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REALTIME NEWS
China’s 15th five-year plan elevates PCB role in AI supply chains
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Huawei’s Kirin 9050 Pro reveals new logic folding chip design
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Huawei says 381 tau chips are already in mass production
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Samsung accelerates HBM thermal management push as AI packaging scales up
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South Korean PCB exports ride AI demand, set to surpass 2022 peak in 2026
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Tuesday 21 July 2026
Eko Agentic: AI-driven data analytics for optimising retail performance
Artificial intelligence is just an interesting theoretical problem for many scientists and engineers, but it is at its most useful when it directly responds to the needs of its users.
Tuesday 21 July 2026
Taiwan launches AI competition to tackle marine debris with 20,000-image dataset
Marine debris management is entering a new phase of data-driven applications. Converting years of accumulated coastal imagery into actionable tools for surveying, identification, and monitoring has emerged as a critical challenge in the digitalization of ocean governance.
Tuesday 21 July 2026
AIYO: An AI tool that designs chips to user specifications
The Best AI awards were given out in two categories: artificial intelligence (AI) applications and integrated circuit (IC) design. AIYO was entered in the IC design category, but their concept – AI-powered acceleration of IC design – really straddles the two categories.
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
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Musk's Memphis move puts xAI at the center of his empire
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
Weekly news roundup: Musk looms large as AI chip boom drives capacity expansion and geopolitical risks
AMD's Lisa Su back in Taiwan as AI capacity crunch spreads beyond TSMC
China's ASML DUV stockpile spurs calls to close export-control loophole
Z.ai GLM-5.3 security draws scrutiny as Anthropic flags weak defenses
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