As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package? Interested in knowing how to increase the glass panel size for manufacturing AI multichip packages? If so, visit iCometrue® at Booth M0957, Hall 1, 4F, Taipei...

As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the future of computing. However, moving technologies such as silicon photonics and co-packaged optics (CPO) from development to commercial deployment presents a critical challenge: how to achieve reliable, high-volume production.

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law...