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Monday 9 February 2026
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
iCatch Technology, a Taiwan leading image processing SoC and solution provider and DXOMARK, the global authority in image quality evaluation as well as provider of imaging solutions, have entered into a strategic collaboration to establish the first automatic  image quality performance evaluation lab in Taiwan. Installed at iCatch facilities, this new laboratory will enable iCatch to design and fine tune the next generation of ThetaEye AI Image Signal Processors (ISPs) with the objective of helping the ecosystem deliver best-in-class image quality experiences to strategic collaboration
Tuesday 7 April 2026
Cincoze Launches DX-1300 High-Performance Compact Industrial Computer
Cincoze has announced the latest addition to its Rugged Computing - DIAMOND product line: the DX-1300 high-performance compact industrial computer. The DX series, already used for numerous large-scale projects, has garnered a strong reputation for its high performance, compact design, and comprehensive functionality. The newly released DX-1300 builds on this legacy, featuring the latest Intel Core Ultra 200S processor, a compact footprint of 242×173×75 mm, rich I/O, and versatile expansion options to meet a wide range of application needs. The DX-1300 serves as the ideal edge computing platform for high-end image processing, AI inference, and multitasking data integration applications in space-constrained environments.Heterogeneous Computing in an Ultra-Compact ChassisThe DX-1300 is powered by the Intel Arrow Lake-S platform Core Ultra 200S processor, featuring an integrated CPU, GPU, and NPU hybrid computing architecture that delivers up to 36 TOPS of AI computing power. Compared to the previous generation, AI inference performance has increased by up to 3.5 times, supporting demanding edge AI applications such as real-time video analysis, smart inspection, and data analytics. Furthermore, it supports up to 96GB of 6400 MHz DDR5 CSODIMM memory, significantly enhancing data transfer efficiency and reducing latency. This bolstered performance still fits in a chassis measuring only 242x173x75 mm—a footprint comparable to an 11-inch iPad—making it perfect for integration into equipment control cabinets, production line machinery, and in-vehicle systems where space is at a premium.Versatile Expansion and High-Speed Data TransmissionThe DX-1300 offers versatile application support through high-speed wireless connectivity—including 5G, Wi-Fi, and GNSS—and flexible storage options that balance NVMe speed with SATA capacity. Its robust I/O features up to 10 GbE LAN and USB 3.2, while optional M12 connectors ensure stability in high-vibration environments. For vision-centric deployments, modular expansion supports up to 12 LAN or 8 PoE ports, ideally suited for complex industrial camera systems.Rugged Reliability and Market CertificationUpholding Cincoze's consistent rugged design philosophy, the DX-1300 features a wide operating temperature range (-40°C to 60°C) and a wide-range DC power input (9 to 48VDC), ensuring stable operation in harsh industrial environments. To meet the demands of various vertical markets, the DX-1300 has passed MIL-STD-810H military standards and UL safety certifications. It also complies with railway EMC standard EN 50121-3-2 and fire protection standard EN 45545-2. These certifications make it particularly suited to manufacturing and railway applications where stability is critical, and installation space is limited. As the key edge computing core, the DX-1300 enables long-term, stable system operation and minimizes downtime risk.For more information, please visit Cincoze, or contact us by email. 
