As Industrial 4.0 and smart manufacturing emerge, the integration of virtuality and reality has become the mainstream. This trend has subsequently brought changes to the landscape of industrial products, from concept design, product design, mold design to manufacturing and production. The process entails CAD models all the way down to different simulations at every stage. Because of its expansive influence, the technology of molding analysis has been employed for more than 30 years and now is highly acclaimed. The application involves commonly seen injection molding, rapidly extending to advanced manufacturing fields, namely smart manufacturing and semiconductor package analysis.David Hsu, Chairman of CoreTech System, demonstrated that Microsoft Azure offers strong cybersecurity, and lists high-performance computing (HPC) as a critical development strategy, aside from a major upgrade for computing facilities under the hood. Meanwhile, Microsoft also launched a hybrid cloud model for the first time that allows customers to control their own data. Microsoft Azure introduced scalability as required for high performance computing, so customers enjoy high performance computing and asset-light benefits.More and more manufacturers are in urgent need of molding analysis software to swiftly develop molds, digital twins of products, or even digital twins of materials and machines with a view to enhancing the efficiency and quality of product development. In light of this, CoreTech System, who has gained high reputation with its Moldex3D software, decided to proceed with various value-added services, such as "Azure Connect", "Moldex3D Plastics E-Learning (MPE)", and "Material Hub Cloud (MHC)" which are built upon Microsoft Azure's cloud platform. The goal is to reduce the threshold for users to harness the techniques of molding analysis, while leveraging simulation-driven AI as means of rapidly reinforcing the capacity of smart design and smart manufacturing.Founded in 1995, CoreTech System helped the plastic industry accelerate product development and decrease the development cost of products and molds at early stages. By laying the foundation on computer-aided engineering (CAE) techniques, CoreTech System initiated Moldex3D, provoking favorable responses as the first of its kind in the global market, which makes 3D molding analysis software real and useful. The number of Moldex3D users is growing and has reached 5,000 customers as of now.David Hsu, Chairman of CoreTech System, expressed that for over 20 years of Moldex3D applications, their annual revenue maintains robust growth of 10% to 15%. There is no sign of the technology being mature or at a standstill, and this indicates continuously thriving market demands. Plastic and metal are top two industrial materials. Especially when there are more than 100 thousand types of plastic materials with distinct properties, the timeline of product development is easily delayed because it could be significantly difficult in design, processing, and size matching. Therefore, it is essential that users carry out simulation of product and mold design with the help of the molding analysis software to shorten the product development cycle. From this perspective, the fundamentals of Moldex3D are indeed solid.Three features of CoreTech System's MHC include viewing material master data, sourcing alternative materials, and recommending materials for products. David Hsu, Chairman of CoreTech System, pointed out that MHC can be beneficial for molding analysis, but much potential for product design and processing applications.It is worth mentioning that recent years have seen Moldex3D leap outside of the conventional scope. Instead, it blazed a way in the new business opportunity of semiconductor package analysis, turning into the molding analysis software that takes up the highest market share in the package area. Furthermore, the product is not just used for smart design which it is most powerful for, but extensively to smart manufacturing application. Accordingly, it is a right fit for simulation of flow, warpage as well as material properties and characteristics of machines. Customers are in perfect hands to address processing conditions during manufacturing and production.As the customer demographics and services have become diverse, the customers' expectations that CoreTech System strives to meet have been broadened. This serves as a driving force to steer away from standalone sales of Moldex3D software. In recent years, CoreTech System successively launched several innovative cloud services, including MPE (Moldex3D Plastics E-Learning) e-learning platform and MHC(Material Hub Cloud) as a database of the properties of processed plastic materials. What's more, Azure Connect solution is also made available for customers to access cloud resources and run Moldex3D for they are enabled to control data on their own. There new offerings are well structured with great values and future trends, all based on Microsoft Azure's platform.MHC as an incredible aid in accelerating product developmentDavid Hsu suggested that it is customers' demands that motivated CoreTech System to roll out the above products. Take MHC for example. One of the biggest obstacles that customers face lies in the fact that the properties of polymeric materials are non-linear and do not have a fixed parameter for reference. That is why they easily deteriorate as temperature changes or when processed. It is extremely hard to control them. Besides, the popularity of ESG stimulated a wave of plastic recycling. This has led to degradation and broken bonds in polymer within plastic materials, which would affect the stability of molding and make the problem thornier. Considering the issue, CoreTech System spent NT$ 60 million to invest in a material laboratory. On one hand, they can compile the physical properties provided by material suppliers. On the other hand, through constantly measuring and accumulating a substantial amount of data, the company helps customers quickly recognize the characteristics of each material curve. In this way, they are able to identify the most suitable materials, accelerate product development, and avoid high cost.As of now, the CoreTech material lab has already established more than 8,000 sets of physical property data of materials, and the list is going on. Usually CoreTech System would provide customers with this kind of data as they purchase Moldex3D. However, CoreTech System noticed that demands for this kind of big data of materials are not limited to molding analysis, but reach out to product design. Thus, this year (2022), the company marketed MHC service on the basis of Microsoft Azure so that existing Moldex3D customers, plastic designers, or plastic processors may subscribe to obtain more sophisticated information for design."The benefits that MHC brings to customers are in fact beyond our imagination," said David Hsu. For instance, "sourcing alternative materials," one of MHC's capabilities, is devised to select materials with similar properties for further analysis in the absence of the materials that customers desire. With that in mind, many customers draw inferences from the idea, and make use of the system to find similar materials to reduce cost or resolve the crisis of supply chain disruption.The concept of MPE derives from the experience 4-5 years ago. CoreTech System formulated a training program for customers on a 1-1 basis, but provided that the cost was relatively high, the service has been shifted online and remotely with the launch of Moldex3D University. The industry is undergoing a wave of retirement of senior masters, and this has forced newcomers to shoulder heavy burden when they still lack sufficient experience. Hence, there is a pressing need to count on Moldex3D University and develop knowledge and techniques for molding as soon as possible.Moving forward, CoreTech System is determined to enhancing the functionality of Moldex3D University to live up to customers' expectations. They look to incorporate more design courses related to materials, machines or processes than just Moldex3D into the new form of MPE service platform.CoreTech System, who has gained high reputation with its Moldex3D software, decided to proceed with various value-added services, such as "Azure Connect", MPE e-learning platform, and Material Hub Cloud (MHC), which are built upon Microsoft Azure cloud platform. The goal is to reduce the threshold for users to harness the techniques of molding analysis, while rapidly reinforcing the capacity of smart design and smart manufacturing.Azure Connect implemented to lower the threshold of simulation computingSpeaking of Moldex3D's cloud transition, David Hsu frankly shared that it occurred to him 10 years ago, but it did not work well with promotion as expected. Whether it is Moldex3D or other CAE software, the cloud journey was rugged. Customers not willing to upload the confidential information of their product design was the most challenging part.It was not until a few years ago that CoreTech System had seen a big turning point. That is to say, Microsoft Azure boasts the most complete cybersecurity and audit certification. The most thorough end-to-end security, covering from identity, encryption, network, SIEM to governance & monitoring across industries and regions, is now within reach for customers in a zero-trust structure. In addition, to play out a large number of CAE use scenarios in simulation, Azure HPC put forth the most cost-effective solution from computing and storage to network powered by the most advanced, optimized technologies. In particular, Microsoft Azure has global presence across more than 66 regions where they can respond to the market needs, fast and properly, from over 5,000 customers of CoreTech System around the world. In the meantime, Microsoft Azure's portfolio, from Azure Marketplace, pre-sales and post-sales technical