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News tagged packaging
  • Last update: Friday 24 November 2017 [552 news items]

China Big Fund planning second round of support for local IC sector

Nov 24, 11:24

China's National Integrated Circuit Industry Investment Fund (known as the Big Fund) has raised an estimated CNY150-200 billion (US$22.8-30.4 billion) which will be spent for the...

OSE looks to swing back to profitability in 2018

Nov 22, 15:46

Memory backend specialist Orient Semiconductor Electronics (OSE) is looking to return to profitability by the first half of 2018 due partly to increasing packaging and testing orders...

ASE to expand WLCSP capacity at Singapore plant, sources say

Nov 21, 12:56

In the wake of robust demand for wearable devices and automotive electronics applications, packaging and testing company Advanced Semiconductor Engineering (ASE) is set to expand...

SPIL to build new factory in China

Nov 21, 12:52

Packaging and testing company Siliconware Precision Industries (SPIL) has gained land use rights for a 147,097-square meter industrial site located at the Fujian (Jinjiang) IC Industrial...

Austria chipmaker ams partners with China firm to develop 3D sensing camera solutions

Nov 17, 13:17

Austria-based ams and China-based Ningbo Sunny Opotech, an optical image system solution provider, have announced a collaboration to jointly develop and market 3D sensing camera solutions...

TSMC board passes US$4.29 billion budget for capacity expansion

Nov 15, 14:18

The board of directors of Taiwan Semiconductor Manufacturing Company (TSMC) has approved a budget of about US$4.29 billion mainly to construct new fab facilities and expand production...

SPIL October revenues almost flat on year

Nov 7, 11:07

Packaging and testing company Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$7.41 billion (US$245.5 million) for October 2017, up 1.2% on month but...

SPIL posts EPS of NT$1.74 for 1Q-3Q17

Oct 25, 13:27

IC packaging specialist Siliconware Precision Industries (SPIL) saw its net profits for the first three quarters of 2017 decline 23.8% from a year earlier to NT$5.41 billion (US$178.7...

PTI expects another quarter of record revenues in 4Q17

Oct 24, 13:51

Robust demand for flash memory chips will buoy further sales performance at Powertech Technology (PTI) in the fourth quarter of 2017, said the memory backend specialist at an October...

Smartphones and other mobile devices continue to boost memory chip demand

Taiwan OSAT firms busy packaging AMD GPUs for new iMacs

Oct 23, 15:42

While Apple has started to release more orders to AMD for high-end GPUs needed for new iMac series since September 2017, Taiwan-based outsourced semiconductor assembly and test (OSAT)...

Xintec to swing to profit in 4Q17, says report

Oct 17, 15:05

Image sensor packaging specialist Xintec is expected to return to profitability in the fourth quarter of 2017 with revenues likely to increase around 30% sequentially to nearly NT$1.3...

KYEC obtains key backend orders from MediaTek

Oct 16, 13:24

Testing house King Yuan Electronics (KYEC) has obtained orders for MediaTek's major products for 2018, including 12nm mobile SoCs, and chips solutions for voice assistant devices...

TSMC 3nm fab plan to create huge biz opportunities for supply chains

Oct 5, 14:06

The decision made by Taiwan Semiconductor Manufacturing (TSMC) to build its 3nm wafer fab in the Southern Taiwan Science Park has won acclaims from both member firms of the TSMC Grand...

Sigurd to enter board of Winstek

Sep 26, 10:30

Winstek Semiconductor (formerly STATS ChipPAC Taiwan Semiconductor) is scheduled to hold a shareholders meeting on November 15 to re-elect its board of directors. Sigurd Microelectronics...

SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology

Sep 18, 11:08

China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...

IC packager ASE reportedly enters Amazon supply chain

Sep 15, 11:04

Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

Taiwan diode maker HY Electronic to unveil new China plant in 2018

Sep 11, 12:03

Taiwan's leading diode maker HY Electronic will inaugurate its second plant in Yangzhou, China in the first half of 2018, to support production of automotive alternator rectifier...