Tuesday 7 April 2026
Tescan Showcase Integrated Failure Analysis Solutions at SEMICON China 2026
Tescan will showcase its integrated semiconductor failure analysis solutions at SEMICON China 2026, covering key stages from non-destructive testing and defect exposure to sample preparation, analysis, and structural verification. The company aims to help customers improve defect localization efficiency and analytical accuracy in response to growing demand from advanced packaging and other applications.As advanced packaging, MEMS, and highly integrated semiconductor devices continue to evolve, the industry is placing greater demands on the speed, precision, and cross-platform coordination of failure analysis workflows. At this year's exhibition, Tescan will present a complete workflow from defect discovery to root-cause verification, helping laboratories improve efficiency and accelerate problem-solving.Defect DiscoveryTescan UniTOM HR 2 supports millimeter-scale non-destructive testing and delivers sub-micron, high-resolution 4D visualization and analysis. Its second-generation system combines Dynamic to Detail Imaging technology with the Panthera AI denoising algorithm to further enhance 4D image quality and defect detection efficiency during rapid scanning.Defect ExposureTescan FemtoChisel helps accelerate workflows for critical-region exposure. Under specific application conditions, the femtosecond laser processing platform can increase sample preparation speed by up to 5x while enabling cleaner cross-sections with lower thermal impact. This helps reduce focused ion beam (FIB) rework and improve overall analytical efficiency and result reliability.Sample Preparation and AnalysisTescan's Ga+ focused ion beam system has been upgraded with the second-generation Orage 2 ion column, which, under specific application conditions, can improve automated transmission electron microscope (TEM) sample preparation efficiency by up to 40%. Tescan SOLARIS X 2 Plasma FIB-SEM also supports applications in advanced integrated circuit packaging, microelectromechanical systems (MEMS), and display device testing, including TEM sample preparation, cross-sectioning, delayering, and in situ nanoprobing.Verification and Correlative AnalysisTescan leverages STEM imaging, EDS elemental mapping, and 4D-STEM capabilities to help users better understand the relationship between material structure and function. Tescan TENSOR, a highly automated analytical STEM platform, is optimized for 4D-STEM measurement and integrates precession electron diffraction technology to support process development and failure analysis.During the exhibition, Tescan will host a series of on-site technical talks from March 25 to 26 at E4-4590 in the Productronica China exhibition area. Visitors can also meet the Tescan team at booth T4-4446 during SEMICON China 2026 in Shanghai from March 25 to 27. Tescan welcomes semiconductor manufacturing and analysis professionals to connect with its technical team and discuss real-world analytical challenges and application needs.
Wednesday 1 April 2026
ASUS AI Predictive Maintenance Boosts Linyuan Advanced Carbon Black Manufacturing Resilience
Carbon black is a critical functional material underpinning the performance of tires and industrial rubber products. Its production involves a high-intensity, continuous operational model where any unscheduled downtime leads to increased defective or off-grade products, wasted energy, and significant instability across the entire production line.As Taiwan's only specialized carbon black manufacturer, Linyuan Advanced Materials Technology Co. Ltd – a core production site within the global network of Continental Carbon – has long prioritized real-time monitoring and predictive maintenance. Recently, the company deployed a comprehensive suite of ASUS AI-driven Predictive Maintenance and Health Management (AISPHM) solutions. This strategic move aims to gain advanced visibility into equipment status without disrupting production pace, thereby driving a robust digital transformation in maintenance operations.Historically, Linyuan Advanced relied on manual inspections and basic digital tools for vibration diagnosis. However, as production scales expanded and environmental constraints intensified, traditional architectures struggled with necessary immediacy, continuity, and comprehensiveness.Hsieh-Ho Tsai, Deputy Director of the Plant Manager's Office, noted that in brownfield factory environments, the construction costs and cabling complexity for wired fixed sensor systems are prohibitively high. This necessitated a search for a more flexible, scalable technical pathway to achieve comprehensive coverage.Empowering Maintenance Transformation for High-Intensity Processes via Scalable, On-Premise Edge AIAddressing these challenges, Linyuan Advanced implemented the ASUS AISPHM solution. Leveraging a robust three-tier architecture comprising wireless sensing, edge computing, and AI modeling, the company systematically reconstructed its maintenance protocols. This established a complete loop evolving from real-time sensing to predictive analytics, laying a deployable and scalable foundation for smart maintenance in high-intensity continuous manufacturing."During the evaluation phase, we prioritized the unique requirements of petrochemical material processing, specifically the need for long-term stability, uninterrupted operation," said Tsai. "Crucially, operational technology, or OT, data must remain on-premise. With equipment anomaly interpretation requiring accumulated domain expertise, key deciding factors included the vendor's capacity to provide responsive, local technical support, and the system's ability to allow continuous fine-tuning and expansion aligned with actual production dynamics.”After weighing critical factors such as cybersecurity governance, system stability, and long-term trust, Linyuan Advanced selected ASUS. With its deep-rooted experience