support to go-to-market planning, has been honed and could be helpful for ISVs to expand their touch worldwide.Milestones of Azure HPC & AI platform about the investment in high performance computing. In 2021, A100 cluster was among the top 10 supercomputers in the world.To tap into the trend, CoreTech System brought forth Azure Connect, committed to carving out a niche of "one-click deployment" for customers to easily construct an environment to execute Moldex3D on Microsoft Azure. David Hsu categorized it as the "first-generation Azure Connect" where customers are asked to "bring your own license" (BYOL). Azure Connect is flexible, dynamic, and scalable in case the computing resources are not adequate during operation. Users may scale up for more CPUs, memory, disks and additional features; they may also scale out to increase the number of VM instances, having multiple machines to massively run parallel computing; they may even scale down to zero and pull out necessary OS Images for future rapid deployment when no resource is requested. Microsoft Azure enables customers to control their own data by introducing scalability as required for high performance computing.Though the "first-generation Azure Connect" puts remarkable benefits in the front of customers, it is restricted by the unscalable number of software license. To overcome the limitation and truly apply the asset-light model to the access to hardware and software, CoreTech System embarked on developing the "second-generation Azure Connect" which sets a license manager for Moldex3D on Microsoft Azure. The company plans to propose a prototype in the middle of the year and formally launch the service in the fourth quarter. After that, Azure Connect users will automatically receive additional pay-as-you-go licenses from the system if they need more, for example, 5 or 10 extra, once filing a request.Microsoft Azure as a critical accelerator to fulfill three development goalsDavid Hsu stated that CoreTech System has three development goals to march toward the future. In the first place, based on smart manufacturing, they would take advantage of digital twin to embed simulation computing into customers' design/ manufacturing process, from which more application values are generated. Secondly, CoreTech System will put a lot of effort in the application of semiconductor and electric vehicles, and take the initiative to seek for collaboration with more customers. He further explained that as the era of advanced 3 nm or 2 nm process is approaching, and the challenge against Moore's Law nearly comes to an end, semiconductor manufacturers are turning to package technology to prompt process innovation. They no longer build skyscrapers but establish many communities before they are packaged. Nevertheless, each community carries different component assembly which varies strikingly in properties. Heterogeneous integration could make scenarios complicated and result in issues, such as heat, interference, and deformation. Consequently, Moldex3D is brought into play here to simulate first. The dependence on it will certainly soar. Under the complex semiconductor processes, the need for IT infrastructure in CAE will also exponentially climb up. Azure HPC will work out more optimal solution to the complicated scenarios in heterogeneous integration and IC innovative package.The third focus is to "train AI with simulation data." The level of difficulty is the highest, so it is not possible to expect results in five years' time. Why does CoreTech System attach great importance to this? Because unlike commercial AI application, people are looking for far more accurate industrial AI in analysis. Nonetheless, acquiring engineering data is costly. The lack of an adequate amount of training data delays the development. Accordingly, it is inevitable that simulation data, coupled with real data, will be utilized for training. The lineups of Microsoft Azure Data Services, namely Azure Synapse Analytics, Azure Machine Learning, Azure Datalake, Azure Data Explorer, and Power BI, furnish customers with data analysis model and engine that are more flexible and on-demand. They will carry on the professional services in the realm of digital twin and AI, thriving together with CoreTech System.All in all, on CoreTech System's journey of pursuing the three goals, Microsoft Azure will play the role of critical accelerator to assist customers in producing a new form of synchronized, collaborative work flow. Moreover, the simulation capability of Moldex3D is incorporated into the flow. In this way, more participants can conduct optimized analysis very efficiently while stepping closer to the vision of smart manufacturing and IC package.Learn More*Probe into the solution to unlock your innovation through Azure's leading high-performance computing*[Free download of whitepaper] How Azure helps semiconductor industry grow and thrive*Explore and start your Azure journey

DEKRA and VicOne, a subsidiary dedicated to vehicle security established by a global cybersecurity leader Trend Micro Incorporated, announced their partnership in providing joint solutions for automotive suppliers to compliance with new international regulations and standards in vehicle security. With their technical know-how, knowledge and certification services, suppliers in the automotive supply chain who are eager to enter the industry of electric vehicles are in good hands so that they can implement and comply with international security standards more efficiently.Daniel Lee, General Manager of DEKRA Taiwan Product Testing Operations, stressed that as the technology of 5G and low-earth-orbit satellites have become mature, high-speed transmission and low latency have facilitated the rapid development of the applications of Internet of Vehicle. A growing number of smart in-vehicle auxiliary technologies and software has changed the landscape of automotive industry. Since the era of software-defined vehicles is approaching, industries in Taiwan are looking to bring their capabilities to the supply chain of smart vehicles and the Internet of Vehicle. Whether it is the design and hardware and software, deployment, or the production of associated parts and computers of the network, cybersecurity is inevitably a key challenge. Only when automotive players within the supply chain pay proactive attention to and intensify security-related regulations can the requirements from major international car brands be satisfied.Mr. Gerhard Rieger, Senior Vice President of DEKRA DIGITAL Global Functional Safety, said: "Global vehicle manufacturers are accelerating their digital transformation, and cyber security has also become a core requirement in the future automotive manufacturing and development process. Therefore, it is necessary to introduce internationally recognized standards and obtain certification to achieve a leading position in automotive cybersecurity." Kevin Huang, Manager of Global Functional Safety/ Cybersecurity, DEKRA Taiwan, in charge of this collaboration project, explained that ISO/SAE 21434 and UN ECE Regulation 155 have been regarded as the mainstream standards for automotive cybersecurity by European and American car manufacturers. However, suppliers are often uncertain about how they can incorporate these international regulations into their development process or meet the legal requirements for security in ISO 21434 and UN155. Therefore, VicOne comes into play, offering counseling and cybersecurity solutions to in-vehicle security. A one-stop integral solution has been devised, coupled with DEKRA's vehicle security certification services, to assist suppliers in implementing and complying with international security standards more efficiently, while lowering the cost of development and production."We've seen news of car companies experiencing cyberattacks to electric vehicles in recent years and it becomes the emerging challenge for the automotive industry." said Edward Tsai, Vice President of Strategic Partnership at VicOne. The new international automotive cybersecurity regulations has prompted global leading OEMs and suppliers to ensure the compliance as it acts as a vital factor to determine whether they are qualified to enter the market of electric vehicles. Edward said "Combining VicOne's expertise in automotive cybersecurity and DEKRA's abundant experiences in inspection and certification, makes us the best security partner of choice for automotive companies and suppliers"DEKRA is the most prominent motor vehicle inspection body in the world. It boasts the largest independent testing center in Europe for interconnection, intercommunication and autonomous driving. The scope of services covers the entire industry chain of the automotive industry, including testing and certification, certification of industry-related management systems, safety counselling, cybersecurity and functional safety. It built a global laboratory network that is driven by one-stop integrated solutions to either the most basic safety testing on materials, parts and components for cars or sophisticated testing and certification for electronic systems and cybersecurity. In addition, DEKRA also provides testing and international certification services for EMC, RF, 5G, DSRC, V2X, electricity safety, functional safety, and reliability verification.DEKRA collaborates with VicOne to create integrated services for vehicle cybersecurity certification

