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Bits + chips
TSMC InFO packaging brings more competitiveness to its 7nm process technology
Josephine Lien, Taipei; Jessie Shen, DIGITIMES
Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness to the foundry's 7nm FinFET process technology, according to...
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The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.