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Tuesday 22 September 2026
Taiwan advances major science park expansion to support AI, semiconductor growth

Demand from high-tech companies for new research and manufacturing sites remains strong, prompting Taiwan to advance plans to expand Longtan Science Park by 104 hectares as the government seeks to accommodate continued growth in AI and semiconductor industries.

Tuesday 22 September 2026
Huaqin challenges Quanta for Steam Deck ODM order

Industry sources say Valve is expected to launch a new Steam Deck in 2027, setting up a tougher contest for Taiwanese original design manufacturer (ODM) Quanta as China's Huaqin moves to win the manufacturing order. The winner has not yet been confirmed.

Tuesday 22 September 2026
Tesla speeds up Optimus mass production with China supply chain visits
Tesla is reportedly making new progress toward mass production of its Optimus humanoid robots, with the company's robot team conducting intensive supplier audits across China's Yangtze River Delta last week. The visits covered Ningbo, Hangzhou, and Shanghai and included potential suppliers Tuopu Group, Sanhua Holding Group, and Joyson Electronics, all of which are existing Tesla automotive suppliers.
Tuesday 22 September 2026
EZconn eyes 2027 high-core fiber ramp as shortages persist

EZconn said global fiber and optical cable supplies remain tight as AI data center demand overtakes demand from traditional telecom applications, pushing up raw material prices and boosting costs for optical passive components. The company expects the shortage to ease gradually from the second half of 2026 into 2027 as upstream suppliers add capacity, while it negotiates for larger allocations and longer-term supply contracts.

Tuesday 22 September 2026
AI inference demand surges as training slowdown talk fades
Calls to slow frontier AI model training have sparked debate across the AI semiconductor industry, but executives at the AI Infra Summit in Santa Clara, California, said the real buildout is aimed at AI inference, not training. The event, held from September 15 to 17, became a broad response to Anthropic CEO Dario Amodei's September 12 essay urging frontier AI labs to slow the pace of capability gains.
Monday 21 September 2026
ACES targets AI compute, power with cable ramp-up

High-speed transmission demand continues to rise on the back of AI server and data center buildouts, while cloud service providers (CSPs) accelerate adoption of in-house application-specific integrated circuit (ASIC) platforms. As a result, demand for high-speed connectors and high-speed transmission cables inside servers is also increasing.

Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on AI servers and high-performance computing applications, driving brisk orders in the first half of 2026 and strong utilization rates. Capacity is now close to fully booked, and customers have also begun laying out long-term orders for the next one to two years.

Saturday 19 September 2026
Ams OSRAM takes an automotive-qualified force sensor into robotic hands
Ams OSRAM is pushing its optical force sensor line into robotic hands on the argument that incumbent piezoelectric solutions cannot hold a reading, and it is using automotive qualification as the entry credential.
Saturday 19 September 2026
Compal takes Compal Broadband Networks private to fold networking into its edge AI stack
Compal Electronics is buying out the shares of its listed networking arm, Compal Broadband Networks (CBN), in a cash deal that will end CBN's public listing and give Compal full control of a router and gateway business it wants to pair with its edge AI hardware.
Friday 18 September 2026
Corning to raise display glass substrate prices 15% from 4Q26
Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026, according to industry sources. The company confirmed the move amid persistent cost pressure across the electronics supply chain.
Friday 18 September 2026
CoreWeave launches US$3 billion bond sale amid growing revenue, debt

CoreWeave launched a debt sale worth US$3 billion in convertible bonds, which would allow buyers to turn their bonds into shares. The neocloud, which has sharply ramped up its infrastructure spending over the past year, has secured a growing customer base but faces concerns over financial sustainability amid intense competition and fears of an AI slowdown.