The rising demands of 5G smartphone, electrical vehicles and data centers drive semiconductor components rapid expansion. The industries increase the investments of advanced packaging technologies to response the trending multi-chip or multi-module packaging technologies. The IDMs, foundry and OSAT service providers increase the capital expenditure for development of wafer level packaging. Meanwhile, in the other hand, the PCB and panel makers are developing fan out panel level packaging (FOPLP) as a way to reduce the cost of advanced packaging. Therefore, on June 1st 2022, Manz AG hosts the "Advanced Packaging Technology Forum" in Sheraton Hsinchu Hotel. This forum explores process challenges of interconnect structure and further depicts the market trends of advanced packaging and multi-chip heterogeneous integration.Robert Lin, General Manager of Manz Asia, gives his opening lectures on this forum. He looks at the shortage of IC substrates and semiconductor components in automotive market globally. The solutions of FOPLP have gradually become a key area of focus of the industry in recent years. The heterogeneous integration is expecting to extend the Moore's Law for semiconductor industry. And the FOPLP is the prevailing technology in advanced package. Manz is incorporating with supply chain partners and material suppliers to make industry continuing its robust growth and having more prosperous together into the next decades.There are several welcome speeches by honored guests and co-host partners including Steven Lin, Taiwan Country Manager of NXP Taiwan, Miss Jo-Ann Su, Senior Director of SEMI and Mr. S. Y. Wang, Secretary General of TEEIA. The invited guests are highly regarding to Manz efforts to collaborate with supply chain partners and pioneer the development of FOPLP technologies.The optimistic semiconductor industry and national technological policy highlightsThe first lecture topic of Ray Yang, Consulting Director of ITRI/ISTI, he talks global market insights and Taiwan government funded scientific and technological development planning. Taiwan semiconductor industry have consecutive three years in double-digit growth since 2019. In 2022, the forecast of Taiwan semiconductor industry will generate the NT$ 4.3 trillion having 18% growth yearly. As counting the total production value of supply side vendors, Taiwan is sitting as the second place taking 20% market worldwide in semiconductor industry. America is number one again to take 39% global market share. Yang also shares the recent Samsung and Intel news for predicting the next move of the industry. He explains two major attractive technologies, which are advanced packaging and logic-memory-chip stacking technology.Additionally, talking about Taiwan government funded development planning, he highlights three major directions. The first, Angstan node process development, the second, GaN and SiC-based compound semiconductor chip development, and the third, AI on Chip or called edge AI development.Dr. M.H. Chan, R&D Manager of SPIL, shares with audience about the advanced packaging solutions to successfully integrate High Bandwidth Memory (HBM) chips. The solutions provide 2.5D, FO-EB, FOEB-T processes for 3D stacking IC, Embedded Bridge Die and Fan-out packaging technology. The current use cases for these solutions could support 1 GPU + 2 HMB dies or 1 GPU + 4 HMB dies in one packaging chip. The benefits for these processes include lower RC delay time, smaller dimension, shorten product development time, lower manufacturing cost and expanding the use of heterogeneous integration.The emerging opportunity of FOPLP applicationsDr. Eric Lee, Director of R&D at Manz, talks the topics focusing the business opportunity of FOPLP technology. He points out that FOPLP technology will be one of the emerging solutions for solving semiconductor chip shortage in the automotive industry. Apart from Foundry and OSAT service providers investing wafer level packaging technology by leveraging the higher end lithography tools and expensive equipment to lead the development roadmap, PCB and Panel makers takes different approaches to push FOPLP as the key driving force to solve the problems. Today, there are 95% investments coming to wafer level packaging market. But FOPLP will grasp the fast forwarding opportunity because high manufacturing capacity and cost advantage still becoming permanent competitive advantages.The current mainstream chips that use FOPLP for integration include AiP antenna modules of 5G smartphone, integrated chips of wearable devices and Internet of Things use cases. The current specification of line width and spacing (L/S) is ranging from 20/20 to 5/5 microns in FOPLP technologies. Due to the reality of high cost structure of higher end IC substrates and slower capacity ramping schedule, FOPLP technologies have strong potential for achieving the goals of miniaturized packaging and lowering costs while the yields rise. FOPLP will continuous gain in the market sectors of lower end SoC chips or middle end multi-chip heterogynous integration applications. The cost advantage of FOPLP will continue to drive the momentum to replace the lower or middle end market, although wafer level packaging increasing in adoption of high end sectors.Manz FOPLP production solutions are mainly focus on RDL (Re-Distribution Layer) technology. The wide area electroplating equipment produces fined line high density copper interconnection. The key technical challenges include uniformity of electroplating pattering, high resolution and high electrical connectivity. Therefore, the main focus of Manz total production solutions are Cu electroplating equipment and wet chemistry systems. Manz also integrates the process solutions form supply chain partners including sputtering and plasma cleaning systems. Furthermore, Manz provides the Total Fab Solutions from factory planning to production services. The current production design can be used for 600mm x 600mm surface areas. And in 2022, the production solution will extend to 700mm x 700mm areas. Besides the lower cost manufacturing and high performance, Manz has extensive experience in automation, material usage and environmental protection while simultaneously satisfying ESG objectives.Collaboration with supply chain partners to accelerate the adoption of FOPLPMr. P.C. Liu, Vice President of R&D at UVAT technology, talks the Ti-Cu seed layer in-line vacuum sputtering equipment in FOPLP production. The company provides the solutions to improve the production yields. The solutions implement dry etching and sputtering by plasma equipment to do the surface modification, roughening and cleaning to increase the stability of Ti-Cu seed layer formationDr. Tim Tsai, Customer account Technology Leader Taiwan of DuPont Taiwan, presents material development projects ranging from PCB to FOPLP industries. His main focus is material differentiation product strategy and process equipment vendors support. The material products are covering main categories including lamination, drilling, high performance dry films, which have better integration with Digital Imaging equipment and electroplating systems. One major thing, for better supporting FOPLP market, DuPont establishes integrated service site in Chungli factory including testing Laboratory, process development and simulation services. This massive investments will strongly support FOPLP supply chain partners to perceive better future for advanced packaging technology.Jack Huang, Vice President of E&R Engineering Co., gives his speech to introduce the laser drilling and plasma cleaning processes in WLCSP technologies. The company provides the drilling tiny holes in diameters down to 20 microns and further to 10 microns for proofing. The last session is on-line presentation by Miss Yik Yee Tan, senior Market Analyst of Yole Développement. The advanced packaging market is expected to grow from US$ 32 to 57 billion during 2021 to 2027. The CAPEX investments are mainly from Intel, Samsung, TSMC, ASE and several OSAT vendors including China top-3 back-end service providers. Among this emerging market and quick scaling development, the trends are toward to a prosperous development in coming years.Manz has been investing FOPLP RDL production equipment since 2016. The process verification and testing tasks are successfully applied in real-world applications with supporting key customers to prepare the sample devices. The roadmap is continuing to go to volume production and provide turnkey solutions in the future. Facing the diverse needs of the market, Manz will actively expand the reach of its Total Production Solutions to help customers in different fields construct high performance FOPLP production systems, seizing the opportunities with continuous innovation in advanced packaging applications.Robert Lin, General Manager of Manz Asia

The 5G industries are ramping up competition to drive innovation and diversify the global telecoms supply market. Surprisingly, in the fierce competition of recent years, Taiwan networking solution providers grab the benefits from market share gains, robust customer demand and a new wave of outsourcing from global telecoms. Revenue is expected to grow, supported by a price-friendly environment and a better product portfolio, wireless module makers play an important role behind the picture for driving the success of Taiwan networking supply chainsFounded in 1999, Fibocom is the first wireless modules provider listed in China Shenzhen Stock Exchange in 2017. The company invests the resources to provide series of wireless modules. The 5G product lines of the company have been applied in wide ranges of applications and received certificates of global telecoms. Another strength of Fibocom is the ability to control the cost to allow OEM/ODM customers to have a better chance to win the telecom bits. These cost advantages and power features have accelerated the market penetration rate of Taiwan networking equipment makers.Ronald Chan, General Manager of Taiwan IoT sales division, Fibocom, talks through this interview. Following its strong growth in the China market, Fibocom is aggressively expanding the business of mobile payment market. Especially in the category of Point of Sale systems, Fibocom takes a 45 to 50% worldwide market share.5G FWA CPE market success driving by cost and engineering effortsLeveraging the strong growth momentum of the Asia market, since 2014, Fibocom