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Tuesday 15 September 2026
US FCC, White House tighten controls on power systems, raising the trust bar for Taiwanese suppliers
The US has taken steps to tighten controls on power systems and robotics equipment in line with its "America First" policy amid the latest geopolitical shifts, adding new uncertainties for Taiwanese supply chain players seeking to establish a foothold in the US. Rather than isolated natural disasters such as earthquakes and floods, the risks that companies must now face are far more structural and geopolitical in nature, according to Chung-Hua Institution for Economic Research (CIER) vice president Shin-horng Chen, who notes that US oversight is moving beyond mere market access for products, into deeper factors such as equipment origin, remote control, software and firmware transparency, and overall supply-chain trustworthiness.
Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the trajectory of the optical networking industry: a 1.6T pluggable optical transceiver currently ramping toward mainstream adoption, and a prototype module built for external light source (ELS) architectures, a technology that could define the next generation of data center interconnects.

Tuesday 15 September 2026
Inside CIOE: takeaways from China's biggest optoelectronics show
Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE), DIGITIMES reporters got a peek into the trends going on within this booming industry.
Tuesday 15 September 2026
SiPh shifts optical module bottleneck upstream: from device manufacturing to laser-grade substrate supply

The market value of optical modules used in data centers is projected to grow from US$12.6 billion in 2025 to US$45.4 billion by 2030. Volume shipments of 1.6T modules are set to scale up starting in 2026, followed by initial revenue contributions from 3.2T modules in 2028. Silicon photonics (SiPh) serves as the core architecture underpinning this growth trajectory, with the majority of modules at 800G and above already transitioning to SiPh designs.

Tuesday 15 September 2026
Robot supply strategies split between US in-house tech and Chinese local ecosystem
As humanoid robots gradually move from laboratory proofs-of-concept and enter industrial manufacturing and commercial service, their underlying motion control and environmental perception capabilities have become core indicators of product maturity. Major humanoid robot makers are actively seeking the best balance between performance and cost efficiency through architecture restructuring, in-house vertical integration, and supply-chain strategic cooperation.
Monday 14 September 2026
STMicro lead times top 1 year, boosting Taiwan chip makers
AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering severe shortages in industrial control MCUs. That is opening the door for Taiwanese chip makers to push into high-end industrial MCUs, while supply is expected to remain tight through 2027 and stable delivery becomes key to defending market share.
Monday 14 September 2026
China optical firms target photonics with mixed high-end, lower-cost push
The 2026 China International Optoelectronic Exposition (CIOE) closed on September 11. While near-eye display applications such as AR/VR and smart glasses drew attention, vendors' latest moves in optical communications also attracted strong industry interest.
Monday 14 September 2026
Aurotek posts record August revenue on semiconductor, robot shipments

Taiwanese robotics component maker Aurotek attributed its strong revenue growth in August 2026 to continued robust customer pull-ins for its automation subsystem equipment in the semiconductor, high-end artificial intelligence (AI) server, and electronics manufacturing industries. The company also highlighted the outlook for robot shipments.

Friday 11 September 2026
CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase a growing web of partnerships. This is a strategy the company says reflects both its late entry into the photonics race and its long-term goals in the region.

