Exhibition Center, Hall 1, 1F (Booth K2876).In addition to showcasing our wide-ranging portfolio of test solutions, Chroma will present at the Semiconductor Advanced Inspection and Metrology Forum. Our presentation "White-Light Interferometry Integration with Electromagnetic Simulation and Digital Light-Field Control for Advanced Packaging" will explore innovative applications of advanced packaging inspection and metrology technologies.Join us at SEMICON Taiwan 2025 and connect with our team to exchange insights on the future of test and innovation.Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing. Chroma ATE Inc.

ADLINK Technology Inc., a global leader in edge computing solutions, introduces the cExpress-R8, a COM Express COM.0 R3.1 Type 6 Compact module powered by AMD Ryzen Embedded 8000 Series processors (8845HS, 8840U, 8645HS, 8640U). Engineered to satisfy the demands of modern smart industrial applications, it delivers an advanced integration of high-performance and energy-efficient design. This module ignites mission-critical AI capabilities, accelerated edge computing, and advanced graphics performance-bringing the confidence that comes with the reliability needed for complex, graphics-intensive workloads.COM Express R3.1 Type 6 Compact Size Module. ADLINKcExpress-R8-B. ADLINKPushing the limits of edge performance, ADLINK's cExpress-R8 combines up to 8 "Zen 4" cores and 16 threads with integrated AMD RDNA 3 graphics and an XDNA NPU, delivering up to 40 TOPS. The cExpress-R8 fuels power-efficient AI inferencing and fast decision-making across machine vision, robotics, medical imaging, infotainment, and intelligent human-machine systems. With XDNA architecture, performance-per-watt efficiency is optimized, delivering advanced AI processing, and enabling more complex AI workloads without a significant spike in energy demands.cExpress-R8-F. ADLINKTo guarantee real-time processing, the cExpress-R8 supports up to 96GB of DDR5 memory at 5600 MT/s, with both ECC and non-ECC options available. ECC acts as a watchdog, detecting and correcting errors in environments where failure isn't an option, whether in mission-critical applications, gaming, transportation, and POS (Point of Sale)/POI (Point of Information) systems.With support for up to four displays, DP, eDP, HDMI, LVDS, and VGA interfaces. VGA and eDP outputs are available as optional features, allowing flexible visual configurations to meet edge computing demands. Combined with scalable performance, power, and graphics configurations, the cExpress-R8 is well-suited for a diverse range of edge applications. With 10-year product availability, it ensures long-term design stability and lifecycle alignment for system integrator roadmaps.Key Features:- AMD Ryzen Embedded 8000 Series Processors- AMD RDNA 3 Graphics and XDNA NPU (up to 40 TOPS performance)- Up to 96GB DDR5 5600 MT/s (ECC/non-ECC)- Four independent display outputsADLINK's cExpress development kits, including reference carriers and full I/O support, will be available in Q4 of 2025 to help you accelerate prototyping and simplify system integration.For more information about ADLINK COMs, visit adlinktech.com and explore the cExpress-R8 module.Summary:- Built on AMD Ryzen Embedded 8000 Series processors for powerhouse performance.Deploy 8-core, 16-thread processing with AMD RDNA 3 graphics for accelerated multitasking and immersive visuals.- Achieve up to 40 TOPS of AI inferencing performance with Zen 4, RDNA 3, and XDNA architectures for enhanced on-device intelligence.- Support up to 96GB DDR5 with ECC for reliable data integrity and system stability.- Enable versatile multi-display configurations (DP, eDP, HDMI, LVDS, VGA), accommodating complex visual setups with convenience.

