中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
Research Home
By Industry
Servers
IC Manufacturing
IDM & Fabless
AIoT
Notebooks
Smart Devices
Vehicle Tech
Asia Supply Chain
Other Tools
Research Insights
Meet the Analysts
TechStats
Single Reports
Preview Report
Reports Index
On-Demand Briefing
Products & Services
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
Smart City
Smart Manufacturing
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Semiconductor News
Server News
Meet the Analysts
AsiaTech Frontier
HotSpot
On-Demand Briefing
Trending
SUBSCRIBE
CONNECT WITH US
anniversary
Sponsored
Home
Biz Focus
LATEST STORIES
Thursday 21 December 2023
Pandemic sparks surge in takeout, delivery platforms: DotDot Global ventures overseas after securing Taiwanese market
During the three-year pandemic, food businesses had been impacted by decreasing in-person dining and government endemic prevention policies globally. As a result, they have been collaborating with delivery platforms to sustain their survival and increase revenue. Despite increasing diversity in delivery services, people began dining in restaurants or ordering takeout again after the pandemic eased off. To avoid hefty platform fees, food businesses are seeking collaboration with other platforms. They hope that by diversifying delivery channels, they can improve their profit margin and the overall revenue.
Friday 15 December 2023
STMicroelectronics accelerates Edge AI adoption to help companies transform their products
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is introducing its comprehensive ecosystem offer for companies to transform their products with edge AI. The announcement of the ST Edge AI Suite, an integrated set of software tools free-to-use with ST hardware, takes the offer to customers one step further, enabling them to jumpstart the design and deployment of billions of connected, autonomous things embedding artificial intelligence locally. The ST Edge AI Suite will simplify the development of customers' AI solutions by exploiting ST's broad range of hardware (general-purpose and automotive microcontrollers and microprocessors, smart sensors) and related tools for embedded AI optimizations. It will expand and integrate the multiple software tools, evaluation, and development kits introduced over the past 10 years while leveraging the existing AI ecosystem of machine learning (ML) frameworks and key partners (such as Nvidia and AWS).
Friday 15 December 2023
Crypto Quantique partners with Blaitek to enable quantum secure chip-to-cloud connection
Crypto Quantique, a leading quantum-safe cybersecurity solutions provider, is delighted to announce a strategic partnership with Blaitek, an AIOT smart-home technology company, as part of its strategic expansion in the Taiwan market.
HIGHLIGHTS
Thursday 18 April 2024
Connections Summit 2024 gathers RFID industry to discuss market trends, technical developments and future use cases for technology
Connections Summit 2024 takes place between 13-16th May in Taichung, Taiwan. The event will bring together the RFID industry for four days of learning, networking and cultural experiences, covering current and future RFID market trends, technical developments and emerging use cases for the technology.
Thursday 18 April 2024
GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC's Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform passed comprehensive silicon testing, validating 3DIC interface hardening flow. The first GUC 3D customer project also passed complete silicon testing, validating a full spectrum of 3D implementation services for AI/HPC/Networking applications.
Wednesday 17 April 2024
DigiKey and NXP unveil MCX MCU Design Contest at Embedded World 2024
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, is excited to announce its teaming up with NXP Semiconductors to launch the MCX MCU Design Contest at embedded world. Using NXP's new FRDM development boards, contest participants are invited to submit design ideas and projects for a chance to win a variety of prizes, including a grand prize package containing a 14-inch MacBook Pro, Apple Watch Series 9, and AirPods Pro.
VIDEOS
Digital Transformation in Smart Cities
Asia Supply Chain 100 Forum | Asia Supply Chain's current/future development
Asia Venturing | How to innovate with GenZ through partnering & investing?
WHITEPAPERS
QUECTEL Build a Smarter World
LILIN | Aida Edge Camera
GIGAIPC offers suitable solutions to assists manufacturers and corporation to transform and develop the ability for the "future".
TOP STORIES
7 DAYS NEWS
China's chip equipment industry gains momentum in import substitution, alarming foreign suppliers
China's JCET confirms advanced packaging capability for chips below 5nm
China-based SICC becomes second-largest SiC wafer provider globally
Intel goal to have half of global advanced chip production in the US and Europe...depends on Asia
Indian imports of monocrystalline silicon wafers from China have surged, why?
TSMC lowers 2024 semiconductor, foundry outlook
Samsung top execs visit Taiwan flash controller companies
NAND demand shows signs of recovery as Samsung and SK Hynix adjust production
Yageo sees customers complete inventory adjustments in 1H24
Taiwan companies repatriate US$46.3 billion back from China in 2023
Full list
PRNEWSWIRE
F5.5G All-Optical Premium Computing Network, Connecting Ubiquitous Intelligence
DeepL makes the Forbes AI 50 list as one of the world's most innovative tech companies
Bybit Institutional Report 2024: Institutions Become Bullish and Eye Challenger Chains, while VC Funding Resurges for Infrastructure, Gaming, and AI
Huawei Introduces AI Technologies to Accelerate Network Transformation Towards All Intelligence in the Net5.5G Era
RESEARCH INSIGHTS
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research
×
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first
Notification
×