Taipei, Wednesday, September 20, 2017 17:27 (GMT+8)
partly cloudy
Taipei
33°C
News tagged packaging
  • Last update: Monday 18 September 2017 [538 news items]

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

IC packager ASE reportedly enters Amazon supply chain

Sep 15, 11:04

Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

Taiwan diode maker HY Electronic to unveil new China plant in 2018

Sep 11, 12:03

Taiwan's leading diode maker HY Electronic will inaugurate its second plant in Yangzhou, China in the first half of 2018, to support production of automotive alternator rectifier...

David Fang, chairman of HY Electronic

SPIL obtains packaging orders for AMD Vega 11 GPUs

Sep 8, 15:17

AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...

TSMC CoWoS eyeing bigger presence in supercomputer field

ASE August revenues increase

Sep 8, 11:26

IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw its August revenues climb to the highest monthly levels thus far in 2017.

Upstream material suppliers in new iPhone supply chain to see strong growth

Sep 4, 15:09

With Apple expected to launch its new iPhone soon, Taiwan players in the US vendor's smartphone supply chain are warming up to embrace a new round of business boom, with the upstream...

Apple is expected to launch the new iPhone soon

Nidec to acquire SV Probe

Aug 29, 10:20

Japan-based Nidec has announced plans to acquire SV Probe, a Singapore-based probe card manufacturer, through subsidiary Nidec-Read. A stock purchase agreement has been reached between...

Backend firm Lingsen to post strong 3Q17, says report

Aug 28, 13:55

Taiwan-based backend service company Lingsen Precision Industries is expected to post its highest revenues since the third quarter of 2013 in third-quarter 2017, the Chinese-language...

Xintec loss widens in 1H17

Aug 25, 11:34

Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.

AMD Vega graphics cards in shortages

Aug 25, 11:10

AMD's new Radeon RX Vega series graphics cards, which have become available since August 15, are currently seeing tight supply in the retail channel reportedly due to an insufficient...

AMD Vega GPUs in shortages

Electric car vendor Thunder Power to build plants in Taiwan

Aug 16, 15:36

Hong Kong-based Thunder Power Holding has announced a new electric car in Taiwan and has also recently signed a letter of intent with a local government to establish plants for battery...

Globalfoundries demos 2.5D HBM solution

Aug 16, 09:33

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...

Globalfoundries intros solution leveraging 2.5D packaging with low-latency

Taiwan Chelic 2Q17 revenues rise 58% sequentially

Aug 15, 16:03

Pneumatic automation component maker Taiwan Chelic has reported its second-quarter 2017 consolidated revenues reached NT$418 million (US$14.09 million), up 58.33% sequentially, with...

SPIL to invest US$25 million in China

Aug 15, 10:27

Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...

Taiwan IC industry output value drops in 2Q17, says TSIA

Aug 10, 14:36

Taiwan's IC industry, consisting of designers, manufacturers, packaging and testing houses, generated output value of NT$572.6 billion (US$18.9 billion) in the second quarter of 2017,...

Taiwan IC industry output value drops in 2Q17

TSMC approves new capex spending for capacity expansion

Aug 9, 12:26

Taiwan Semiconductor Manufacturing Company (TSMC) has approved the appropriation of around US$3.15 billion, which includes funding for new facilities construction with costs estimated...

Taiwan passive component makers post record July revenues

Aug 8, 10:53

Major Taiwan-based passive component makers including Yageo, Walsin Technology and Chilisin Electronics have reported record-high revenues for July 2017, thanks to a pick-up in customer...

Capacitor

SPIL July revenues rise 6%

Aug 8, 09:52

IC packaging and testing house Siliconware Precision Industries (SPIL) saw its July revenues climb to a 7-month high of NT$7.26 billion (US$240.1 million).

Global Unichip targeting AI sector

Aug 7, 14:44

Taiwan-based Global Unichip, an IC design service company partnering with Taiwan Semiconductor Manufacturing Company (TSMC), is looking to expand its business in the artificial intelligence...

