Chipbond secures NT$2.5 billion bank loan

EDN, March 30; Esther Lam, DIGITIMES Asia Thursday 30 March 2006 0

Taiwan-based LCD-driver-IC testing and packaging house Chipbond Technology has secured a bank loan of NT$2.5 billion to help fund this year's capital expenditure (capex), according to a company filing at the Taiwan Stock Exchange (TSE). The company...

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