中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Huawei
Nvidia
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
CXMT targets DDR5 RDIMM mass production by end-2026
Tomorrow's Headlines
2h 11min ago
Nvidia expands China gaming partnerships
Tomorrow's Headlines
2h 11min ago
US promotes AI exports as chip industry flags supplier gaps and reshoring costs
Tomorrow's Headlines
2h 11min ago
Commentary: The methodology behind Lip-Bu Tan’s strategy of vulnerability for Intel
Tomorrow's Headlines
2h 11min ago
Analysis: GF finds high-value outlet for mature capacity through advanced packaging, lessons for China
Tomorrow's Headlines
2h 12min ago
Home
Biz Focus
COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Tuesday 11 August 2026
ViTrox showcases AI packaging inspection solutions at SEMICON Taiwan 2026.
ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor industry events. The exhibition will take place from 2 to 4 September 2026 at TaiNEX 1 & 2 in Taipei, Taiwan. Visitors can visit ViTrox at TaiNEX 2, 1F, Malaysia Pavilion, Booth #P6006.
Monday 10 August 2026
BIOSTAR to Showcase at EMBEDDED WORLD NORTH AMERICA 2026
BIOSTAR, a leading manufacturer of edge AI solutions, industrial motherboards, and edge computing systems, today announces its participation in embedded world North America 2026, taking place September 22–24, 2026 at the Anaheim Convention Center in Anaheim, California, USA...
Friday 7 August 2026
SK hynix Invests 54T Won in Y2 and M17 Fabs
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has decided to build new fabs in Yongin and Cheongju to respond to the continuously growing demand for memory in the AI era.
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Micron opens second Taiwan advanced packaging plant as HBM supply tightens
Intel says AI 'gold rush' is over, pushes prompt routing across open hardware
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Korean memory makers accept ASML parts price hike, leaving TSMC as the open question
Full list
×
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first