ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting the growing role of quality in scaling AI hardware

Elitegroup Computer Systems (ECS), a leading global provider of motherboards, mini PCs, and computing solutions, will participate in COMPUTEX 2026 from June 2 to 5, 2026, at Taipei Nangang Exhibition Center, Hall 1, Booth J1317a. Under the theme Power AI Computing, ECS will present its latest motherboards and LIVA Mini PCs, highlighting how compact and scalable PC platforms can support AI Agent workloads, Edge AI processing, smart healthcare applications, and embedded deployments

Technology news, product launches and show highlights from the event attendees available for download (PDF).

ROHM Co., Ltd. (hereinafter "ROHM") has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC, with which ROHM has an ongoing partnership, to establish an end-to-end production system within the ROHM Group. By licensing TSMC GaN technology, ROHM will strengthen its supply capability to meet growing demand for GaN in applications such as AI servers and electric vehicles.GaN power devices offer excellent high-voltage and high-frequency performance, helping to improve efficiency and reduce size in a wide range of applications, and are already used in consumer products such as AC adapters. Adoption is also expanding in high-voltage applications such as power units for AI servers and on-board chargers for electric vehicles (EVs), and demand is expected to continue growing.ROHM began developing GaN power devices at an early stage and established a mass-production system for 150V GaN at ROHM Hamamatsu in March 2022. In the mid-power range, ROHM has built its supply structure while advancing external collaborations. One of the key partners in this effort has been TSMC: ROHM has adopted a 650V GaN process since 2023, and in December 2024, the two companies entered into a partnership related to automotive GaN, further deepening their collaboration.This latest integration represents an evolution of that partnership. Under a newly concluded license agreement, TSMC's process technology will be transferred to ROHM Hamamatsu. ROHM aims to establish the production system in 2027 to meet expanding demand in applications such as AI servers.Upon completion of the technology transfer, ROHM and TSMC will amicably conclude their automotive GaN partnership. At the same time, the two companies will continue to strengthen collaboration for higher efficiency and more compact power supply systems.

XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the development and commercialization of advanced semiconductor packaging applications.Under the partnership, XTPL will install a Delta Printing System in Manz Asia's  Semiconductor Innovation and R&D centre in Taoyuan, Taiwan, establishing a local capability for process development, testing, and validation. The facility will enable customers to evaluate specific applications and establish a pathway from prototype development to volume production.The partnership combines XTPL's proprietary dispensing technology with Manz Asia's expertise in advanced semiconductor manufacturing systems and process development. The collaboration will focus on joint engagement with third-party customers and the evaluation of application-specific commercial opportunities.XTPL's UPD technology enables highly controlled deposition of functional nanomaterials with feature sizes ranging from tens of micrometres down to below one micrometre. The technology is already qualified for high-volume production in display applications and is currently being evaluated for additional applications in advanced electronics, including inline manufacturing, multichip module packaging, and advanced electronic structures."I am delighted to start the partnership with Manz Asia - a company with a strong position and deep expertise in the semiconductor industry in Taiwan and Asia. It is only natural for us to work side by side with a partner who knows this ecosystem from the inside.The synergy between XTPL's unique ultra-precise dispensing technology and Manz Asia's competencies in advanced semiconductor packaging is a natural fit. That is precisely why I am confident this collaboration will translate into tangible business opportunities for both sides.," said Filip Granek, CEO of XTPL.Robert Lin, CEO of Manz Asia, added: "This strategic partnership with XTPL expands our printing capabilities into ultra-precise material deposition, enabling a wide range of advanced semiconductor applications. The technology supports both conductive and non-conductive materials across 2D, 2.5D and 3D substrates in diverse manufacturing scenarios.By combining XTPL's dispensing technology with Manz's automation and process integration expertise, we broaden our portfolio and provide more flexible manufacturing solutions, helping customers accelerate innovation and move efficiently from prototype to volume production."

Teamsworld Innovation Inc. announced its AI-powered manufacturing matchmaking platform, targeting multinational enterprises seeking to diversify supply chains. The platform connects clients with precision component manufacturers in Taiwan and mass production facilities in Vietnam, addressing information gaps and geopolitical risks in cross-border sourcing. The digital platform serves companies implementing "China Plus One" strategies. Teamsworld combines Taiwan's research and development capabilities with Vietnam's cost advantages, providing sourcing solutions for mechanical components from prototype development to mass production with supply chain transparency and flexibility.AI-Driven Manufacturing SupportThe platform digitalizes traditional procurement processes using artificial intelligence. The system analyzes materials and geometric tolerances while incorporating Design for Manufacturing (DFM) experience to optimize production paths during early development stages. Company data indicates the platform helps clients increase production efficiency by 25% and reduce research and development costs by up to 40%. A cloud-based dashboard offers global clients real-time visibility into production status, fostering seamless cross-border collaboration while significantly lowering overhead.Taiwan-Vietnam Dual-Hub Model"In today's volatile global landscape, manufacturing has evolved from a race on price to a test of resilience," said Vincent Lin, CEO of Teamsworld. "We aren't just a matchmaking platform; we are a strategic partner. By integrating Taiwan's advanced R&D with Vietnam's cost-effective production, we empower enterprises to navigate the entire lifecycle from prototype to mass production with unparalleled agility."Specialized Thermal Management Solutions for EV and 5G MarketsTeamsworld has developed technical capabilities in thermal management for high-power consumption and harsh environment applications. The company provides precision thermal enclosures for electric vehicle battery management systems, 5G communication base stations, and industrial automation equipment. Production processes integrate over 50 techniques, including aluminum die casting and injection molding, with assembly services spanning thermal bases to protective enclosures. Further information is available at official website.