In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply committed to developing high-reliability packaging equipment for power devices and modules. Over the past five years, the company's formic acid vacuum reflow oven has gained widespread acclaim from leading international IDMs and the world's largest OSATs. Its remarkable advantages—including low void rates, flux-free soldering, and post-solder cleaning-free processes—effectively resolve metal oxidation issues, establishing 3S as a leading brand for high-end power module reflow packaging.From data to prediction: AI empowers equipment3S Silicon Tech's core technology utilizes AI to build process behavior models, enabling equipment to learn from data, predict, and self-optimize. Through machine learning (ML), the system analyzes vast amounts of data from sources like MES, sales, and SQL databases to identify key process variables.This allows the equipment to learn from past experience and provide precise parameter recommendations, leading to:1. Precise process tuning: The AI model recommends optimal parameters for different product types, ensuring perfect soldering every time. For example, baseline models for heating elements in various temperature zones are established before the equipment leaves the factory. By continuously monitoring the heating elements, the AI uses predictive analysis to issue early warnings before a malfunction occurs, ensuring process stability, preventing unexpected downtime, and even predicting the lifespan of the heating element.2. Yield and quality optimization: AI analysis quantifies the interactive relationships between different parameters and variables. Using a correlation matrix model, it provides optimal parameter recommendations for power modules, effectively boosting yield and product reliability.3. Precise predictive profiling: This technology effectively prevents up to 99.99% of equipment failures, optimizing production efficiency, reducing downtime, and significantly lowering maintenance costs.Green sustainability: Achieving flux-free solderingBeyond intelligence, this new launch also emphasizes sustainability. 3S Silicon Tech's AI-empowered formic acid vacuum reflow oven features a unique flux-free soldering capability. This not only enables a clean and highly reliable soldering process without the need for post-solder cleaning, but also reduces waste by up to 99%, providing a dual benefit of environmental protection and cost control for businesses.3S Silicon Tech sincerely invites you to SEMICON Taiwan 20253S Silicon Tech's AI-empowered formic acid reflow oven offers semiconductor manufacturers a highly efficient and easily implementable solution. This technology is specifically designed to address customers' void rate concerns, clearly demonstrating the immense application value of AI in semiconductor manufacturing. It further helps companies achieve a comprehensive upgrade in yield stability, predictive analysis, and maintenance optimization.3S Silicon Tech cordially invites all industry professionals and partners to visit our Booth Q5338 at Hall 2 of the Nangang Exhibition Center during SEMICON Taiwan from September 10-12, 2025. Come experience our cutting-edge AI and formic acid reflow oven technology and witness the journey toward smart, optimized manufacturing. For more information, please visit the 3S Silicon Tech Official Website.

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of nano-precision platforms and thermal stabilization in Semiconductor automation a strategic investment.PBA Systems will debut its latest nano-precision dual gantry platform series and metrology stage series designed for CoWoS and smart manufacturing requirements, to be showcased in the 2025 SEMICON Taiwan exhibition, located at Hall 2, 1st floor, Booth Q5536 in the Taipei Nangang Exhibition Center from Sep. 10th to Sep. 12th.For semiconductor advanced packaging technologyThe technology drivers of Heterogeneous Integration Architectures in Semiconductor advanced packaging involve different materials and bump density, and drive different process equipment requirements. From 2.5D to 3D development, semiconductor advanced Packaging may require different Die Attachment Processes, from high-speed, high-accuracy to thermal compressed and hybrid bonding. These processes require highly precise, custom-designed platforms for automation.PBA's latest dual gantry nano precision platform series offers high precision solutions for flip-chip bonding, thermo-compression bonding, and hybrid bonding. Its special dual-gantry architecture facilitates special simultaneous, multi-axis motion controls for high-speed die bonding and precision assembly applications, with less floor space requirements and high yield rates. PBA offers fast custom design services.Key advantages of PBA dual gantry series include:Nanometer-level assembly accuracy to boost high throughput and yield rates.Design with controllable suppression of thermal expansion minimizes yield