started to enter a strategic partnership and collaborate with Taiwan networking and telecommunication, notebooks and industrial PC industries. The product portfolio is ranging from various communication modules, as well as techniques related to industrial Internet of Things and M2M solutions. Chan points out, Fibocom provides one-stop services to build a tightly bound for mutual benefits by deeply investing in wireless technologies to maintain a long turn strength.Looking at the PC market, although consumer-grade notebooks have slower growth in 2022, there is still maintaining upbeat in the higher-end commercial notebook models. The entire PC market of Fibocom's business still enjoys a good result. Furthermore, through the collaboration of Intel and Mediatek targeting 5G Modem chips, there is a good future for notebook PC business outlooks. Fibocom has contributed the cost effective modules with excellent price performance ratios.Apart from the commercial notebook business, the international tenders and competitive bids of the global telecom market are another major sales growth engine of Fibocom. Talking about 5G FWA use cases for rural regions or countryside areas in North America, the end users pay fifty dollars to get a 5G CPE device to massively improve internet connection speed. To chase this opportunity, Taiwan networking solution providers have an aggressively move with the full support from Fibocom through the engineering efforts to pass the telecom's certification tests and refinery cost structure.Software and testing lab investments strengthening the future opportunitiesThe new emerging IC design vendors such as Mediatek have tried to change the development landscape of 5G wireless modules very hard. The 5G CPE devices leveraging SoC-based chips combined with software stacks to integrate wireless protocol including Wi-Fi, Bluetooth and other mainstreaming wireless connectivity with a cost-effective manner. It leads the cost structure of 5G FWA gateway very attractive with powerful features inside. This makes Taiwan networking manufacturers to win telecom competitive bids of North America. Apart from software support, Fibocom has also invested in building a Shielding Room in Taipei for 5G communication testing, providing strong support from both software and test labs to help Taiwan networking manufactures win international telecom bids. Adapting this cooperative experience, Fibocom continues to help Taiwan vendors to penetrate the market of many other countries.Compared with the success in the global telecom sectors, Industrial IoT (IIoT) market is a different story, said Chan. IIoT requires longer term engagement and steady steps in the market. The series of smart solutions including smart manufacturing, agriculture and medical provide the versatile but small quantity orders. The market is relying on engineering efforts and stronger support with prolonged product verification and approval sequence. Fibocom is gaining because of providing strong technical support to help Industrial PC vendors catching up the business opportunities.Chan talks about the current economic situation. The downturn directly affects the market segments driving by the pandemic-driven Work-From-Home (WFH) business. The radical spending is decreasing while the slow down or reversing economic growth. And the increasing inflation rates, it looks like another bad news to hit the market further. However, the global enterprises increase the investments for improving the energy efficiency and performance to reaching ESG goals by introducing smart applications.This will be a fundamentally boost to IIoT sectors. A new driving force implements multiple wireless technologies of Wi-Fi, BT, NB-IoT and Lora fast forwarding the data streams from IoT sensors to smart edge nodes. These trends have helped the IoT gateway devices to play a more active role as a data hub bridging the cloud servers through 4G/LTE and 5G technologies. Those are related to the devices or solutions with wireless modules. Backed by solid technical expertise, Fibocom looks at this new opportunity and is actively working with Taiwan industrial PC, networking and electronic manufacturing service providers to build Taiwan's competitiveness. Looking into the future of 5G construction, there is still room for continuous improvement. Fibocom accurately grasps the trend of 5G commercialization, insists on promoting digital transformation to unlock the full potential of the future IoT business.Apart from software support, Fibocom has also invested in building a Shielding Room in Taipei for 5G communication testing, providing strong support from both software and test labs to help Taiwan networking manufactures win international telecom bids.

STREAM education is a novel educational concept of a new generation, combining science, technology, reading and writing, engineering, arts and mathematics. It brings inspiration and invention to help students improve their practical problem-solving skills. As this new trend of education will have a great influence on national competitiveness in the future, it is playing an important role in worldwide educational policies.HOLTEK Semiconductor (HOLTEK) uses microcontroller technology along with product creativity to promote STREAM educational products:1. HOLTEK has launched 32-bit music synthesis MCUs of a new generation: HT32F61355, HT32F61356 and HT32F61357.2. HOLTEK has developed an Audio Workshop, an audio development platform, to assist customers to build diversified and interdisciplinary educational products efficiently.3. HOLTEK provides a variety of Music STREAM creative musical instruments and smart toy application solutions.HOLTEK launches a range of Music STREAM creative musical instruments and smart toy solutionsPhoto: HOLTEKA new generation of 32-bit music synthesis MCUBased on the Arm Cortex -M0+ core, these are high-performance, low-power 32-bit microcontrollers. The devices have a maximum operating frequency of 48 MHz with memory capacity of 128KB ROM, 16KB RAM and 32Mbit~128Mbit of Data Flash. In addition, these devices offer a wide range of peripherals and communication interfaces. Fully equipped with an internal of 32-channel MIDI music engine, these devices can simultaneously operate the function of 32-channel wavetable synthesis and meanwhile provide stereophonic outputs. The data waveforms synthesized by the wavetable, such as musical instrument timbres, MIDI music melodies, voice, sound effects, etc., can all be directly stored in the internal data memory. This then can be used in the development of electronic organs, digital pianos, electronic drums, electric guitars, electronic accordions as well as other musical products, even can be used in Acoustic Vehicle Alerting System (AVAS) for electric vehicles.Audio development platform (Audio Workshop)The devices of HT32F6135x series are equipped with a powerful computing engine. When used together with the exclusive audio development platform, the Audio Workshop, these devices can implement pre-release evaluation and post-development design. This will offer enhanced editing and configuring music rapidly, same to voice, sound effects, sentences and other audio content. The Audio Workshop has multiple functions such as optimized editing, switching of customers' own unique timbres, ADSR parameter adjustment, real-time update of timbre parameters and simulated sound effects, etc. The use can also be expanded with various sensors and functional modules, allowing developers to quickly develop related voice, music, smart toys as well as many other audio products.Creative Music STREAM demonstration products and solutionsHOLTEK has integrated both Music and STREAM to launch various application solutions of creative products.7 creative instrument solutions:Sophisticated lighting effect products can be thus created, such as "illuminated electronic drums" and "electronic strike pad" percussion instruments as well as "gesture controlled drum" percussion instruments. Moreover, there are simulated traditional musical instruments with interactive lighting, "electronic wind instruments" and "weighted key electronic pianos". These parts can be divided and joined to form "combination instruments" to implement a band ensemble. All electronic musical instruments can be directly played through "MIDI speakers", which can be matched with an App for intelligent teaching and enhanced playability, thus lowering beginners' learning threshold.5 smart toy solutions:Products such as "RGB full-colour combination light boards", "building block creative toys" and "colourful caterpillars" are platform products that include sound and light to create creative products for children. "humanoid robots" with integrated multiple sensors are high-end intelligent interactive experiential products which can be freely separated and spliced and combined into various shapes, when used with an App for graphical programming. "RGB screen card music early education machines" can read teaching cards, with mini games to integrate both educational activities and games.1 solution of infant care:A "smart cradle" can swing automatically. As combined with soothing music, it assists infants to fall asleep more comfortably and peacefully. It has a foot piano module for audio interaction as well as intelligent weighing and temperature measurement functions. With the App management and functions of cloud data recording, parents can be eased of the worry and pressure of parenting babies.STREAM education focuses on interdisciplinary applications with an emphasis on the cultivation of creativity and improving the quality of students' study. Here HOLTEK provides one-stop Music STREAM solutions and demonstration products, allowing customers to promote STREAM education in the simplest and most efficient way. For anyone interested in such applications, please contact our sales teams for more information on potential business opportunities.

