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News tagged packaging
  • Last update: Thursday 20 April 2017 [491 news items]

PTI to enjoy robust demand for NAND flash

Apr 20, 10:25

Robust demand for NAND flash memory will boost revenues at packaging and testing company Powertech Technology (PTI) in the second half of 2017, according to industry sources.

Global semiconductor materials market grows 2.4% in 2016, says SEMI

Apr 5, 14:24

The global semiconductor materials market increased 2.4% in 2016 compared to 2015 while worldwide semiconductor revenues grew 1.1%, according to SEMI.

Greatek building high-end packaging capacity

Mar 28, 16:05

Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...

ASE says no plan to set up local site in US for packaging services

Mar 23, 21:09

Advanced Semiconductor Engineering (ASE) has a site in the US for IC testing, and has no plans to expand the site or build another locally for packaging services, according to company...

ase

ASE, KYEC to see sales pick up in 2Q17

Mar 14, 22:11

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and King Yuan Electronics (KYEC) will see their sales pick up starting in April, as shipments to their main...

SPIL February revenues fall

Mar 7, 11:46

IC packaging specialist Siliconware Precision Industries (SPIL) has announced consolidated revenues of NT$6 billion (US$193.9 million) for February 2017, down 12.8% sequentially and...

SPIL to enjoy another year of record revenues

Feb 8, 10:41

IC packaging specialist Siliconware Precision Industries (SPIL) will likely see its 2017 revenues hit a record high for the second consecutive year, according to market watchers.

Amkor to buy fellow packaging company Nanium

Feb 8, 10:39

Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to...

ASE orders equipment for NT$500 million

Stockwatch - Feb 3, 14:02

Packaging and testing company Advanced Semiconductor Engineering (ASE) has purchased equipment from Towa for a total of NT$500.44 million (US$16.1 million), according to a company...

SPIL posts EPS of NT$3.19 for 2016

Jan 24, 21:58

Siliconware Precision Industries (SPIL) saw its net profits increase 13.4% on year to NT$9.93 billion (US$316 million) in 2016 with EPS reaching NT$3.19. Non-operating gains led to...

Packaging material supplier Chang Wah secures syndicated loans

Newswatch - Jan 23, 10:19

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) and its LED leadframe subsidiary Chang Wah Technology (CWTC) have separately signed a syndicated loan with...

EIH cooperates with Texen to offer smart cosmetics packaging solution

Jan 20, 11:03

E Ink Holdings (EIH) has offered a smart packaging solution for cosmetics in cooperation with Texen, a France-based provider of luxury and beauty products. The smart solution integrates...

Smart cosmetics packaging solution jointly developed by EIH and Texen

TSMC collaborates with Mentor Graphics enabling design and verification tools for new InFO technology variants

Jan 12, 21:04

TSMC has extended its collaboration with Mentor Graphics on the Xpedition Enterprise platform in conjunction with the Calibre platform for the design and verification of TSMC's integrated...

PTI buys equipment from Disco

Stockwatch - Dec 27, 16:09

Powertech Technology (PTI), which provides backend services for the manufacture of memory chips as well as logic ICs, has purchased packaging equipment and spare parts from Disco...

China LED packaging service providers to keep expanding capacities in 2017

Dec 16, 11:11

China-based LED packaging service providers, in view of significantly growing demand for LED lighting, large-size LED displays and LED automotive lighting, will continue expanding...

PTI to enjoy particularly strong 1Q17

Dec 14, 21:42

Packaging and testing company Powertech Technology (PTI) is expected to enjoy a particularly strong first quarter of 2017 thanks to robust demand for DRAM and NAND flash chips, and...

ASE, VisEra obtain packaging orders for under-glass fingerprint sensors from Synaptics, says report

Newswatch - Nov 25, 16:06

Taiwan-based Advanced Semiconductor Engineering (ASE) and VisEra Technologies have both landed packaging orders for under-glass fingerprint sensors from Synaptics, according to a...

Packaging material supplier Chang Wah 3Q16 profits rise 68%

Nov 15, 15:08

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has reported net profits of NT$152 million (US$4.8 million) for the third quarter of 2016, up 67.8% sequentially,...

ASE ready to enter volume production of fan-out wafer-level packaging

Oct 26, 11:54

Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set...

PTI expects another quarter of record revenues

Oct 26, 11:46

Powertech Technology (PTI) expects its revenues to increase by a low single-digit percentage point sequentially in the fourth quarter of 2016, which will mark the second consecutive...

Digitimes Research: Nichia tops LED packaging service providers in 1H16 revenues

Oct 14, 11:16

Among LED packaging service providers around the world, Japan-based Nichia ranked first in LED revenues for the first half of 2016 with JPY126.58 billion (US$1.248 billion), followed...

E Ink Holdings, HTC, Palladio cooperate to develop smart packaging solution for pharmaceuticals

Oct 5, 15:19

EPD (electrophoretic display) maker E Ink Holdings (EIH), smartphone vendor HTC and Italy-based packaging solution provider Palladio Group have announced a jointly-developed smart...

Smart packaging solution for pharmaceuticals developed by EIH, HTC, Palladio

PTI buys wafer-level packaging equipment

Stockwatch - Sep 28, 14:08

Packaging and testing company Powertech Technology has purchased wafer-level packaging equipment from Ultratech SE Asia for NT$544 million (US$17 million), according to a company...

Cadence delivers integrated system design solution for TSMC InFO packaging technology

Sep 23, 10:55

Cadence Design Systems has announced the immediate availability of an integrated system design solution for TSMC's advanced wafer-level integrated fan-out (InFO) packaging technology,...