In the face of global challenges such as traffic congestion, air pollution, and rising oil prices, electric two-wheelers are rapidly becoming an important transportation choice due to their advantages of flexibility, affordability, and zero emissions. To address the urgent market demand for high-performance electronic control systems, Holtek Semiconductor, leveraging its technical expertise accumulated through deep involvement in the consumer electronics sector, has officially launched a full-featured electronic control component solution for electric two-wheelers, enabling customers to achieve rapid product development and mass production.Complete technology ecosystem covering all vehicle electronic control requirementsBased on its independently developed complete technology ecosystem, Holtek deeply integrates technologies such as instrument display, anti-theft security, power control, energy management, and wired/wireless communication to launch an electric two-wheeler electronic control solution, abbreviated as the E-2W solution. This solution covers six core electronic control components: dashboard, RF vehicle alarm, central controller, motor controller, battery management system (BMS), and EV charger, flexibly supporting single-component development and whole-vehicle integration applications.Development efficiency revolution: dual engine drive in the form of evaluation boards + parametric platformHoltek's E-2W solution is equipped with feature-rich evaluation boards and a graphical development platform, allowing developers to quickly enter the functional testing stage by parameter configuration. It is worth noting that this series of evaluation boards supports the popular CAN bus communication, including:1. Intelligent LED dashboard: real-time display of vehicle data and operating status2. Hopping code alarm: RF remote control, supports abnormal vibration detection, and sound and light alarms3. 4G/Bluetooth central controller: multi-mode positioning, remote vehicle condition management, and OTA upgrades4. 250W motor controller: 3-shunt sensor FOC algorithm and multiple protection mechanisms5. 350W charger: precise control of battery charging curve and multiple safety protections6. 16S battery management system (BMS): battery power estimation and multiple protection mechanismsEnabling Green Transformation of the IndustryHoltek will collaborate with industry chain partners to accelerate technological innovation in electric mobility by providing vertical support from core chips to system solutions. Holtek will also continue to invest in R&D resources to deepen its technological footprint in the green transportation sector.Holtek wishes to announce its participation in Electronica India 2025, which will take place in Bangalore from 17th to 19th, September. At the exhibition visitors can see Holtek's E-2W development platform and the electronic control evaluation boards suitable for low-speed e-scooters. We welcome interested partners to visit the site to learn more information. For further details on our solution, please contact Holtek's sales or agencies.Holtek E-2W Solution for Green Travel. Holtek

TerraONE Tech Co., Ltd., a company specializing in modern IT solutions, has announced a strategic partnership with Wasabi Technologies, a leading cloud storage company, becoming the authorized distributor for Wasabi Technologies in the Taiwan market. With the partnership, Taiwanese businesses can enhance their data management and redundancy services with high-performance, secure, and cost-effective cloud object storage.Credit: TerraONEWasabi is one of the technology industry's fastest-growing companies. Wasabi Hot Cloud Storage is a predictable, affordable cloud object storage service. Compared to traditional storage solutions, Wasabi eliminates fees for egress and API usage and provides 99.9999999999% (11 nines) data durability and robust enterprise-grade security. Wasabi Hot Cloud Storage is widely adopted by tens of thousands of businesses and MSPs worldwide.Kevin Chen, General Manager of TerraOne Technology, said, "Amid digital transformation and IT modernization, many businesses are increasingly demanding highly flexible and scalable cloud storage. Wasabi Technologies' services offer significant advantages in performance, price, and security, making them ideal for storage, backup, redundancy, video surveillance, big data analytics, and other application scenarios across various industries. By partnering with Wasabi, we can provide our customers with more professional technical support, integration services, and customized solutions, helping businesses seamlessly transition to cloud platforms.""TerraONE has extensive experience in enterprise IT deployments and a broad distribution network in the Taiwanese market, making them a key partner in our efforts to expand our distribution network in Taiwan," said Raymond Koh, Country Manager, ASEAN, Wasabi Technologies. "We look forward to working together to accelerate the adoption and innovative applications of enterprise cloud storage."TerraOne Technology will host a Wasabi partner product launch event on 9th September 2025. Interested distributors are welcome to contact TerraOne. Alternatively, click here to stay up-to-date on TerraOne Technology events.For more information, please visit.

