LB Semicon is planning to offer fan-out wafer-level package (FOWLP) service next year at the earliest. The company completed the development of relevant technologies earlier this year and has been testing them with an analog chip customer since the first quarter. LB Semicon will likely offer FOWLP for RF and power management ICs.
Fan-out packaging market was worth US$1.5 billion in 2020 but is expected to grow 15.1% per year on average to be worth US$3.4 billion in 2026, According to Yole Developpement.
LB Semicon is a company in South Korea which provides the full turn-key service of WLCSP, RDL, bumping, probe test, back-end and etc.