中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Anthropic
Nvidia
SpaceX
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
South Korea's army advances energy transition with microgrids, hydrogen
Sustainability
3min ago
India's Mivi opens electronics plant in Hyderabad as it moves into smartphones
ICT
8min ago
EasyJet bets on Starlink for full-fleet connectivity by 2027
Aerospace
14min ago
Apple Intelligence heads toward paid tiers in 2027, yet AI usage limits leave key questions unanswered
ICT
17min ago
Rebuilding the American edge: How TSMC is driving US manufacturing and economic opportunity
Semiconductors
17min ago
Meta reportedly advances humanoid robot development with Chinese partner Fourier
ICT
21min ago
Commentary: China's Nvidia H200 challengers look beyond GPU power, with Huawei and T-Head targeting system-scale AI
ICT
29min ago
Kioxia's AI storage boom faces a test as pricing gains moderate, shipments shift
Semiconductors
32min ago
Home
Biz Focus
COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Monday 31 August 2026
NewPower Worldwide expands credit facility to $750M for growth
NewPower Worldwide, one of the electronics industry's fastest-growing distributors, today announced it has expanded its committed credit facility to $750 million, further enhancing its ability to invest in inventory, support customer growth, and capitalize on opportunities across the global supply chain.
Monday 31 August 2026
Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined Failure Analysis for Advanced Packaging," Tescan will present a correlative workflow that connects defect localization, rapid access to regions of interest (ROIs), site-specific sample preparation, and nanoscale characterization.
Thursday 27 August 2026
ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At Booth L0716 (TaiNEX 1, Level 4)...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Nvidia unveils OOI CPO prototype for post-2028 AI needs
TSMC advances CoPoS packaging at Taoyuan Longtan site
Column: Samsung's memory boom reshapes its investment strategy
India roundup: India accelerates semiconductor push as states, chipmakers and equipment suppliers expand investment
NearLink looks to chip vendors to expand beyond Huawei ecosystem
Analysis: Samsung's own memory unit pushes its foundry toward a 2027 capacity crunch
Nvidia's Korea robotics push gains ground as LG starts data factory operations
Full list
×
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first