In the past decades, the memory industry has been one of the most volatile sectors in semiconductors, marked by price fluctuations, supply-demand imbalances, and rapid capacity shifts. Yet as we step into 2025, the rise of AI, massive data processing, and edge intelligence is propelling memory from a "cycle-driven" market into a new stage of "structural growth."The global memory market is moving beyond sheer "capacity expansion" toward "breakthroughs in performance, energy efficiency, and system-level integration". Rapid advances in DRAM and NAND, coupled with the accelerated adoption of new packaging, protocols, and architectures, are propelling the memory ecosystem into a new phase of robust and sustainable development.According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market reached USD 346 billion in H1 2025, up 18.9% year-over-year, with the memory segment growing by 20%. Multiple institutions forecast that memory product prices will continue to rise in the third quarter of 2025, particularly in high-value segments such as enterprise SSDs and high-speed DRAM. This wave of AI-driven structural demand is becoming the starting point of a new growth cycle for the memory industry.GMIF2025: Shaping the Future of Memory in the AI EraIn this paradigm-shifting moment, the industry needs a collaborative hub to connect upstream and downstream players, bridge technology with markets, and bring together key forces across the global memory ecosystem to explore trends, align resources, and foster partnerships.The 4th Global Memory Innovation Forum (GMIF2025 Innovation Summit) will be held on September 24–25, 2025, at the Renaissance Shenzhen Bay Hotel.Co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., GMIF2025 will focus on the theme "AI Applications, Innovation Empowered" to discuss memory breakthroughs and ecosystem collaboration under the momentum of AI.Four Core Themes:01 Trends and Roadmaps of Storage and Memory Technologies: From CXL and Chiplet to near-memory computing, new architectures are transforming memory from isolated optimization to system-level synergy.02 AI Applications & Deployment Practices: Deep dives into emerging memory innovations driven by AI servers, AI smartphones, AI PCs, and intelligent vehicles.03 Industry Collaboration Across the Value Chain: Uniting IDM manufacturers, controller providers, solution vendors, packaging & testing suppliers, material and equipment companies to build dual engines of technology and market growth.04 Global Ecosystem & New Industry Dynamics: Exploring new pathways to reshape supply chains, jointly build standards, and establish a paradigm for cross-border collaboration in the post-globalization era.Summit Highlights. Credit: GMIFGMIF2024 Data Insights. Credit: GMIFAn Industry Gathering Not to Be MissedGMIF is more than just a technology summit; it is a global high-end platform that combines dialogue, showcase, partnership, and influence:For enterprises: it's a premier stage to showcase technological achievements and expand upstream & downstream collaborations.For industry professionals: it's a vital arena to grasp trends, access resources, and discover opportunities.For investors: it's a unique vantage point to anticipate turning points and uncover industry value.For media & academia: it's a core hub for first-hand insights and shaping industry discourse.We sincerely invite you to join us this September in Shenzhen Bay, where global industry leaders will gather to discuss memory innovation in the AI era, witness a new stage of collaboration, and co-create the future of the memory ecosystem.Click the link to secure a seat.An Industry Gathering Not to Be Missed. Credit: GMIFFor more information about GMIF, please visit.

As cybersecurity threats continue to evolve, attackers are no longer just targeting applications or operating systems, but are now penetrating deeper into the boot firmware layer of devices, including BIOS, UEFI, and BMC. These firmware components are responsible for initializing and verifying the system integrity during the boot process. Once compromised or embedded with malicious code, they can compromise the entire system.Real-world incidents and attack simulations have shown that firmware attacks are highly stealthy and persistent, often eluding traditional antivirus software and OS-level defenses. The National Institute of Standards and Technology (NIST) addressed this as early as 2018 in the release of NIST SP 800-193: Platform Firmware Resiliency Guidelines, proposing a three-step framework: Detect–Protect–Recover, as the core architecture for platform firmware security.Among these, the"Recover" mechanism has drawn significant attention. It not only mandates that a system halt upon detection of firmware anomalies, but also be capable of restoring original firmware from a secure image (such as a Golden Image)—automatically, without human intervention—thus ensuring the platform can return to a trusted state and cutting off any potential long-term malware residency.