loss.Scalability to support heterogeneous integration and next-generation chip architectures.Custom-designed High-speed, high-precision positioning to ensure both productivity and process stability.Flexible joint design, reduction of vibrations and resonance, improved accuracyPowered by PBA motors, an advancement from traditional ball-screw or belt motors, enjoyed low cogging force with anti-cogging features.In addition to offering fast custom design solutions, PBA also offers 250,000 square feet of contract manufacturing space for flexible manufacturing plans for worldwide system partners.PBA will also showcase its Z-Axis High-Precision Positioning Stage series at the upcoming SEMICON Taiwan show. This stage series offers ideal motion solutions for vertical movement in semiconductor automation with limited space and high-precision requirements, ideal for AOI inspection and PCB pick-and-place applications.Leader in nano-precision stage and gantry solutions for automationPBA Korea specializes in high-precision stage technologies. PBA Group further merged Korea SOONHAN Engineering, Korea's leading manufacturer of precision stage systems for 31 years, powering PBA Group to become one of the world's top precision stage experts that provide dynamic custom design and manufacturing services. PBA Systems is also a technology-capable partner of Mitsubishi Electric and Applied Materials. PBA group's contract OEM manufacturing experiences for many world-renowned semiconductor equipment partners in Asia also differentiate the group from regional local vendors.Meet the expert tech talkThe SEMICON Taiwan show will feature several advanced technical talk sessions in dedicated show floor booth sections. In the Smart Manufacturing Expo section, PBA will participate in the Expert Talk session on September 12, located at Talk Booth Q5356, 1F, Nan-Gang Exhibition Hall 2. PBA will be presenting the highly anticipated speech topic: PBA's Dual-Gantry Precision Platform Series for Semiconductor Advanced Packaging and Metrology Equipment. This is a rare opportunity for industry professionals to gain smart manufacturing insights directly from the expert—don't miss it.Global reach, local serviceHeadquartered in Singapore, PBA Group has R&D and sales offices in Singapore, Taiwan, South Korea, Japan, Malaysia, China, the United States, and Europe. The Taiwan branch offers a one-stop solution, providing everything from direct drive motors and modules to custom-integrated, high-precision platform systems. This ensures fast, flexible, and innovative smart manufacturing services for both local and international clients.For system partners with product customization or procurement inquiries, please contact.PBA released their latest Nano-Precision Dual Gantry Stage Platform Series for Heterogeneous Semiconductor Advanced Packaging and Metrology Equipment. To Be Debuted at the 2025 SEMICON Taiwan. PBA

Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing.Advanced Packaging 3D Metrology Solutions - Chroma 7980/7981The Chroma 7980/7981 systems feature Chroma's patented BLiSTM technology, purpose-built for nanoscale critical dimension measurement. These systems incorporate application-optimized algorithms and user interfaces to deliver high-speed surface profiling and fast auto-focusing capabilities, along with large-area image stitching. They address key needs in advanced packaging processes such as TSV/VIA, RDL, probe mark inspection, overlay, and sub-micron surface profiling. Additionally, Chroma's inspection and in-situ AOI solutions, like the Chroma 7961, enable real-time defect detection and inline process quality control.AI-Driven Test Platform - Chroma 3680When hardware innovation meets AI-enhanced software, a new era of automated test equipment emerges.The Chroma 3680 platform is purpose-built to meet the demands of modern semiconductor testing, combining high-efficiency algorithms with a modular architecture to redefine flexibility and efficiency in test systems.This platform features a unified and intelligent system architecture that enables real-time, accurate test program conversion—reducing migration time and manpower by over 80%. It addresses key pain points such as poor portability of legacy test programs and time-consuming debugging processes, supporting diverse chip architectures with a concrete and effective solution.Chroma 3680 supports modular expansion to meet increasingly diverse future requirements, and can be equipped with the HDRF2 module for one-click activation of RF testing, greatly simplifying test setup. The overall platform is designed for high scalability and flexibility, enabling fast adaptation across different product lines, application needs, and test scales—streamlining both development and validation processes.Tri-Temp System-Level Test SolutionsChroma's 3100 and 3200 pick-and-place handler solutions, paired with the 31000R/31000K Series Temperature Forcing Systems, deliver a powerful, fully integrated platform to