Friday 18 September 2026
FCS Group eyes North America layout, as plastics industry turns to material innovation

The spotlight has been on industry innovation at the 2026 Taipei International Plastics and Rubber Industry Show (TaipeiPLAS), as Taiwan's plastics and rubber sector moves beyond the realm of traditional manufacturing, with forays into high-value applications in aerospace, drones, robotics, automobiles, and healthcare and medicine, aiming to create new value through smart manufacturing, innovative materials, and circular use. According to data from the Ministry of Finance, Taiwan's total exports of plastics and rubber processing machinery reached US$458 million through August 2026.

Friday 18 September 2026
AI's next infrastructure squeeze is storage: Seagate sees demand accelerating
Seagate's 2026 Data Infrastructure Readiness Report finds that enterprise AI strategies are moving beyond early-stage adoption toward broader deployment, increasing the importance of data infrastructure for storing, accessing, managing, and using data at scale.
Friday 18 September 2026
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks

Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization and visibility extending through 2027. Optical communications products began shipping in small volumes in 2026 and are expected to scale further in 2027 and 2028, though adoption will ultimately follow customers. "We cannot run faster than our customers," Lu said.

Thursday 17 September 2026
Trumpf eyes glass as AI demand drives packaging innovation
At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser solutions to advanced chip packaging, specifically for drilling holes in glass substrates.
Thursday 17 September 2026
China optical suppliers power smart glasses supply chain
China's optical suppliers are playing a growing role in the global smart glasses, VR, and AR supply chain as AI glasses demand accelerates worldwide. Industry sources say more than 80% of smart glasses suppliers are from China, with Chinese vendors covering key areas from camera modules and light waveguides to microelectromechanical systems (MEMS) and batteries.
Thursday 17 September 2026
China's LCD trio flexes newfound pricing power as Taiwan panel makers retreat
China's top three liquid-crystal display (LCD) panel makers have sent written price-increase notices to customers for the first time, as Taiwan's leading panel makers sell factories and China tightens its grip on the global market. With South Korea and Japan already out of the thin-film-transistor LCD (TFT-LCD) market, China now controls more than 70% of LCD TV and monitor panel share, creating an effective oligopoly.
Thursday 17 September 2026
FIT ramps up optical interconnect push as AI race shifts to connectivity
At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus is shifting from simply pursuing greater computing power to improving the overall efficiency of data centers. He said the key to the next 10 years of AI lies not only in chips and computing performance, but also in whether data can flow smoothly within data centers and across different systems through faster, more stable, and more efficient connectivity.
Thursday 17 September 2026
Taiwan machine tool makers target aerospace, semiconductor boom at major trade shows
Taiwanese machine tool manufacturers are taking part in two major manufacturing trade shows in Europe and the US this September. The participation reflects a shift in Taiwan's machine tool industry from supplying standalone equipment and components toward integrated processes and smart manufacturing solutions.
Wednesday 16 September 2026
Why Wiwynn chose El Paso for its first US plant

Wiwynn held the grand opening for its first US factory on September 14 local time, choosing El Paso, Texas, over larger cities such as Dallas and Houston. Chief manufacturing officer Robin Wang said the site gives the company the best support from its Ciudad Juarez, Mexico plant, which is less than an hour away.

Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser, and higher-performing, bolstering the value of the advanced packaging end of the chip process.
Wednesday 16 September 2026
BizLink's CPO breakthrough hits the hard part: scaling
BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal management and system reliability rather than production capacity.
Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market. Samsung's share of the global smartphone AP market rose to 9% in the second quarter of 2026, up 2 percentage points from the previous quarter and 3 percentage points from a year earlier, marking a second straight quarterly increase.

Wednesday 16 September 2026
DeepSeek to hire its first CFO as it aims for public listing, expands workforce

DeepSeek is reportedly set to hire Wentao Yan, a partner at venture capital firm GL Ventures, as its first CFO. If the appointment takes place, it would happen at an important time for the Chinese AI startup as it seeks to go public, begins a large expansion of its workforce, and invests in chipmaking and computing capacity.

Wednesday 16 September 2026
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations in the industry amid the AI boom.