Thursday 10 September 2026
Phison pushes in-house AI solutions as August revenue surges to record high
Phison Electronics continues to benefit from the rapid growth in demand for artificial intelligence (AI) infrastructure, AI inference, and enterprise storage, with its Phison AI Data Platform gradually being deployed across industries in Taiwan, said company CEO Khein-seng Pua.
Thursday 10 September 2026
CIOE 2026: Morphotonics draws on display background to break AR waveguide bottlenecks
At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR glasses runs through the display industry rather than the semiconductor background, where most AR lens-making equipment comes from.
Thursday 10 September 2026
Apple just put a US$700 premium on hinges — seven supply chain takeaways
These are the seven supply chain takeaways from Apple's announcements on September 9, covering new iPhone models, new AirPods, chips, and upgrades to its ecosystem.
Thursday 10 September 2026
Apple names 2nm node for the first time since 2024 — and raises prices on every iPhone it still sells
Apple used its 2026 iPhone launch to do two things it had avoided for years: name the process node in its flagship chip, and raise the price of phones already on sale. Both moves point to the same pressure. Memory is expensive, the packaging that binds memory to logic has become the hard part of building a phone chip, and Apple has stopped absorbing the cost.
Thursday 10 September 2026
Apple bets on new sensors and S11 chip to differentiate its 2026 watches
Behind the foldable, Apple used the same event to rebuild the sensing hardware in its wearables and to push active noise cancellation down to US$129. Apple announced the Apple Watch Series 12, Apple Watch Ultra 4, and AirPods 5 in Cupertino on 9 September, and the two watches share the key upgrades: an all-new Health Sensing System and the S11 chip, which Apple calls its most powerful wearable silicon.
Wednesday 9 September 2026
AI servers push Asus' August revenue up 51%
Asus reported consolidated revenue of NT$94.96 billion (US$3.02 billion) in August 2026, up 12.87% from July and 51.17% from a year earlier — the second-highest monthly figure in company history. Revenue for the first eight months reached NT$645.19 billion (US$20.5 billion), up 42.3% year over year. The company attributed the gain to AI server and PC demand, with motherboard orders also recovering.
Wednesday 9 September 2026
CIOE 2026: Luxshare bets on flat optics to solve AR glasses' weight problem
At its booth at the China International Optoelectronic Expo (CIOE), Luxshare and its camera-module affiliate Luxvisions showcased the components they believe will define the next generation of smart eyewear, pointing to weight and price as among the industry's biggest remaining obstacles.
Wednesday 9 September 2026
Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic capacitor (MLCC) customers ramp up copper paste purchases.
Wednesday 9 September 2026
Verizon, Corning strike multi-billion-dollar fiber deal for broadband and AI buildout
Verizon and Corning have agreed to a multi-billion-dollar supply deal that could shape broadband access and artificial intelligence infrastructure well beyond the US. The pact underscores how telecom networks are becoming a shared foundation for consumer internet, enterprise connectivity, and the data-heavy systems driving the next wave of AI services.
Tuesday 8 September 2026
What to expect at CIOE 2026, Shenzhen's optoelectronics mega-expo
This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's era of pervasive digital connectivity, from smart glasses to cars to phones, this event is expected to give us a glimpse into the hardware supply chain behind these devices, and increasingly behind the global AI infrastructure build-out.
Tuesday 8 September 2026
CIOE 2026: 5,000 exhibitors gather in Shenzhen to chase AI-driven optics boom
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions as AI infrastructure, high-speed optical communications and AR/VR applications reshape the optoelectronics industry.
Tuesday 8 September 2026
SST market grows 32% as global players race to secure position
As AI server computing power and per-rack power density continue to rise, traditional 54VDC power architectures are hitting bottlenecks such as excessive current, higher copper usage, and greater transmission losses. This is pushing next-generation AI data center power designs toward 800V high-voltage direct current (HVDC).
Monday 7 September 2026
STMicroelectronics says humanoid robots must clear a trio of hurdles
STMicroelectronics said humanoid robots are still most likely to enter manufacturing first, as the industry works through key hurdles in hand dexterity, edge AI decision-making, and total system cost. The chipmaker made the remarks at a recent press event in Taiwan focused on sustainability, AI data centers, and robotics.
Monday 7 September 2026
AI racks move toward MW scale as power, cooling converge
As AI computing power surges, the energy consumption of AI servers has become a major bottleneck that must be solved. The issue is spreading from chips into power delivery systems as Nvidia's AI racks ramp up, rapidly pushing up the power draw of a single AI rack.
Sunday 6 September 2026
Trumpf CTO says advanced packaging reshapes semiconductor equipment race
AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data transfer requirements rise rapidly, competition is no longer limited to front-end process scaling; 3D stacking, advanced packaging, high-density interconnects, thermal management, and memory technologies are also becoming more important.
Saturday 5 September 2026
Topco targets optical comms, cooling as copper gives way
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical communications between racks and chips will enter practical use. Industry players say the maturity of system integration is still the main consideration for commercialization.