meet the unprecedented challenges of AI-era device testing.The advanced 3110, 3200, 3200-HD, 3210, and 3260 pick-and-place systems feature industry-leading SLT testing solutions, including a high-precision contact force system, CVOT (Chroma Virtual Operation Tools) for intelligent yield optimization, integrated device protection features, and a universal change kit design for fast, flexible device conversion. These systems ensure superior test quality through scalable architecture that integrates seamlessly into both engineering and high-volume production environments.The intelligent 31000R thermal solution provides a wide and stable temperature control range from –40°C to 150°C, with high-power dissipation capability up to 2,900 W. It features advanced thermal performance with direct phase-change cooling, intelligent power monitoring, and high-precision multi-zone control. This makes it ideal for AI, HPC, and thermally demanding automotive applications.SuperSizer Nano-Particle Monitoring SystemsPowered by advanced aerosol particle measurement technology, the SuperSizer system delivers precise monitoring of nano-sized particles ranging from 3 nm to 20 nm, overcoming the limitations of conventional optical systems, especially bubble interference.The SuperSizer II, V, VI, and VII generations have been widely adopted for real-time monitoring of critical wet chemicals such as CMP slurry, isopropyl alcohol (IPA), hydrogen peroxide/pure water, and ammonia solutions. The latest addition to the series, SuperSizer VIII, is purpose-built for hydrochloric acid monitoring—extending the system's capabilities into more aggressive chemistries.By enabling in-line and real-time particle detection, the SuperSizer platform helps minimize wafer defects, ensure chemical purity, and improve overall process yield.Visit Chroma at SEMICON Taiwan 2025From September 10–12, Chroma ATE will exhibit at SEMICON Taiwan 2025 at the Taipei Nangang Exhibition Center, Hall 1, 1F (Booth K2876).In addition to showcasing our wide-ranging portfolio of test solutions, Chroma will present at the Semiconductor Advanced Inspection and Metrology Forum. Our presentation "White-Light Interferometry Integration with Electromagnetic Simulation and Digital Light-Field Control for Advanced Packaging" will explore innovative applications of advanced packaging inspection and metrology technologies.Join us at SEMICON Taiwan 2025 and connect with our team to exchange insights on the future of test and innovation.Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing. Chroma ATE Inc.

Tescan Group proudly introduces its new global brand platform, The Art of Discovery at this year's Microscopy Conference (MC) in Karlsruhe, Germany. Built on the belief that beauty lies in what is yet to be discovered, it reflects Tescan's ambition to be a trusted growth partner in science. Following its global introduction at MC 2025, the brand platform will make its Asia-Pacific debut at SEMICON Taiwan (September 8–12, 2025).This rebrand signals a pivotal step in Tescan's shift toward a more integrated model — combining advanced technology, workflow-focused solutions, expert support, and a community built on shared knowledge. This represents Tescan's broader focus on delivering customer-centric solutions rather than simply providing technology.New Aspiration, Approach and Drivers"Our brand transformation captures who we are today — a company built on strong partnerships, driven by results, fueled by innovation, and committed to delivering purposeful solutions that put users first," says Sirine Assaf, Chief Revenue Officer at Tescan. Guided by its core principles, Tescan sets a clear ambition: to empower customers and partners with tools, software, and services built for what's next. At the heart of this transformation is a simple idea — removing the barriers between a question and its discovery. "This transformation isn't just about technology. It reflects a continuous evolution in how we think, how we work together, and how we enable the scientific community with timely solutions to fasten their discoveries," says Assaf.Automation and InnovationBuilding on last year's successful introduction of multiple new instruments (including the plasma FIB-SEM Amber X 2) — Tescan continues its innovation journey across the entire portfolio. This year, the company's primary focus is on enhancing automation throughout all its products, aiming to streamline scientists' workflows at a time when speed and accuracy are more important than ever. Alongside its new brand platform, Tescan is also unveiling two new software solutions: AutoSection and TEM AutoPrep PRO – Inverted & Planar Lamella Automation. "Our primary goal in this area is to reduce the time from instrument purchase to when users can fully leverage its capabilities. We accomplish this through intelligent automation, deep application expertise, and close collaboration with our customers," closes Bruno Janssens, Chief Strategy Officer at