Tata Electronics is ramping up hiring and redesigning its Gujarat chip fab as it races to match Apple's fast-growing India production. The expansion comes amid soaring iPhone exports and mounting engineering challenges, underscoring the Tata Group's broader push to scale electronics and semiconductor manufacturing.
Driven by a global upgrade in advanced manufacturing, hydraulic components are expanding beyond traditional heavy industries into semiconductor, medical, and precision equipment sectors. At its recent investor conference, Jufan expressed optimism about growth in semiconductors, molds, medical devices, and machine tools, projecting continued operational expansion in 2026.
Foxconn Industrial Internet (FII) plans to double its revenue in Vietnam to US$20 billion in 2026, driven largely by surging demand for AI server systems and components purchased by cloud giants, including Amazon, Google, and Oracle.
Foxconn has announced a new four-year plan to expand its operations in Wisconsin, focusing on artificial intelligence (AI) infrastructure, after approval from the Wisconsin Economic Development Corporation (WEDC). The plan includes an additional investment of US$569 million and aims to create nearly 1,400 new jobs in Racine County, marking a significant step in the company's efforts to grow its presence in the US.
Foxconn showcased sweeping upgrades across artificial intelligence (AI), electric vehicles (EVs), advanced manufacturing, and data center hardware during its two-day Hon Hai Tech Day event. The developments underscore the company's push to evolve from the world's largest electronics contractor into a full-stack technology and platform provider. The event highlighted new strategic partnerships, including a collaboration with OpenAI and expanded work with Nvidia.
Foxconn Industrial Internet (FII), a subsidiary of Foxconn Technology Group, has publicly rejected recent media reports asserting that it would reduce its fourth-quarter performance targets and alter its business model. The company emphasized in a statement on the evening of November 24 that these claims are unfounded and not supported by any factual basis.
At its Hon Hai Tech Day (HHTD) held in Nangang, Taipei, Hon Hai (Foxconn) outlined its strategic transformation through chairman Young Liu's remarks and technology showcases. The event highlighted the company's emphasis on artificial intelligence (AI) and its expanded role in smart industries, underscoring a shift towards a broader technology platform service orientation.
Fujifilm will build a semiconductor materials plant in India for regional exports; Ziroh Labs promotes CPU-first AI compute; India approves 17 ECMS projects worth US$810 million to expand component manufacturing.
Hon Hai Tech Day, held on November 21-22, featured IBM Asia-Pacific general manager Hans Dekkers discussing ongoing cooperation in AI and quantum computing with Jesse Chao, head of AI and Quantum Computing, Corporate BD at Foxconn. The event emphasized advancing AI factories and quantum technologies amid rapid AI development.
Hon Hai Tech Day (HHTD) opened on November 21, 2025, with founder Terry Guo present, as chairman Young Liu again rejected the long-held view that Foxconn is only a contract assembler. He underscored that the company's real competitive strength comes from its fully integrated technology, manufacturing, and process-engineering stack.
Foxconn Technology Group is expected to showcase its latest innovations and strategic developments during the sixth annual Hon Hai Tech Day, starting on November 21. The event will focus on advancements aligned with the company's 3+3+3 development strategy across computing, manufacturing, and real-world applications; this includes AI Factory, robotics, smart manufacturing, and electric vehicles.
At its 2025 Hon Hai Tech Day event held on November 21, 2025, Foxconn emphasized its strategic transformation from a system assembler to a deeply integrated technology company. Founder Terry Gou attended as an honored guest, and chairman Young Liu highlighted Gou's foundational role, stating that without Terry Gou, there would be no Foxconn today. The event showcased the company's evolving vision and technological ambitions.
The AI infrastructure industry is intensifying competition as demand for AI server capacity surges, raising concerns about a potential AI bubble. Despite enterprises committing to long-term leasing contracts with major cloud and software companies, server shortages highlight the ongoing urgency for AI hardware deployment and signal substantial, sustained market demand.
Foxconn has announced a joint venture with Intrinsic, an AI robotics software company founded by Alphabet, aiming to develop intelligent factory solutions that enhance manufacturing flexibility, adaptability, and cost efficiency. The collaboration will focus on leveraging AI-powered robotics to transform production methods across factory floors.
Foxconn is accelerating its push into electric vehicles and energy storage batteries, launching its Foxtron plant in Kaohsiung and investing in talent, automation, and supply chain development as it works to build Taiwan's first gigafactory-level battery industry and expand its global footprint.
India has approved a second tranche of 17 projects under the Electronics Component Manufacturing Scheme (ECMS), authorizing investments worth INR71.72 billion (US$810 million) and projected production of INR651.11 billion. The Ministry of Electronics and Information Technology said the new approvals are expected to create 11,808 direct jobs and further expand domestic component manufacturing capacity. This follows an earlier set of seven applications worth INR55.32 billion cleared in the previous phase.
India-based EMS provider Syrma SGS is investing INR15.95 billion (approx. US$180 million) to set up a plant near Naidupeta, Andhra Pradesh. The facility is expected to create over 2,100 high-skill jobs and strengthen domestic PCB production, while the company also plans to produce laptop motherboards locally to increase value addition and qualify for government incentives, according to The New Indian Express.
Nvidia is set to adjust its AI server ODM shipment model to exert tighter control over system assembly processes. Supply chain sources indicate that Taiwan's Wistron Group, Quanta, and Hon Hai Precision Industry (Foxconn) will handle assembly of Nvidia's next-generation Vera Rubin AI server racks up to Level 10 (L10), after which Nvidia will ship products directly to customers.
Pegatron Corp. held an online investor briefing on November 12 to review its third-quarter 2025 performance and outline expectations for the coming quarters and beyond. The company stressed its ongoing efforts to diversify revenue sources by expanding into new business areas such as servers and automotive electronics while continuing to serve its established client base.
Pegatron Corp. is accelerating its shift away from China, increasing the share of manufacturing capacity located outside the country to 30-40% in 2025 from 20-30% in 2024, the company's management revealed during its earnings call on November 12. This move reflects Pegatron's broader strategy to diversify its manufacturing footprint and reduce reliance on its core contract with Apple Inc., which still accounts for approximately 60% of its revenue.
Foxconn (Hon Hai Precision Industry Co.) posted robust performance in the third quarter of 2025, driven by new smartphone launches, smart consumer electronics, AI servers, and cloud network devices. The company anticipates substantial sequential and year-over-year growth in the fourth quarter, maintaining expectations for solid full-year expansion and expressing optimism about 2026 results for the first time, according to chairman Young Liu.
Kaynes Semicon, the semiconductor division of India's Kaynes Technology, is expanding beyond its success in power module packaging toward advanced chiplet and co-packaged optics assembly.
Luxshare Precision Industry Co., a major Chinese electronics manufacturer, is fast-tracking its expansion into the AI server supply chain. On November 11, 2025, the company announced that its 800G silicon photonics (SiPh) modules have entered mass production, while 1.6T-class versions are under customer validation, reflecting stronger momentum in high-speed interconnects and AI data center applications.
