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News tagged packaging
  • Last update: Wednesday 2 September 2015 [435 news items]

SPIL looks to effective results of SiP packaging development with Foxconn

Sep 2, 11:22

Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit...

SPIL chairman Bough Lin

SPIL 2Q15 revenues meet low-end guidance

Jul 6, 21:57

Packaging and testing house Silicon Precision Industries (SPIL) saw its second-quarter revenues increase 2.1% sequentially to NT$21.24 billion (US$686.6 million), which met the low-end...

SPIL chairman Bough Lin expects business to hit bottom in June-July

PTI set to post revenue growth in 3Q15

Jul 3, 14:43

Memory packaging and testing house Powertech Technology (PTI) is set to enjoy revenue growth sequentially in the third quarter of 2015, thanks to a pick-up in demand for memory chips,...

IC backend set for tepid growth in 2H15, says ASE COO

Jun 24, 12:28

The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according...

Niching May sales rise 18%

Jun 10, 10:46

Semiconductor packaging material and equipment distributor Niching Industrial has reported consolidated revenues of NT$95 million (US$3.1 million) for May 2015, up 18% on month but...

Computex 2015: ASE to showcase SiP solutions

Jun 1, 15:49

Advanced Semiconductor Engineering (ASE) has announced it will be showcasing system-in-package (SiP) solutions for consumer applications at the Computex Taipei 2015. These SiP applications...

Packaging material supplier Chang Wah to distribute cash dividend of NT$3.50 for 2014

May 14, 16:45

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has decided to deal out a cash dividend per share of NT$3.50 (US$0.11) for 2014.

SPIL to see sales rebound in May, says paper

May 13, 21:25

IC packaging and testing company Siliconware Precision Industries (SPIL), which saw its revenues decrease 6.6% sequentially in April, is expected to see its May revenues rebound,...

TSMC InFO-WLP technology to generate significant revenues starting 2016

May 5, 22:25

Taiwan Semiconductor Manufacturing Company's (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry's...

Altera, TSMC develop UBM-free WLCSP packaging

Apr 7, 21:30

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...

SEMI reports 2014 semiconductor materials sales of US$44.3 billion

Apr 7, 13:59

The global semiconductor materials market increased 3% in 2014 compared to 2013, while worldwide semiconductor revenues increased 10%, according to SEMI. Revenues of US$44.3 billion...

Xintec to list on Taiwan OTC on March 30

Mar 25, 21:53

Image sensor packaging house Xintec will be listed on the Taiwan over-the-counter (OTC) stock market at a tentative price of NT$42 (US$1.34) per share on March 30, according to the...

Xintec 12-inch wafer-level CSP ready for volume production in 2H15, says chairman

Mar 17, 20:01

Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...

Xintec chairman Robert Kuan

National Instrument transforms Taiwan office to independent company

Mar 13, 15:59

National Instrument has announced it has transformed its branch office in Taiwan to become an independent company starting March and expects the company to achieve 20-40% on-year...

TSMC to offer InFO-WLP technology for 16nm chips, eyeing Apple orders

Feb 4, 13:45

Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple's...

SPIL gearing up for fan-out WLP

Jan 29, 19:39

Siliconware Precision Industries' (SPIL) fan-out type wafer level packaging (WLP) will be ready for mass production in 2016, company chairman Bough Lin said during a January 28 investors...

Chipbond, ChipMOS 1Q15 sales to drop 5-10%

Jan 19, 10:36

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are both expected to see their first-quarter 2015 sales decrease 5-10% sequentially, compared...

UTAC said to set up 12-inch wafer-level packaging line in Taiwan

Dec 23, 15:13

United Test and Assembly Center (UTAC), a Singapore-based assembly and test company, will continue its investment in Taiwan in 2015 by setting up a 12-inch wafer-level packaging line,...

Micron, PTI partner for assembly and packaging services in China

Stockwatch - Dec 3, 22:10

Micron Technology and Powertech Technology (PTI) have entered into a series of agreements forming the basis of a long-term strategic relationship for assembly and packaging services...

