Apple is reportedly hiring talent to develop RF solutions, modem chips and other wireless semiconductors in house, sparking market concerns about possible impacts on its suppliers...
Etron Technology's in-house developed KOOLDRAM products are being adopted by car vendors, a milestone for its entry into the automotive sector, according to the Taiwan-based niche-market...
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...
Rising demand for 5G handset application processors, RF chips and HPC solutions boosted revenue at IC test solutions provider Chunghwa Precision Test Tech (CHPT) in October 2021,...
LED packaging service provider Harvatek has stepped into heterogeneous integration packaging and packaging of LED devices integrated with ICs, through cooperation with IC testing...
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
More China-based memory makers will receive cash injections from the government, as China's National IC Industry Investment Fund (Big Fund) steps up its investment in the country's...
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
ASE Group will complete the establishment of its 18th smart factory by the end of this year, with plans to build seven more intelligent plants in 2021, according to company COO Tien...
Moore's Law will continue to be embraced as sort of a faith when it becomes inapplicable, but chiplets will have a chance to become the mainstream in future IC design, according to...
The era of AI is coming. It will not be long before our cities operate efficiently with tremendous amounts of devices and robots connected through 5G infrastructure with enough bandwidth...
A sound ecosystem for high-end IC substrates has to be built in Taiwan as such substrates will still have a big role to play in backend services despite the growing demand for substrate-free...