Tescan.CEO PerspectiveJean-Charles Chen, CEO of Tescan Group, commented: "This is much more than a cosmetic redesign. It's a strategic repositioning that reflects the way we see how science is evolving, and how Tescan is evolving with it. We're aligning with a new era of scientific discovery by enabling better-integrated workflows, faster time from question to insight, and a tighter connection between our technology and our users' needs. It's a shift from being a product-oriented company to becoming a solutions partner. This means more automation, smarter software, and a mindset rooted in customer outcomes. The new look is simply a reflection of that deeper change.”APAC RolloutFollowing an exclusive offline preview at the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) in early August, Tescan will make the APAC debut of its new brand at SEMICON Taiwan (September 8–12, 2025). As part of the Semiconductor Advanced Inspection and Metrology Forum, Herv? Mac?, Global Business Development Director for Semiconductors, will speak on September 12 on Development of New Workflows to Address Metrology and Failure Analysis Challenges at Macroscale, Microscale and Nanoscale.Venue: 701F, 7F, Taipei Nangang Exhibition Center Hall 2.Tescan Unveils New Global Brand Platform "The Art of Discovery" with APAC Rollout at SEMICON Taiwan. Tescan.

With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has intensified, driving advanced packaging technologies toward higher density and lower latency. Heterogeneous integration architectures such as CoWoS, CoPoS, and HBM are accelerating in adoption, while Thermo-Compression Bonding (TCB) has emerged as a critical process technology thanks to its advantages of low thermal stress and high bonding strength.Global equipment leaders including BESI, ASMPT, Kulicke & Soffa, Hanmi, and Shibaura are actively investing in TCB, underscoring its growing strategic importance.In response to this market momentum, Taiwan-based precision equipment manufacturer Micraft System Plus Co., Ltd. (MSP��) has officially announced the launch of its first self-developed TCB bonder, which will make its public debut at SEMI Taiwan 2025. Purpose-built for heterogeneous integration applications, the system integrates Micraft's years of expertise in precision automation and features localized heating, programmable temperature control, pressure sensing, platform leveling, and micron-level alignment—marking a new milestone for Taiwan's equipment industry in advanced semiconductor processes.According to Micraft, the system employs multiple independently controlled heating modules, enabling rapid localized heating and cooling to minimize the thermal-affected zone and reduce warpage risk. Leveraging its extensive wafer bonder experience with optical semiconductor customers, the company has incorporated pressure sensing and leveling technologies that dynamically adjust bonding pressure and thermal profiles. This ensures uniform bonding quality and high yield, particularly for fine-pitch, low thermal stress, high-precision, and high-throughput packaging requirements.The bonder is further equipped with advanced optical alignment modules from Carl Zeiss, combined with Micraft's proprietary optical system and cutting-edge vision algorithms. This enables alignment accuracy of better than 1μm. In addition, the system offers high process flexibility, supporting a wide range of materials and carrier formats to meet diverse requirements of OSATs and IDMs.Micraft has long been a pioneer in the MicroLED equipment market, with its laser mass transfer and repair platforms already adopted and mass-produced by Taiwan's two leading panel makers. By extending its expertise into advanced packaging, Micraft leverages its core strengths in precision motion control, optical integration, and thermal processing. Several leading domestic and international semiconductor customers have already initiated tool qualification programs.Looking ahead, Micraft plans to continue developing next-generation wafer-level bonding equipment, including Hybrid Bonding and Co-Packaged Optics (CPO), to address the rising demands of 3D IC and chiplet architectures. Through these efforts, Micraft aims to strengthen Taiwan's role in the global advanced packaging supply chain and further advance the localization and globalization of Taiwan's precision equipment technologies.Micraft System Plus warmly invites industry partners to visit its booth at SEMI Taiwan 2025 to explore collaborative opportunities and witness the next generation of bonding solutions.Micraft self-developed TCB bonding system, which will make its global debut at SEMI Taiwan 2025

ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence Revolution." This refers to the driving forces for new chip technologies like AI, smart mobility, and hyperconnectivity. As a leading provider of advanced packaging and semiconductor assembly solutions, ASMPT enables its customers to develop cutting-edge AI technologies, supporting both high-performance AI chips that integrate advanced memory technologies like HBM and efficient components for edge devices. ASMPT will showcase three machines at SEMICON Taiwan: the new ALSI LASER Platform, the fine-pitch wire bonding solution AERO PRO, and the SIPLACE CA2 uniting semiconductor and SMT processes.ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025.ASMPTThe next-generation LASER platform has been specifically developed to meet the increasingly complex requirements of IDM and Foundry semiconductor companies for laser dicing and grooving wafer materials. This new system with ASMPT's patented multi-beam technology expands the company's portfolio with a focus on front-end operations."The new platform combines high-precision laser processing with smart automation to support the next generation of semiconductor manufacturing", says Patrick Huberts, Head of Business and Marketing at ASMPT ALSI. "It's the ideal platform for applications in advanced packaging, AI, and power automotive. We invite you to join us for the official launch and discover the new machine live at our booth during SEMICON Taiwan."High-performance wire bondingASMPT also introduces its latest high-performance wire bonder at SEMICON: the AERO PRO. Developed for high-density semiconductor designs, this machine delivers the highest bonding accuracy and exceptional speed for wires with diameters of 0.5 mil (≈12.7 µm). Thanks to integrated real-time monitoring and preventive maintenance functions, the system is ideally suited for use in intelligent, networked production environments. To accommodate complex designs such as system-in-package (SiP) and multi-chip modules (MCMs), as well as applications like ball grid arrays (BGAs), land grid arrays (LGAs), memory modules, or quad flat packages (QFPs) with external leads. For uniform 22-µm bond balls, it employs the patented X-POWER 2.0 transducer—a lightweight and vibration-optimized ultrasonic transducer that supports mixed-wire and vertical bonding in bond via array (BVA) technology. Optimized for complex interconnects in memory, microcontroller units (MCUs), and more, ideal for advanced applications such as AI edge devices and automotive systems.Bridging Semiconductor and SMTThe hybrid SIPLACE CA2 placement solution from ASMPT SMT Solutions redefines advanced packaging by uniting semiconductor and SMT processes in a single, high-speed platform. Traditionally, die bonding and SMT placement were separate steps — now, they are seamlessly integrated. Designed for advanced packaging applications in smartphones, 5G, AI, high-performance computing (HPC), and IoT devices, the SIPLACE CA2 processes both SMDs from tape and dies taken directly from sawn wafers. This eliminates the need for expensive die taping, saving up to 800 km of tape annually in 24/7 production, reducing both cost and material waste. With up to 76,000 components per hour (cph) for SMT, 54,000 cph for Die Attach, and accuracy of up to 10nm @ 3σ accuracy, the SIPLACE CA2 delivers high-speed and accuracy — even for advanced Die Attach and Flip Chip applications. A breakthrough buffer system decouples die pickup from placement, solving previous speed limitations. Up to 50 wafers can be managed with just 13 seconds of swap time – unmatched in the industry.The SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly. ASMPT

xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.This year's one-day seminars will center on live product demonstrations of Sycamore, xMEMS' revolutionary thin and lightweight full-range MEMS loudspeaker, and cooling, the world's first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can't go.Attendees will experience:1) AI glasses featuring Sycamore speakers and cooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear2) Next-gen headphones featuring full-range Sycamore, paired with cooling to deliver the world's first active earcup ventilation3) SSD thermal management featuring cooling for higher sustained data transfers4) Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing cooling at both chip and system levelsIn addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and cooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics."AI is changing how we interface with devices while also increasing processor and thermal loads," said Joseph Jiang, CEO of xMEMS Labs. "At xMEMS Live Asia, we'll demonstrate how Sycamore and cooling technologies are enabling a new generation of thinner and lighter-weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance."Registration is now open. Seating is limited. Click here for English, here for Simplified Chinese, or here for Traditional Chinese. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management!For more information about xMEMS and its solid-state solutions, visit xmems.com.Showcasing Live Demonstrations of AI Interface and Thermal Device Innovation Enabled by Sycamore and cooling on September 16 in Taipei and September 18 in Shenzhen.