Over 100 China-based LED packaging houses to be forced out of competition in 2014

Dec 2, 22:10

Profitability for LED products is shrinking due to continual price drops along with increasing competition, and more than 100 relatively small China-based LED packaging service providers...

IC backend firms cautious about 2015 capex plans

Dec 2, 15:52

Having spent big in 2014, major Taiwan-based IC packaging and testing houses are cautious with their capital expenditures (capex) for 2015.

LED packaging houses to see 10% sequential drop in 4Q14 revenues

Nov 26, 15:27

Due to weak demand for LED backlighting and lighting, Taiwan-based LED packaging service providers are expected to see fourth-quarter 2014 consolidated revenues decrease 10% sequentially...

TSMC to offer InFO packaging for 16nm chips in 2016, says paper

Newswatch - Nov 21, 16:11

Taiwan Semiconductor Manufacturing Company (TSMC) will be able to offer its backend InFO (integrated fan-out) wafer-level packaging process for 16nm chips as soon as 2016, the Chinese-language...

Taiwan estimated to supply 20% of global IC packaging materials, says IEK

Nov 21, 15:37

Output from Taiwan-based IC packaging materials suppliers is forecast to account for about 20% of the global output in 2014 indicating the industry's less-competitive global presence...

Packaging material supplier Chang Wah swings to loss in 3Q14

Nov 17, 10:58

IC-packaging material and equipment supplier Chang Wah Electromaterials (CWE) has reported pre-tax losses of NT$17 million (US$553,000) for the third quarter of 2014, as affiliate...

Niching 3Q14 net profits soar 86% on year

Nov 13, 19:27

IC packaging material and tool distributor Niching Industrial saw its third-quarter net profits soar 86% from a year earlier, with revenues increasing 37%.

Demand for high-end packaging to stay strong in 4Q14, say materials suppliers

Nov 7, 10:47

Semiconductor materials suppliers expect demand for high-end packaging to remain strong and buoy their sales in the fourth quarter of 2014.

China LED packaging firms expanding capacity for 0.2-0.5W 2835 chips

Nov 4, 11:26

China-based LED packaging houses, including Leedarson Lighting and Yankong Lighting, have fully automated packaging lines for 0.2-0.5W 2835 (specification code) low-power LED chips...

LED packaging market to expand 3.2% in 2015

Oct 27, 22:12

The LED packaging industry's value is anticipated to only rise 3.2% on year from US$14.6 billion in 2014 to US$15 billion in 2015, according to LEDinside.

Semicon Taiwan 2014: Focus on new processing, packaging technologies

Sep 2, 22:13

Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...

IC packaging material distributor Niching looks to 5-10% sequential revenue growth in 3Q14

Aug 25, 13:38

IC packaging material and tool distributor Niching Industrial is expected to see its revenues grow 5-10% sequentially in the third quarter of 2014, buoyed by rising capacity utilization...

Everlight to expand monthly LED packaging capacity to 4 billion chips, says chairman

Jul 28, 10:09

Everlight Electronics started expanding its LED packaging capacity in June and when the expansion completes in September, its monthly capacity will have increased by 500 million LED...

Trends in mobile computing technologies and component packaging

Jun 6, 10:18

2.5D interposer packaging technologies are being used in products ranging from Intel's Haswell/Broadwell processors to AMD's mobile high-performance GPU chips. DDR4, which is about...

Asia Tech Image steps into packaging 13-megapixel smartphone-use lens modules, says paper

Newswatch - May 30, 12:19

Taiwan-based contact image sensor module maker Asia Tech Image has stepped into packaging 13-megapixel smartphone-use lens modules based on its COB (chip on board) process and will...

Altera-TSMC tie-up to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Newswatch - Apr 23, 15:13

Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's...

435 items [1/13]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Intel strategies in the mobile device market
Trends and forecasts for the China FPD industry, 2014-2017

4-Sep-2015 markets closed

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2015 global notebook demand forecast
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