CONNECT WITH US

TSMC InFO packaging brings more competitiveness to its 7nm process technology

Josephine Lien, Taipei; Jessie Shen, DIGITIMES Asia 0

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness to the foundry's 7nm FinFET process technology, according to...

The article requires paid subscription. Subscribe Now