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 - 1F from September 10-12, 2025. Visit TRI's Booth No. K3070 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions.TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack/Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the TR7900Q SII-R TRI's Reject Station with A-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.

The existing competitive edge has prompted the birth of a semiconductor Innovation Zone in the city of Bromont, located in Quebec, Canada. World leaders like IBM, Teledyne DALSA, Fabritec, and GE Aviation are located in the area, taking advantage of Quebec's green energy.The Innovation Zone is strategically located in the North American semiconductor North-East Corridor and has the highest number of microelectronics jobs and clean rooms in the country. The North-East Corridor links Quebec with the U.S. semiconductor industry, which is booming thanks to the CHIPS Act. More than 60 new semiconductor projects have been announced in the U.S., including 23 new chip fabs and the expansion of 9 other fabs, many of them in New York State. This makes Quebec part of a cross-border supply chain, covering everything from chip design to R&D and manufacturing.The American semiconductor industry is facing a labor market gap, as the projected demand for talent is growing. Demand for engineers, technicians, and computer scientists is particularly expected to increase. Quebec is taking the lead in developing and implementing solutions to this challenge, building on its historic strengths while demonstrating agility in response to regional CHIPS investments. Incentives and international mobility programs have been created to attract top talent. At the federal level, companies can already benefit from the Intra-Company Transfer program, which allows for the temporary transfer of qualified employees from abroad to Canada within the same organization. Another immigration program, the Global Talent Stream, makes it easier to hire specialized or highly skilled talent from abroad. This program includes a simplified procedure in Quebec for high-demand skills within the province.There are also several Quebec-specific incentives aimed at talent development and attraction. Companies can benefit from programs provided by Employment Quebec, which offer competitive grants for training. In strategic sectors—such as digital transformation, the green economy, or the energy transition—the grants can cover up to CAD1 million of eligible expenses. Additionally, tax credits are available to help recruit foreign researchers for scientific research or experimental development (SR&ED) projects in Quebec.To further attract talent, the Quebec Perspective Scholarship Program, announced in 2021, is a CA$1.7 billion investment over five years to encourage Canadian or permanent resident students to pursue diplomas in strategic economic sectors such as engineering and information technology. Another strong incentive is the Quebec tax holiday for researchers and specialists recruited to work in the province. This holiday provides an exemption from Quebec income tax for five consecutive calendar years, including a full exemption for the first two years.Investissement Quebec, the Quebec government's financial arm and economic development agency, has established its own Talent team, whose mandate is to work closely with companies already in Quebec or those looking to establish a presence, helping to build resilience against workforce challenges.All levels of government work closely with businesses to adapt existing training programs and create new ones that target priority sectors. A great example is the swift action taken to support the large battery projects recently established in Quebec. Several partner organizations across the province collaborated on these structural changes and actively promoted them to attract both local and international students and talent.In addition to responsive policies, Quebec offers several lifestyle advantages. The region is one of the safest in North America, providing an outstanding quality of life, affordable housing, and competitive childcare. In 2020, the monthly childcare cost for an infant was just CA$181. Companies in Quebec also benefit from significantly lower labor costs compared to those in the U.S.Investissement Quebec offers 360-degree support for business growth and productivity. Its services range from financing to technological support and business consulting. To learn more about what the Quebec semiconductor ecosystem can bring to your business contact Rachel Yin (LinkedIn) Info@Invest-Quebec.com