In the wake of the continuous advancement of semiconductor manufacturing processes, sensing technology has been popularized, which empowers the rise of many new technologies and drives the demand for sensors. According to Yole Developpement, aside from mobile applications, the emergence of other application demands has been seen, such as automotive, healthcare and security. The development is expected to drive the continuous growth of the CIS market in the future, and the global market size is even anticipated to expand to US$31.5 billion in 2026.Status of CMOS Image Sensor Industry 2021 report. Yole Developpement, 2021ASM Pacific Technology (ASMPT) Assistant Vice President — CIS, Benny Au points out that the rapid development of smartphone design from single-camera to multi-camera indicates the assembly technologies of major CIS cameras are progressively becoming mature. ASMPT has long been optimistic that the application of CIS is a key factor leading the world to an intellectualized future and therefore, we have been utilizing the advantages and experience of the smartphone camera market to accelerate the development of CIS in different fields. Today, we have successfully set foot in the two major fields - automated driving systems and the Metaverse.ASM Pacific Technology Assistant Vice President — CIS, Benny AuOne of ASMPT's observations is that consumers have ever-changing expectations for automobiles. Vehicles are no longer just a means of transportation and overall driving safety needs to be ensured with the incorporation of intelligentization and safety technologies. Therefore, major automobile manufacturers are advancing the use of technologies like AI and machine learning to build a brand-new possibility of smart mobility. Regulations, clarification of responsibilities, and safety guidelines, however, are the biggest challenges for the development of autonomous vehicles. In addition, different markets and countries have different views on the technology and thus, we will continue to keep a close eye on the changes and trends in different markets in order to provide the products in demand.Camera quality plays a vital role in driving safetyAutonomous vehicles are highly anticipated by consumers on account of the ability to actively detect changes in the surrounding environment of the vehicle through camera lenses and sensor technologies, such as LiDAR, millimeter-wave radars, and ultrasonic radars. Other than reporting abnormal conditions, the connected mechanism including accelerating, steering and braking will also provide car owners with assistance to cope with emergencies as well as ensure driving safety.Although the aforementioned sensor technology is progressing significantly, camera is capable of capturing the actual state of the surrounding environment directly, allowing car owners to comprehend the surrounding situation accurately when driving. Cameras, therefore, play a crucial part in driving safety.ASMPT believes that the image processing capability and back-end algorithm of the system are not the only criteria for assessing autonomous vehicles' ability to detect the surrounding environment. On the other hand, cameras' ability to capture high-quality images carries much more weight. Different from the camera requirements of consumer electronics, automotive cameras involve road safety and even personal safety. Therefore, the majority of automobile manufacturers have extremely strict quality requirements for camera products. They will even formulate purchasing standards for the cameras according to the characteristics of their own automated driving systems and algorithms."As the market demand for cameras has increased remarkably, the competition between camera module suppliers has also become fierce. Many industry players have gone down the path of price competition. This way, the focus of camera assembly has switched from quality to cost, bringing uncertainty to the safety of autonomous vehicles," Benny Au explains. "In contrast, we pay full attention to product quality. Apart from purchasing high-precision manufacturing equipment, we have also established a holistic set of precision monitoring mechanisms in the production line. In this way, manufacturers are empowered to take full control of the entire process of the camera assembly and to advance the quality and precision of the entire production line, all for the high-quality cameras that meet the needs of autonomous vehicles."Aiming to improve the quality of camera assembly, ASMPT has also acquired the world-leading active camera module assembly factory, meeting the mass production needs of major European and American clients as well as accelerating the development of new products. The acquisition will further put our business philosophy of high performance, high productivity, high assembly precision and stability into practice, ensuring the delivery of the highest quality products for our clients.Heated topic of Metaverse sparks demands for camera lensesOther than autonomous vehicles, the Metaverse that can draw consumers and enterprises all the way into a massive virtual world has been another hot topic recently, and it is anticipated to bring significant changes to the electronic product supply chain. Although there is no complete definition of the Metaverse by research institutions, it has already attracted a wide range of companies to expand their investment in the field. Even Facebook has changed its name to Meta to declare its determination to play a part in the Metaverse. In the next few years, the world is expected to step into the new era of the Metaverse.The world is expected to step into the new era of the Metaverse. ASMPTAs the key path to the Metaverse, VR/AR devices can provide immersive human-computer interaction, and more related applications are also seen on the market. The market demand for cameras, therefore, is soaring. It is estimated that the total addressable mark, TAM (Total addressable market) of the camera for VR/AR applications will increase from US$120 million in 2021 to more than 10 times in 2025, and then rocket to US$ 4.6 billion in 2030.Benny Au mentions that the camera lens of VR/AR equipment is mainly for simultaneous localization and mapping as well as pass-through viewing. Under the Metaverse trend, it is believed that RGB cameras will gradually replace grayscale cameras to enhance the interaction with the surrounding environment. Also, the camera lens used to capture eye movement is capable of improving the accuracy and precision of tracking position and gesture. On top of it, when combined with depth-sensing technology, the interaction between computers, humans, and the environment for mixed reality will be further accelerated.In response to the latest trends including autonomous vehicle systems and the Metaverse, ASMPT will put its competence in mobile cameras to good use, and continue to explore the high-quality cameras market. By enhancing our own R&D capabilities and participating in pre-development work, ASMPT is confident to provide different industry players with the best solutions to sharpen their competitive edge in the market.