Applied Materials, IME to advance R&D in fan-out wafer-level packaging

Sep 20, 00:46

Applied Materials and the Institute of Microelectronics (IME), a research institute under Singapore's Agency for Science, Technology and Research, have announced a five-year extension...

CWTC listed on Taiwan OTC

Sep 14, 14:55

Chang Wah Technology (CWTC), which manufactures LED leadframe packaging materials, started trading on Taiwan's over-the-counter (OTC) stock market at an initial price of NT$102 (US$3.22)...

SEMICON Taiwan 2016: Advanced packaging remains in the spotlight

Sep 7, 12:22

Semicon Taiwan 2016 will kick off in Taipei from September 7-9, with advanced packaging remaining a major focus.

Demand from Taiwan chipmakers brisk, says Namics

Sep 2, 11:36

Demand from Taiwan-based Taiwan Semiconductor Manufacturing Company (TSMC), Siliconware Precision Industries (SPIL) and other chipmakers has been strong, according to Japan-based...

SPIL chairman calls for more open government policy

Aug 26, 10:18

Packaging and testing company Siliconware Precision Industries (SPIL) chairman Bough Lin has urged Taiwan's government to create a more open investment environment for China-based...

SPIL chairman Bough Lin

Micron to acquire Cando plant

Jul 21, 22:11

Micron Technology plans to buy touch panel maker Cando's plant in central Taiwan, which will be operated by Powertech Technology (PTI) to provide the US memory vendor packaging and...

All Ring June revenues hit record for 2nd straight month

Stockwatch - Jul 7, 14:45

Equipment maker All Ring Tech has reported consolidated revenues of NT$253 million (US$7.8 million) for June 2016, hitting a monthly record for the second consecutive month.

Everlight to expand packaging capacity to 5.8 billion LED chips

Jul 4, 10:54

LED packaging service provider Everlight Electronics will complete the construction of a factory in central Taiwan in third-quarter 2016, which will expand monthly LED chip packaging...

Amkor opens MEMS packaging line in China

Jul 4, 10:42

Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology has announced it is ramping up a new MEMS and sensor packaging line...

Taiwan backend firms seeing robust orders from HiSilicon

May 25, 11:10

Demand for HiSilicon's chips has been robust, according to sources at Taiwan-based IC backend firms, which have identified the China-based fabless IC vendor as one of their important...

Lextar to move part of Taiwan LED packaging capacity to China

May 23, 11:20

Vertically-integrated LED firm Lextar Electronics will move part of LED packaging capacity at its factory in Taiwan to its factory in Suzhou, eastern China, to reduce production cost,...

491 items [1/15]
Realtime news
  • MediaTek 2Q17 revenues to rise 10-15%

    Bits + chips | 12h 14min ago

  • EMEA traditional PC market returning to growth in 1Q17, says IDC

    IT + CE | 12h 35min ago

  • Galaxy S8 materials costs highest by far compared to previous versions, IHS teardown reveals

    Bits + chips | Apr 24, 20:32

  • Commentary: Motherboard players act passively about outcome of the market

    IT + CE | Apr 24, 20:30

  • Lenovo to push gaming products in Asia Pacific

    IT + CE | Apr 24, 19:39

  • Taiwan sees increased March manufacturing production index, says MOEA

    Bits + chips | Apr 24, 19:35

  • Digitimes Research: Biometric sensor product shipments expected to achieve CAGR of over 30% from 2017-2020

    Before Going to Press | 12h 5min ago

  • Gemtek Technology nets NT$0.63 per share for 1Q17

    Before Going to Press | Apr 24, 20:57

  • PCL Technologies to deal out 2016 dividend of NT$5.00

    Before Going to Press | Apr 24, 20:54

  • HTC unveils 3 VR applications

    Before Going to Press | Apr 24, 20:53

  • 100 million all-screen smartphones expected to be shipped globally in 2017

    Before Going to Press | Apr 24, 20:49

  • IC distributor Edom 2Q17 revenues to rise

    Before Going to Press | Apr 24, 20:47

  • Philips promoting healthcare business at IFA Global Press Conference 2017

    Before Going to Press | Apr 24, 20:47

  • Taiwan market: Population proportion for using mobile e-payment services aimed to rise to 50% by 2020

    Before Going to Press | Apr 24, 20:46

  • Adata posts EPS of NT$3.62 for 1Q17

    Before Going to Press | Apr 24, 20:43

  • Lextar Electronics buys back 2.03% stake

    Before Going to Press | Apr 24, 20:43

  • Copper foil maker Co-Tech positive about 2017 outlook

    Before Going to Press | Apr 24, 20:42

  • TSMC talks about its next growth drivers

    Before Going to Press | Apr 24, 20:42

  • Young Optics suffers net loss per share of NT$0.58 for 1Q17

    Before Going to Press | Apr 24, 20:41

  • Silicon wafer suppliers seeking to secure long-term contracts

    Before Going to Press | Apr 24, 20:33

  • GlobalWafers seeing robust semiconductor-grade silicon wafer demand

    Before Going to Press | Apr 24, 20:31

  • Taiwan market: Chunghwa Telecom sets 5-year plan to develop IoT applications

    Before Going to Press | Apr 24, 20:29

  • Delta Electronics showcasing smart workstation based on Internet of robots at Hannover Messe 2017

    Before Going to Press | Apr 24, 19:25

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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

24-Apr-2017 markets closed

 LastChange

TAIEX (TSE)9717.95+0.54+0.01% 

TSE electronic399.56-0.06-0.02% 

GTSM (OTC)130.08-1.26-0.96% 

OTC electronic182.46-2.54-1.37% 

Analysis of China revised domestic semiconductor industry goals
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    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.