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and getting larger-sized AI chips require advanced packaging technologies to improve performance and time to market while reducing chip manufacturing costs and power consumption. The heterogeneous integration including 2.5D, 3D hybrid bonding, fan-out, and system-on-a-chip (SoC) packaging, along with emerging solutions like silicon photonics and panel-level packaging, are critical in optimizing system performance. These trending technologies are offering a higher-value opportunity and propelling the global semiconductor industry to foster the big waves of AI and high-performance computing chip innovation.The chemical solution providers play an important role in helping chip makers develop and commercializing various advanced packaging solutions to win premium customers. In this exclusive interview in the private conference room of SEMICON Taiwan with Mr. Ramachandran (Ram) Trichur, Global Market & Strategy Head for Semiconductor Packaging at Henkel Adhesive Technologies Electronics. He started recap the market observation of the semiconductor industry in 2024Henkel Adhesive Technologies business unit is the global leading chemical solution provider for adhesives, sealants, and functional coatings with sales of EUR10.790 billion in fiscal 2023. Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries.Mr. Ramachandran (Ram) Trichur, Global Market & Strategy Head for Semiconductor Packaging at Henkel Adhesive Technologies Electronics.Expecting AI killer applications drive massive growth for edge computing Ram described the market as in a persistently challenging business environment as well as the market recovery in the Electronics business in 2024. Especially the advanced packaging is now gaining significant momentum as the next pathway for breakthroughs in semiconductor technology. The company expects single-digit market growth for 2024 and is optimistic about looking into 2025 as a massive increase in demand for the semiconductor market.He has observed several notable trends. First of all, in the past two years, generative AI has rapidly evolved and driven cloud computing AI revenue growth for enterprises. However, the volume of AI-enabled electronic devices is not increasing in the same way currently. The chip makers and electronic manufacturing industry are looking for applications to drive the unit count growth happened in the edge computing AI sector.Meanwhile, consumer electronics brands have quickly responded to promote their latest AI-powered products to figure out how consumers use AI to expand use cases that people use every day. There are more AI-enabled devices coming. Nowadays, some newly released fancy devices including AI personal computers (PC), AI smartphones, and intelligent robotics in automation systems are gathering attention. While companies race to incorporate AI technologies internally and externally, consumer use of AI still requires more time to see the results.Henkel hospitality suite showcasing solutions at SEMICON Taiwan 2024Photo: HenkelThermal mechanical challenges in advanced packagingSemiconductor chips are essential for the development and deployment of AI at scale. There are several primary challenges to be tackled in the semiconductor industry. Thermal-induced mechanical stress is now one of the leading causes of semiconductor failures, and it is becoming a top focus for chip manufacturers and ecosystem partners. "The bigger chips mechanically have big space and cause warpage and stress issues happened while ICs in operation," said Ram. He acknowledges the control of the warpage or mechanical stress to prevent chip failure is the highest priority for both material providers and chip manufacturers. The collaboration of ecosystem partners jointly developed and set a guideline on the maximum warpage or stress allowed in 3D-ICs, and designers could follow and avoid exceeding the constraints.Henkel is focusing on providing semiconductor packaging materials with long-term reliability, optimized performance, and processability for high throughput production. The demonstrated chemical solution lineups in SEMICON Taiwan 2024 include several major categories of advanced packaging materials. They are advanced underfill, non-conductive pastes & films (NCP & NCF), wafer-level encapsulation, and lid & stiffener attach materials.Lid & stiffener adhesives strengthening, warpage-reducing, grounding or shieldingRam divided the use of Henkel's materials for 2.5D/3D integrated packages in the manufacturing process into several highlights. The first is the lid & stiffener attach materials. The metal parts of lid & stiffener design in the larger-sized packaging is useful to reduce warpage concerns while dealing with tighter interconnects, thinner dies, complex architectures, and multiple coefficients of thermal expansion (CTE) in a single package. The Henkel's semiconductor adhesives are reliably attached to the lid and peripheral stiffeners to the substrate, allowing the package to maintain flatness throughout production and operational thermal cycles.During the manufacturing process and in operation, these devices and their multiple dies are subjected to several thermal cycles which can stress interconnects, leading to warpage and mechanical damage. The design of Henkel's lid & stiffener attach materials provides a portfolio of stability-enhancing adhesives ranging from conductive and non-conductive