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Challenges in PFR Adoption: Legacy Architectures and Weak Firmware VerificationAlthough NIST SP 800-193 is widely recognized as a reference for governments and enterprises implementing firmware security, the practical deployment of PFR (Platform Firmware Resiliency) still faces numerous hurdles.First, many embedded systems or server platforms rely on conventional SPI NOR Flash as firmware storage, which lacks support for key-based verification, partition control, and redundancy mechanisms, making it difficult to meet the "Protect" and "Recover" requirements defined by NIST. Even when the platform includes a Root of Trust (e.g., TPM, CPLD, BMC), vulnerabilities remain if the external memory used does not support secure image switching or key-binding mechanisms.Common challenges include:Firstly, firmware regions vulnerable to rollback attacks, where outdated, exploitable images are reintroduced. Secondly, the inability to separate access rights between boot-time and run-time, leading to broken access control. Thirdly, the lack of integrated verification tools and APIs requires extensive engineering effort to build verification workflows.Unnder these conditions, the search for a secure storage component that supports the PFR framework has become a critical entry point for enhancing firmware security.Winbond TrustME Secure Flash — W77Q: A Secure Memory Fully Supporting PFRTo address the above challenges, Winbond's TrustME Secure Flash — W77Q series offers a solution specifically designed for platform firmware security and recovery. It allows for fast deployment of the NIST PFR-required protection and automatic recovery features without altering the main platform architecture.Dual Images with Secure Verification—Seamless Auto-Recovery DeploymentThe W77Q integrates both a Primary Image and a Recovery Image, supporting secure verification mechanisms and auto-switching logic. When the primary firmware image is corrupted or fails verification, the Root of Trust controller (e.g., BMC or CPLD) can trigger a switch to restore the system to the Golden Image. This entire process requires no additional software or CPU intervention, fulfilling the "unattended, automatic recovery" requirements of PFR.Moreover, the mechanism complies with the Detect-Protect-Recover architecture outlined in NIST SP 800-193, and can be integrated with major platform vendors' boot verification logic, establishing a full Chain of Trust from chip initialization to firmware validation.Multi-Level Access Control and Key Binding to Strengthen Firmware IntegrityW77Q supports partitioning and key-based access control, allowing different keys and permissions to be configured for each firmware region (e.g., Bootloader, UEFI, BMC). This prevents unauthorized access and tampering. It also supports rollback prevention and restricts firmware updates to authorized controllers only, significantly reinforcing platform firmware integrity verification.Modular Integration and Development Support—Accelerating PFR ImplementationThe W77Q Secure Flash not only strengthens hardware-based firmware protection but also provides complete software development and validation support to help device manufacturers accelerate PFR deployment:Offers ready-to-integrate verification API interfaces and reference designsProvides boot verification parameters and switching logic in coordination with Root of Trust controllers (e.g., BMC, CPLD)Delivers test reports and certification documents compliant with NIST SP 800-193 and ISO 26262The Winbond W77Q Secure Flash is pin-to-pin compatible with existing SPI Flash devices, requiring no hardware changes, greatly reducing implementation costs.For applications like server motherboards, 5G base stations, industrial control systems, or automotive ECUs, W77Q presents an ideal solution for quickly realizing platform firmware recovery mechanisms and meeting security compliance requirements.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.This year's one-day seminars will center on live product demonstrations of Sycamore, xMEMS' revolutionary thin and lightweight full-range MEMS loudspeaker, and cooling, the world's first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can't go.Attendees will experience:1) AI glasses featuring Sycamore speakers and cooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear2) Next-gen headphones featuring full-range Sycamore, paired with cooling to deliver the world's first active earcup ventilation3) SSD thermal management featuring cooling for higher sustained data transfers4) Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing cooling at both chip and system levelsIn addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and cooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics."AI is changing how we interface with devices while also increasing processor and thermal loads," said Joseph Jiang, CEO of xMEMS Labs. "At xMEMS Live Asia, we'll demonstrate how Sycamore and cooling technologies are enabling a new generation of thinner and lighter-weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance."Registration is now open. Seating is limited. Click here for English, here for Simplified Chinese, or here for Traditional Chinese. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management!For more information about xMEMS and its solid-state solutions, visit xmems.com.Showcasing Live Demonstrations of AI Interface and Thermal Device Innovation Enabled by Sycamore and cooling on September 16 in Taipei and September 18 in Shenzhen.