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Chipbond to cut prices amid order drainage; LCD driver IC packaging demand to pick up in 2Q

Amy Lee & Kathryn Chiu, Hsinchu; Esther Lam, DIGITIMES Asia 0

Chipbond Technology is likely to cut its testing quotes in March or April in an attempt to increase its market share as it has experienced order drainage from a major customer, according to company sources. Industry observers indicated that such a strategy...

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