formulations, providing warpage-reducing coplanarity as well as grounding or shielding capability.Large die capillary underfill considering bump protection and warpage controlThe second highlight is focusing on advanced underfill materials. The 3D-IC design continues to increase the silicon interposer area to accommodate multiple dies including memory and processor units allowing the dense die integration inherent in advanced packaging techniques. This will require the underfill material with low shrinkage and toughness to provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Targeting to meet the dimensional demands of highly integrated package designs, Henkel's Capillary Underfill(CUF) materials completely envelop fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields.However, there is rising processability or manufacturing throughput requirements while the Capillary Flow Materials fill a large area in the substrate for bigger ICs. The flow speed allowing for greater process efficiency is an important feature for complete interconnect coverage. Henkel takes a quick response to release new materials. Taking Loctite Eccobond UF 9000AE as an example, in internal testing versus previous generation Capillary Underfills, Loctite Eccobond UF 9000AE demonstrated 20% faster flow on a 40 mm x 40 mm die, indicating that this material is compatible with even larger die sizes. So far, Loctite Eccobond UF 9000AE's performance has been validated on die as large as 50 mm x 50 mm and within packages up to 110 mm x 110 mm.Liquid compression molding materials support high reliability & high-UPH processThe third highlight is advanced molding and encapsulation materials. Wafer-level packaging shows significant growth potential, chemical solutions including advanced molding and encapsulation are enabling accelerated adoption by providing improved handling, protection, and warpage control for thinner die design approach. The challenges are the molding area is getting larger and the molding thickness is thin. The warpage becomes large after curing and it affects proceed to the subsequent process. Henkel's portfolio of wafer-level encapsulation materials include a variety of solutions to facilitate high-yield processing and in-field reliability for various advanced wafer-level packaging applications. The focus of the demo section is liquid compression molding materials (LCM).Henkel's liquid compression molding materials for wafer-level packaging processes integrate ultra-fine filler technology (less than 10 μm upper-cut) to deliver void-free gap filling and thorough coverage. In addition, the high warpage control and fast in-mold curing of Henkel's formulations molding materials provide high reliability in combination with a high-throughput process for overall lower cost. The LCM materials are anhydride-free and REACH-compliant, ensuring that the die remains protected under various operational stresses.Henkel Adhesive Technologies ElectronicsPhoto: HenkelHenkel Taiwan Electronics Adhesives Technical Center supports customers' technology roadmapsHenkel is well positioned to deliver the sustainable high-performance materials needed for next-generation advanced packaging. These series of Henkel's solutions offer characteristics with high reliability, thermal expansion, fast capillary flow to satisfy the requirements of complex, high-density semiconductor packages. In all product developments, Henkel's sustainability commitments to use renewable carbon content and eliminate Substances of Very High Concern (SVHC) materials will remain a priority. The newest generation of advanced packaging is integrated with the technologies with environmental protection and partnerships with industry leaders. This will drive the material innovation to satisfy the semiconductor manufacturing fab requirements.There are more versatile and potential opportunities for semiconductor advanced packaging technology underway including Co-Package Optics (CPO), panel-level packaging, and other emerging techniques. The next steps for Henkel Adhesive Technologies will continue investing heavily in material innovation and seek to understand the evolving needs of the semiconductor and electronic materials market while actively proposing chemical products that align with customers' technology roadmaps and contributing to the research and development of new products.Moreover, Henkel Taiwan Electronics Adhesives Technical Center at Zhubei City provides prompt technical support and increases collaboration with Taiwan customers to speed up prototype development. This application center is dedicated to supporting customers in technical innovation and product development through faster application simulation, data generation, and analysis, thereby accelerating time-to-market for advanced packaging technologies. Ram concludes, "Through Henkel's dedicated global support teams and in close partnership with customers, Henkel Adhesive Technologies will create technical breakthroughs to open a new frontier for semiconductor advanced packaging."