A single-board computer (SBC) incorporates microprocessors, memory, and input/output (I/O), among other features on a single circuit board. It provides industrial control or commercial IoT developers with a straightforward mode that simplifies the process and reduces the high costs of developing their own hardware, thereby accelerating time-to-market. Currently, SBCs are generally mature, powerful, and easy to use. SBCs can help industrial/commercial end customers and system integrators to quickly create products for various applications.In recent years, market acceptance of ARM-based SBCs has risen. According to Abbey Chen, Product Manager of ASUS Tinker Board, this is mainly due to improved performance and lower power demand. Moreover, ARM processors are not only used for mobile or embedded applications in the industrial control and commercial markets; nowadays, ARM usage has entered new areas such as PCs, high-performance computing, deep learning, and more. Abbey Chen said that the ASUS Tinker Board is equipped with the latest, most powerful quad-core ARM-based processor, which provides "best in class" performance.The ASUS Tinker Board is one of the most popular products in the ARM-based SBC market. An exploration of the reasons behind its success showed that its first advantage is its supply cycle of more than 5 years. Thanks to this, developers can stop worrying about default risks due to delayed deliveries or having to switch to alternative materials. To avoid these issues, ASUS provides a long-term and stable supply, so that developers can avoid the high costs of manpower and materials required for the development and verification processes of introducing new SBCs due to supply shortages.It is worth mentioning that in the past two years, the global parts shortage has continued to worsen, which highlights the advantages of Tinker Board. ASUS has a close relationship with its parts suppliers, and has thus been able to establish a stable source of parts to ensure that the Tinker Board supply will not be affected.Second, ASUS is one of the few SBC suppliers who are familiar with the underlying architecture of Android and can provide strong technical support for it. Most application developers are proficient in the development of high-level Android apps, but not necessarily in how to adjust the app based on the SBC hardware functions or the underlying architecture of the operating system. Thus, SBC manufacturers need to provide customized development or optimization services; this is one of ASUS' strengths. In particular, ASUS provides dedicated on-site technical support engineers for each customer to offer nearby support. This can shorten the customer's development cycle and accelerate application deployment. Thus, this service is well received by customers.eMMC on Board: Better Reliability and PerformanceSince its launch in 2017, Tinker Board has produced a large number of IoT application cases. For example, many retailers use Tinker Board-based digital billboards because they take the quality of advertisement playback and display stability very seriously, and Tinker Board eMMC on Board design's provides higher reliability. Moreover, Tinker Board is also widely used in smart cities, smart hospitals, and smart factories. Applications include digital billboards for bus stops, outpatient check-in machines in hospitals, and IoT gateway applications such as tracking for smart warehouses and renewable energy storage monitoring, etc.Most system integration partners in the aforementioned vertical application fields tend to give priority to Tinker Board, due to several factors. Abbey Chen said, first of all, most development board suppliers provide technical consulting services through online forums, which force customers to disclose development details online. On the other hand, concerns about information leaks are eliminated with Tinker Board's dedicated FAE service.Second, Tinker Board not only supports Linux (Debian), it also supports Android, which is not supported by many SBC suppliers. Customers have more options to choose from and can create the most suitable operating environment according to their application requirements or programming habits.Moreover, Tinker Board is one of the very few SBCs with an eMMC memory soldered directly onto the board. Therefore, customers can install the operating system on the eMMC instead of the Micro SD memory card to eliminate the risk of poor slot contact. In addition, the on-board eMMC was found to be able to withstand more than 3,000 write/erase cycles after testing, far exceeding the 300 to 500 of a Micro SD slot, and with better reliability. The on-Board eMMC also features superior write and read performance, which are 6% and 32% higher than that of Micro SD cards, respectively.Powerful CPU/GPU Performance Advantages and Detailed User ResourcesMore importantly, ASUS has strictly selected and configured relatively high-quality SoCs to ensure Tinker Board's outstanding performance. The CPU performance of the first Tinker Board, which was born five years ago, is still comparable to the latest competing products of today.How does the CPU performance of the latest Tinker Board 2 (ARMv8 6-core SoC based) compare with competing products? The technical editing team of DIGITIMES conducted a test using the Geekbench 5 benchmark. The results showed that Tinker Board 2 has a CPU speed of 298Mbps and 806Mbps under different single-core and multi-core conditions, which are 1.5 and 1.35 times higher than those of competing products, respectively. Then, the team used the glmark2 benchmarking software and ran a test under the same visual computing load. The results showed that the GPU speed of Tinker Board 2 is 787 Mbps, which is 73% higher than the 456 Mbps of competing products.In terms of memory performance, although both Tinker Board 2 and major competitors use LPDDR4, Tinker Board 2 adopts a dual-channel design, which is different from the single-channel design of competing products. This design gives Tinker Board 2 superior memory access performance, surpassing competing products by 74%.Regarding the 802.11ac Wi-Fi connection speed, Tinker Board 2 relies on a 2x2 dual-band 2.4/5 GHz design foundation, which is different from the 1x1 single-band architecture of competing products. Thus, Tinker Board 2 has a throughput of up to 618 Mbps, which is 7.3 times higher than the 74.5 Mbps of competing products.In addition to the aforementioned advantages such as stable supply, complete technical support from FAEs, and outstanding performance, Tinker Board also has many other features that add to its value. For example, ASUS created the Tinker Board forum, shared the open source code on GitHub, and provided a comprehensive User Guide and Developer Guide to help users who don't have a software engineer background install the OS and adjust the boot settings; in addition, ASUS assisted people with an R&D background in building their own Android or Debian operating environment and convert the preset GPIO to I2C, UART or I2S as needed.Furthermore, developers can manage Tinker Board with the ASUS IoT Cloud Console (AICC) for more efficient operations and maintenance. For example, administrators can connect to the AICC via a computer or mobile phone anytime, anywhere to check the status of Tinker Board, as well as the sensor data connected to Tinker Board; they can also control Tinker Board through remote commands. Essentially, developers can easily access the rich functions Tinker Board provides to quickly turn ideas into reality.It is worth mentioning that in the past two years, the global parts shortage has continued to worsen, which highlights the advantages of Tinker Board. ASUS has a close relationship with its parts suppliers, and has thus been able to establish a stable source of parts to ensure that the Tinker Board supply will not be affected.An Arm-based Single Board Computer (SBC), with Arm technology with highly efficient Cortex-A processor, offers enhanced computing performance with low power consumption.