Global Unichip partnering with TSMC to expand business in AI field

China market: Prices for LED packaging materials rise

Aug 7, 09:30

Due to tight supply, suppliers of materials used in LED packaging in the China market have hiked quotes and the increased prices are likely to remain in the fourth quarter of 2017,...

ASE likely to post over 10% revenue growth in 3Q17

Jul 31, 09:09

Packaging and testing company Advanced Semiconductor Engineering (ASE) is expected to report 10-13% sequential growth in consolidated revenues for the third quarter of 2017, with...

ASE

PTI optimistic about 3Q17

Jul 25, 21:46

Memory backend specialist Powertech Technology (PTI) expects its sales to peak in the third quarter, and remains optimistic about the outlook for the fourth quarter.

TSMC to expand CoWoS capacity to fill increasing AI chip packaging orders

Jul 24, 13:47

Taiwan Semiconductor Manufacturing Company (TSMC) is planning to carry out the first-ever expansion of its CoWoS (Chip on Wafer on Substrate) packaging and testing capacity to fill...

TSMC CoWoS packaging and testing capacity

TSMC InFO packaging brings more competitiveness to its 7nm process technology

Jul 20, 11:45

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...

Chipbond reportedly to sell partial stake in China subsidiary to BOE

Jul 19, 21:19

Speculation has circulated in the industry that Taiwan-based Chipbond Technology plans to sell part of its stake in its China-based subsidiary Chipmore Technology to BOE Technology...

Chipbond, ChipMOS seeing robust gold bumping demand

Jul 19, 15:37

Backend houses Chipbond Technology and ChipMOS Technologies have both cut into the supply chains of US and Korea smartphone brands with their gold bumping services, and are set to...

Global semiconductor equipment sales set to reach record high in 2017, says SEMI

Jul 12, 15:11

Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8% to total US$49.4 billion in 2017, marking the first time that the semiconductor equipment...

Sigurd to acquire half of Winstek via Bloomeria takeover

Jul 5, 22:20

IC testing company Sigurd Microelectronics has announced plans to acquire 100% of Singapore-based Bloomeria Limited, which will allow the Taiwan-based company to also obtain a more...

SPIL 2Q17 revenues rise, KYEC down

Jul 5, 21:58

IC packaging and testing house Siliconware Precision Industries (SPIL) saw its second-quarter revenues increase 4.5% sequentially, while revenues at fellow company King Yuan Electronics...

Tongfu Microelectronics to set up advanced IC backend plant in Xiamen, says report

Jun 27, 21:05

China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally...

China Big Fund commits investment of CNY85 billion

Jun 27, 15:43

China's National Semiconductor Industry Investment Fund (known as the Big Fund) has committed to invest CNY85 billion (US$12.4 billion) into the local IC industry, mainly the manufacturing...

Chipbond to see revenues peak in 3Q17

Jun 19, 15:20

Chipbond Technology, a backend house specializing in LCD driver ICs, is expected to see its third-quarter revenues peak for 2017 driven by a pull-in of orders from Japan-based clients,...

Packaging can extend physical limits of semiconductors, says TSMC chair

Jun 12, 15:41

Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...

TSMC chairman Morris Chang

China market: ASE re-submits application for planned merger with SPIL

Jun 9, 13:43

Advanced Semiconductor Engineering (ASE) has said its application submitted previously to China's antitrust regulators for a planned merger with Siliconware Precision Industry (SPIL)...

538 items [1/16]
  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Global notebook shipment forecast, 2017 and beyond
China AMOLED panel capacity expansion forecast, 2016-2020

20-Sep-2017 markets closed

 LastChange

TAIEX (TSE)10519.17-56.97-0.54% 

TSE electronic447.25-2.84-0.63% 

GTSM (OTC)142.07-0.40-0.28% 

OTC electronic210.41-0.69-0.33% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.