in industrial and enterprise markets, ASUS offered a mature, autonomous technology solution with responsive local R&D support. The brand's reputation for reliability provided the assurance of a stable, sustainable partnership, securing the role of ASUS and the wider ASUS group as the trusted technology partner for this smart transformation.The deployed ASUS AISPHM solution encompasses three core layers: sensing, computing, and analysis. At the frontend, ASUS AISSENS wireless vibration sensors capture real-time equipment status. The intermediate layer utilizes the ASUS PE2100U industrial computer for on-site data aggregation and edge analysis. Finally, the backend AISPHM platform performs equipment health assessments, long-term trend comparisons, and anomaly alerts, forming a one-stop, integrated, and continuously evolving predictive maintenance ecosystem.A standout feature of the ASUS system is the high flexibility of its AI models. Designed for carbon black production – and in particular, powder transport – the ASUS system allows for granular parameter adjustments based on actual operating conditions. Such precision significantly enhances anomaly detection accuracy.According to Tsai: "Carbon black production is a high-intensity, continuous process inherently accompanied by persistent vibration disturbances. This makes context-aware AI vital; without integrating this specific process knowledge, false positives would be inevitable".The ASUS solution enables model fine-tuning for individual units based on specific RPM, bearing models, and structural parameters. Beyond the software's inherent flexibility, these AI models are fine-tuned by certified vibration analysts to verify baseline modeling and anomaly interpretation. Furthermore, remote technical support ensured that any initial parameter calibration or connectivity issues were resolved in real-time, rapidly stabilizing the overall system.Before full-scale expansion, ASUS provided sensors and a trial system for a pilot program, while Linyuan Advanced deployed its own WiFi network to test the solution on critical assets. The results verified stable, lossless data transmission. By combining this data with Linyuan's existing operational expertise, the team successfully established a vibration anomaly detection model tailored specifically to the carbon black plant, laying a solid empirical foundation for large-scale deployment.Following successful validation, Linyuan Advanced leveraged government resources to expand the rollout. The initial target extends vibration monitoring to 100 sets of rotating equipment. The deployment strategy adopts a unit-by-unit expansion while simultaneously building the database. Currently, 20 critical assets are live with real-time transmission, and this systematic approach is gradually accumulating a high-value database of equipment health, creating a high-value data asset through scale.From Operation to Governance: Establishing a Scalable Roadmap for Maintenance EvolutionIn practical operation, the system architecture comprises four layers: Front-end Sensing, On-site Transmission, Backend Server, and Monitoring Analysis. Sensors measure multi-axial vibration spectrum and surface temperatures of rotating equipment such as fans and pumps. Data is transmitted via gateways and industrial WiFi, overcoming cabling challenges and construction costs.The backend industrial computer performs full-spectrum analysis to build a historical vibration database. The AI prognostic mechanism utilizes the stable state following annual overhauls as a baseline model, continuously comparing it against real-time waveforms. Upon detecting anomalies, the system triggers alerts, allowing staff to verify with manual measurements and schedule planned maintenance, thereby significantly mitigating unplanned shutdown risks.Regarding digital governance, Linyuan Advanced maintains a strict on-premise OT architecture. All critical data is processed within the plant, adhering to group cybersecurity protocols and zone-based management to ensure absolute data sovereignty and risk control. Looking ahead, Tsai positions the Taiwan site as the primary validation hub. Once operational procedures and engineering capabilities are fully mature, the company plans to evaluate expanding this standardized, replicable smart maintenance architecture to overseas plants in the US, India, and Turkey. Given the homogeneity of process conditions across these sites, this global rollout is expected to further fortify the group's overall operational resilience.Tsai emphasizes that smart maintenance is a continuously evolving journey, not a one-time implementation. Building on the foundation of vibration monitoring, future roadmap items include integrating Generative AI analysis modules. These will automate reporting, helping engineering teams simply query equipment history and accelerate decision-making.Additionally, the company plans to implement video AI to create an intelligent environment, health, and safety (AIEHS) management platform, specifically targeting access control, personal protective equipment (PPE) compliance, and high-risk behavior detection, prioritizing scenarios that deliver tangible safety value.Linyuan Advanced places a high premium on system scalability and long-term upgrade flexibility – hence its choice of ASUS equipment to power its evolution. The goal is to extend analysis dimensions as the platform matures, avoiding redundant investments or the need to rebuild from scratch. When smart maintenance successfully integrates equipment, data, processes, and personnel capabilities, it transforms from a mere supporting tool into a core governance capability underpinning process stability and operational resilience.ASUS AISSENS sensors at Linyuan Plant capture real-time vibration data for AI proactive maintenance. Credit: ASUSHsieh-Ho Tsai, Deputy Director of the Plant Manager’s Office: AISPHM enables proactive monitoring. Credit: ASUS