MEAN WELL is a global leading standard power supply manufacturer. Since its establishment in 1982, MEAN WELL has launched more than 10,000 power supply products. Its diverse and comprehensive product range fully satisfies the power supply needs of customers around the world. However, some customers require products that can be integrated with existing ones, and that offer smart control integration capabilities. System planning for smart control functions is difficult, so customers must rely on the technical capabilities of manufacturers. To solve this problem, MEAN WELL recently released the 3+N System Solutions, which is the first wave of solutions that focuses on the DALI digital lighting system.MEAN WELL Introduces the 3+N System Solutions the First Focusing on Smart Lighting Control.Photo: MEAN WELLThe "3" in 3+N System Solutions refers to the rack power supply, modular power supply, and system power supply; while the "N" stands for other MEAN WELL products and controllers. Under the 3+N solution framework, MEAN WELL combined a set of system solutions according to customer needs to provide the corresponding power supply combinations. Tony Hsieh, Section Manager of MEAN WELL's Technical Service Center, said that "MEAN WELL is like an amoeba that can meet customer needs by changing and adapting its product mix."Different from the "you place an order, I fulfill it" model of selling products, when selling the 3+N System Solutions, MEAN WELL's sales and technical teams must first understand what customers really need before "prescribing the right medicine." Since MEAN WELL has established a complete global distribution system, it is able to provide consulting services to customers all over the world.Three Smart Lighting Control Solutions: IoT, DALI, and KNXMEAN WELL first promoted the 3+N System Solutions for smart LED lighting applications and released solutions for IoT lighting control, DALI lighting control, and KNX building automation, covering most of the current needs for LED lighting.Among these, the IoT lighting control solution is suitable for small spaces. MEAN WELL uses Bluetooth Low Energy, allowing users to change settings and control light switches and dimmers wirelessly via an app on a mobile phone or tablet. MEAN WELL partnered with world-renowned manufacturers like Casambi, Tuya, and SILVAIR to design various LED drivers for wireless lighting control, which are suitable for the constant current control, LCM-IOT series for lamps, and the constant voltage control, PWM-IOT series for light strips.DALI is a widely used communication protocol of digital lighting applications for buildings in Europe. It is suitable for communication between lighting control devices, and it makes lighting control easier to set up and reduces the need for rewiring. Rex Lin, Product Manager of MEAN WELL's Product Strategy Center, explained, "The DALI Alliance continues to add new lighting control functions to the protocol, and MEAN WELL has quickly launched corresponding solutions. Now, we not only provide DALI-2 driver power supply products, we have also released DALI-2 DLC-02 digital controllers that comply with the latest specifications."Digital Lighting Controller-DLC-02 for office lighting applicationPhoto: MEAN WELLThe DALI-2 digital control system is mainly composed of three parts: bus, control device, and control gear. The control device includes an input device and an application controller. MEAN WELL launched a DLC-02 controller that complies with the latest DALI-2 IEC 62386-103 Standard. It has two built-in independent DALI power supplies (each set can provide 250mA of current), so it can serve as a bus power supply and an application controller in DALI systems. By integrating an input device and control gear, we can build a complete DALI digital lighting control system.KNX is also a common control system in Europe. Unlike DALI, the scope of KNX control extends from lighting to the entire building since it can connect various electrical control systems together. MEAN WELL also launched KNX-related products that comply with international standards, including KNX LED power supplies, gateways, and actuators. Depending on the application, these products can be used with various MEAN WELL products.Taipei 101 Boutique Watch Store Deploys a Digital Lighting SystemThe 3+N System Solutions have received positive feedback since their launch, with many successful cases. The watch store in Taipei 101 adopted the DALI-2 DLC-02 controller solution as suggested by the MEAN WELL team. To help the customer with its lighting needs for different scenarios, the MEAN WELL team suggested the best digital control solution based on the customer's application and scenario requirements, and paired it flexibly with the customer's lights. Rex Lin pointed out, "For different groups and applications, we use lights with different wattage and optical angles. It is not always possible to find a digital lighting controller that meets these needs. MEAN WELL's DALI-2 DLC-02 can utilize the advantages of digital lighting to configure groups and lighting scenarios of lights on the same circuit, offering customers greater flexibility. In addition, when combined with the latest DALI-2 DT8 variable color application, both general groups and scenario applications are available for the same lighting controller, with color change applications. Thanks to this, the customer was able to adjust the background color of store displays to match the theme of its luxury watches, achieving the best mood lighting effect."Demo Kit Suitcase: Helping Customers Quickly Understand MEAN WELL's SolutionsTo help distributors explain the 3+N smart lighting solution to customers, MEAN WELL designed IoT, DALI, and KNX 3+N solution demo kit cases. For the DLC-02 DALI-2 controller solution, for example, MEAN WELL integrated the DLC 02 controller with two digital dimmable LED drivers, LCM (constant current output) and PWM (constant voltage output), and built-in lights in a carrying case. This demo kit can also be connected to other lights.Furthermore, MEAN WELL's Virtual Expo Technical Service Hall also provides introductions and success cases of the 3+N System Solutions to help customers quickly become familiar with the solutions. For the 3+N System Solutions, MEAN WELL will launch solutions for other applications in the future. Eris Wu, Head of MEAN WELL's Global Technical Service Center, said, "In response to the global trends of net zero and carbon neutrality, MEAN WELL will launch 3+N energy conservation and green energy solutions to help customers overcome multiple challenges."

Wintel, a partnership between Intel and Microsoft, has been strongly driving the development of PCs and NBs. Recent years, digital transformation has been one of the key elements in manufacturing industry remarkably edging toward intelligentization. The two prominent companies also work hands in hands to navigate their services through edge computing, visual recognition, and Artificial Intelligence + Internet of Things (AI + IoT). Synnex Technology International Corporation invited Intel, Microsoft, and many leading technology companies to join 2022 Taiwan AI EXPO and hosted "When AI enables mass production – Future Manufacturing Summit for Successful People."Lien-Ren Hsueh, General Manager of Synnex Component Business, Synnex Group, believed that in the rapidly changing industry environment, the manufacturing industry has to strengthen the resilience of their organization to address distinct challenges. Experts in different areas dissect the AI development trends in the manufacturing field in the hope of entering a new era of smart manufacturing with collective wisdom.I-Fen Lin, Deputy General Manager of Synnex Component Business, Synnex Group, pointed out in his opening remarks that digital transformation has become an essential lesson for businesses to remain unbeaten against market challenges, such as complex production equipment and strenuous effort to integrate heterogeneous systems. Transformation would be more seamless if professional support is in place from close partners. Synnex has worked with Microsoft recently to assist several manufacturers in deploying smart systems and empowering both production lines and employees.IoT covers a considerably wide range of aspects. That is why software systems, hardware platforms and expertise should come into play simultaneously with a view to devising a new-generation manufacturing structure that tailors to clients' requirements. As a result, Intel has been actively establishing a complete industry ecosystem and deepening partnership in recent years. In addition to extending the collaboration with Microsoft that has continued for years, Intel framed the concept of Intel IoT Solution Aggregator where Synnex plays a major role. Synnex and Intel brought Market Ready Solutions (MRS) and IoT RFP Ready Kits (RRK) for industry players to swiftly accomplish the most purpose-built IoT specific to their needs.Crystal Yin, Microsoft IoT Partner Ecosystem, Director of Asia Sales, expressed that Intel, professional and experienced, is also one of the key factors in successful digital transformation. With years of presence in the manufacturing industry, Microsoft has everything in its product portfolio, from data capture from front-line equipment and communication and transmission of the network layer to data analysis in the top layer. Microsoft carries on the collaboration with Intel, supporting the integration of intelligent edge and intelligent cloud conned by AI + IoT. The purpose is to foster system upgrades and the construction of a smart solution that delivers diverse functions and immensely high information security for manufacturers. Together with partners in IoT ecosystem, we achieve more!Metaverse has been firing on all cylinders, while the technology of digital twin has attracted great attention. Kuo-Pin Kao, Technical Director of Otsuka Information Technology, gave a speech on Otsuka Intelligence – Interaction between Digital Twins and AI Inspection Mapping to introduce the values that this technology attaches on the manufacturing industry. He stated that the company adopts Microsoft HoloLens Mixed Reality AR smart wearable devices and Azure Digital Twins to design an AI smart integration solution that bolsters the establishment of a factory IoT system and intelligent inspection model. Therefore, onsite personnel are able to precisely carry out works, for example, system inspection or equipment maintenance. In this way, manufacturers could have a clear and timely picture of the operation status to prevent unexpected downtime and further increase capacity utilization.Han-Lu Fan, Business Development Manager for Taiwan, DataMesh, also believed that metaverse at business level will act as a novel power of industry innovation and be primarily built upon the technical foundation of XR and digital twin. She provided an overview about DataMesh in the first place. The company is a global partner of Microsoft in the realm of XR as well as forming a closed-loop working relationship with XR leaders, including Qualcomm and NTT Docomo, from product research and development to selling in the industry. Businesses are well served with the fundamentals of an industrial metaverse by DataMesh, which can be applied to CAD, BIM and IoT and knowledge base to develop digital twin. Businesses then make the most of their know-how to bridge the digital world and reality. By empowering industries, such as manufacturing, architecture, and operation and maintenance with XR techniques, front-line personnel management and execution capabilities can be improved. DataMesh specially indicated that it is the digitalization of cumulative experiences that keeps businesses not only motivated to invest in innovation technologies but also competitive at its core.Image recognition carries weight in the field of smart manufacturing. Hong-Pei Lin, General Manager of YUAN High-Tech Development, mentioned that as the world-renowned video capture module provider, the company has accumulated an abundance of expertise and experiences. Recently, it launched a smart image processing platform equipped with NVR and AI image recognition to respond to scenarios of video capture, recording, streaming, and image analysis in a smart factory. The first 8-channel product of its kind processes image in real time and supports different formats of video or audio input signals. It shows more flexibility as it is intended for system build across both Windows and Linux that helps manufacturers optimize the overall signal processing of image and audio.ADLINK, specializing in industrial PCs, has been committed to the manufacturing industry for years. Manufacturers at home and abroad have benefited from ADLINK's products designed for edge computing and realized their vision of smart manufacturing. Yan-Ting Shen, Product Manager of Open Instrument Business Center, IoT Solutions & Technology Office, took their MCM solutions for example. MCM-100 in the series is embedded with I/O which is highly scalable to capture data from the equipment in a field. By contrast, MCM-200 I/O module with lower power consumption is a better fit for rapid deployment to detect the temperature and current of the equipment on site. ADLINK have seen successful use cases with their MCM solutions in various manufacturing areas, namely petrochemical industry and semiconductor fabrication. Their product performance and quality of services have received notable recognition in the market.In the end of the summit, I-Fen Lin shared that AI could be a valuable aid to shaping the thinking on data decision and enriching market insights, but AI implementation requires thoroughly professional capabilities. Hence, he suggested that manufacturers seek collaboration with partners from varied areas so that they can leverage the collective wisdom to contribute to diverse values for their business.Synnex invited Intel, Microsoft, and many leading technology companies to join 2022 Taiwan AI EXPO and hosted "When AI enables mass production – Future Manufacturing Summit for Successful People.