David Fang, chairman of HY Electronic

SPIL obtains packaging orders for AMD Vega 11 GPUs

Sep 8, 15:17

AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...

TSMC CoWoS eyeing bigger presence in supercomputer field

ASE August revenues increase

Sep 8, 11:26

IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw its August revenues climb to the highest monthly levels thus far in 2017.

Upstream material suppliers in new iPhone supply chain to see strong growth

Sep 4, 15:09

With Apple expected to launch its new iPhone soon, Taiwan players in the US vendor's smartphone supply chain are warming up to embrace a new round of business boom, with the upstream...

Apple is expected to launch the new iPhone soon

Nidec to acquire SV Probe

Aug 29, 10:20

Japan-based Nidec has announced plans to acquire SV Probe, a Singapore-based probe card manufacturer, through subsidiary Nidec-Read. A stock purchase agreement has been reached between...

Backend firm Lingsen to post strong 3Q17, says report

Aug 28, 13:55

Taiwan-based backend service company Lingsen Precision Industries is expected to post its highest revenues since the third quarter of 2013 in third-quarter 2017, the Chinese-language...

Xintec loss widens in 1H17

Aug 25, 11:34

Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.

AMD Vega graphics cards in shortages

Aug 25, 11:10

AMD's new Radeon RX Vega series graphics cards, which have become available since August 15, are currently seeing tight supply in the retail channel reportedly due to an insufficient...

AMD Vega GPUs in shortages

Electric car vendor Thunder Power to build plants in Taiwan

Aug 16, 15:36

Hong Kong-based Thunder Power Holding has announced a new electric car in Taiwan and has also recently signed a letter of intent with a local government to establish plants for battery...

Globalfoundries demos 2.5D HBM solution

Aug 16, 09:33

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...

Globalfoundries intros solution leveraging 2.5D packaging with low-latency

Taiwan Chelic 2Q17 revenues rise 58% sequentially

Aug 15, 16:03

Pneumatic automation component maker Taiwan Chelic has reported its second-quarter 2017 consolidated revenues reached NT$418 million (US$14.09 million), up 58.33% sequentially, with...

SPIL to invest US$25 million in China

Aug 15, 10:27

Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...

Taiwan IC industry output value drops in 2Q17, says TSIA

Aug 10, 14:36

Taiwan's IC industry, consisting of designers, manufacturers, packaging and testing houses, generated output value of NT$572.6 billion (US$18.9 billion) in the second quarter of 2017,...

Taiwan IC industry output value drops in 2Q17

TSMC approves new capex spending for capacity expansion

Aug 9, 12:26

Taiwan Semiconductor Manufacturing Company (TSMC) has approved the appropriation of around US$3.15 billion, which includes funding for new facilities construction with costs estimated...

Taiwan passive component makers post record July revenues

Aug 8, 10:53

Major Taiwan-based passive component makers including Yageo, Walsin Technology and Chilisin Electronics have reported record-high revenues for July 2017, thanks to a pick-up in customer...

Capacitor

SPIL July revenues rise 6%

Aug 8, 09:52

IC packaging and testing house Siliconware Precision Industries (SPIL) saw its July revenues climb to a 7-month high of NT$7.26 billion (US$240.1 million).

Global Unichip targeting AI sector

Aug 7, 14:44

Taiwan-based Global Unichip, an IC design service company partnering with Taiwan Semiconductor Manufacturing Company (TSMC), is looking to expand its business in the artificial intelligence...

Global Unichip partnering with TSMC to expand business in AI field

China market: Prices for LED packaging materials rise

Aug 7, 09:30

Due to tight supply, suppliers of materials used in LED packaging in the China market have hiked quotes and the increased prices are likely to remain in the fourth quarter of 2017,...

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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

UMC
Global AP demand forecast, 2017-2020

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.