COMPUTEX 2022 is set to kick off starting from May 24, the world-leading brand in gaming, content creation, and business & productivity, MSI, attends 2 online exhibitions: COMPUTEX DigitalGo and COMPUTEX CYBERWORLD to showcase its new lineup of laptops, graphic cards, AIO and gaming peripherals, of which feature its maximum-beast Titan GT77 laptop, the most powerful graphics card GeForce RTXTM 3090 Ti SUPRIM X 24G and others, dedicated to making high-performance computing accessible to everyone.At COMPUTEX 2022, MSI stood out from the major brand competitors, winnig total 4 Best Choice Awards. MSI Titan GT77 Gaming Laptop wins "Golden Award"; MSI GeForce RTX 3090 Ti SUPRIM X 24G Graphics Card, MSI Modern MD272 Series Business Monitor, and MSI AMR-AI-PJ-UVGI Robot all receive "Category Awards"."We are proud to announce Titan GT77, the double winner of COMPUTEX 2022 Best Choice Golden Award and red dot 2022, along with other award-winning products that manifest MSI's continuous innovation and dominance in gaming, content creation, and business & productivity lineups on a global scale, " says Sam Chern, MSI Marketing Vice President.After the star-studded tech bonanza, MSI will launch a virtual event: MSIology: Ahead of the Curve, showcasing the latest 12th Gen Intel HX CPU Gaming and Creator laptops on June 7 at 01:00 A.M. Taipei Time. Made for gamers and creators, the new series presents uncompromising performance and more. Stay tuned!Here are eye-catching products MSI has to offer:Titan GT77 gaming laptopWinner of 2022 COMPUTEX Best Choice Golden Award and red dot, the flagship Titan GT77 features a perfect gaming desktop replacement that truly lives up to the name. The triumphant return of Titan GT77 unleashes the next level of performance, cooling as well as stunning features.Check out MSIology: Ahead of the Curve for more details.MAG Trident S 5M gaming desktopThe MAG Trident S 5M is a desktop dedicated to the cloud and mobile gaming. Unlike the traditional gaming desktop, MAG Trident S 5M is your best choice for a living room gaming PC. All gamers have to do is to activate MSI APP Player via the MSI's exclusive Game Stadium software, plus a 30-day free XBOX GAME PASS ULTIMATE, you're ready to sit on your couch and enjoy your favorite games with just one joystick. Furthermore, you can easily access cloud games and other entertainment software.GeForce RTX 3090 Ti SUPRIM X 24G graphics cardBased on the GeForce RTX 3090 Ti, the SUPRIM cards are crafted for performance, efficiency, and prestige. Cooled with MSI's TRI FROZR 2S system, heat is effectively dissipated from critical board components with TORX FAN 4.0, up to 8 Core Pipes, Airflow Control fins, and a copper base plate.GeForce RTX 3090 Ti GAMING X TRIO 24G graphics cardThe latest iteration of MSI's iconic GAMING series once again shows performance, low-noise efficiency, and aesthetics that hardcore gamers have recognized and trusted. Highlighting the excellent TRI FROZR 2 cooling system, making it possible to tame the power consumption of the beastly GeForce RTXTM 3090 Ti.Modern MD272 Series MonitorThe 2022 Best Choice Award & 2021 Red Dot Design Award Winner, the Modern MD272 series brings eye care & ergonomic environment for all users. With the Less Blue Light PRO and Anti-flicker technology, this monitor protects your eyes while maintaining vibrant colors.Modern AM242 & AM272 All-in-One PCFeaturing the MSI Cloud Center software, Modern AM242 and AM272 series AIO PC bring you a private cloud and help back up your files between the Android and IOS mobile devices and this series of AIO PCs. Just one click and MSI Cloud Center will automatically backup all of your photos and videos to the designated space within a secure intranet environment.VIGOR GK71 SONIC gaming keyboardThe VIGOR GK71 SONIC is an esports-focused keyboard, stressing the world's lightest linear mechanical switches, MSI SONIC RED, co-developed by MSI and the professional switch maker, Kailh. Underlining its 35gf actuation force and a linear smooth feel for each keystroke, MSI's proprietary switches offer seamless and instantaneous responses thus helping finger fatigue, bringing more comfort, and improving the ergonomics of your posture during gaming sessions.SPATIUM M480 PCIe 4.0 NVMe M.2 2TB PLAY SSDPacked with high-quality, high-density 3D NAND flash memory and compliance with PCIe 4.0, the SPATIUM M480 2TB PLAY SSD is capable of delivering read speed up to 7000MB/s. The sleek dual finish aluminum heatsink makes it a perfect match for storing PS5 games.RadiX AXE6600 WiFi 6E TRI-BAND GAMING ROUTERThe RadiX AXE6600 WiFi 6E tri-band gaming router sports the latest WiFi technology to handle numerous bandwidth-intensive WiFi devices in a variety of home environments. The 7 high-speed channels on a low-interference frequency band ensure incredible network performance with low latency for all connected devices including next-gen AR/VR home entertainment.MSI @ COMPUTEX 2022 OnlineCOMPUTEX DigitalGoDate: Tuesday, May 24 - Monday, June 06Time: 10:00 AM - 10:00 PM (GMT +08:00)Location: MSI@COMPUTEX DigitalGoCOMPUTEX CYBERWORLDStarts now and 24/7Location: MSI@COMPUTEX CYBERWORLDMSIology: Ahead of the CurveDate & Time: June 7, 01:00 AM TAIPEI (GMT +08:00)June 6, 10:00 AM LOS ANGELES (GMT -07:00)June 6, 06:00 PM LONDON (GMT +01:00)Location: MSI YouTubeThe 2022 Best Choice Award and 2021 Red Dot Design Award Winner, the Modern MD272 series brings eye care and ergonomic environment for all users.Photo: MSIGeForce RTX 3090 Ti SUPRIM X 24G.Photo: MSI