Last update: Tuesday 22 May 2012 [325 news items]
Packaging and testing firms see mobile DRAM orders rise
May 22, 14:07
Memory packaging and testing specialists including Powertech Technology (PTI) and Walton Advanced Engineering have both enjoyed a ramp-up in orders for mobile DRAM chips recently,...
LED lighting packaging price to drop nearly 10% in 2Q12
May 4, 16:58
Quoted prices for LED lighting packaging parts have dropped around 3% during the second quarter and could drop 10% due to packaging firms moving from backlighting applications to...
Tong Hsing expects revenue growth through 4Q12
Apr 24, 00:33
Tong Hsing Electronic Industries, which provides assembly and packaging services for niche ICs and produces ceramic substrates for the production of LED devices, has guided that its...
Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS
Apr 17, 14:55
LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...
Second-tier packaging and testing firms post sales growth in 1Q12
Apr 11, 14:16
Revenues at Taiwan's second-tier packaging-and-testing houses Giga Solution, Greatek Electronics, Lingsen Precision Industries and Thailin Semiconductor all registered single-digit...
Walton and FATC 1Q12 sales up, PTI down
Apr 10, 11:37
Memory IC packaging and testing firms have reported mixed results for the first quarter of 2012. Walton Advanced Engineering and Formosa Advanced Technologies (FATC) both saw their...
ASE, SPIL report slight decreases in 2011 revenues
Apr 3, 01:40
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) reported 2011 consolidated revenues that represented an on-year decrease of 1.8%...
Aptos expanding 12-inch wafer level packaging business
Mar 14, 14:30
Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...
Walton says 1Q12 revenues to hit bottom
Feb 17, 01:15
Walton Advanced Engineering expects sales to register sequential growth starting the second quarter after hitting bottom in the first. The memory-IC backend service provider has also...
South Korea-based LED makers beat out Taiwan makers in LED packaging market share
Feb 14, 15:40
Samsung LED, LG Innotek, Seoul Semiconductors, and other South Korea-based makers together occupied 26% of the global production value for LED packaging in 2011, higher than the 19%...
Lextar operates in the red in 2011
Feb 10, 11:01
Taiwan-based LED firm Lextar Electronics has reported net losses of NT$138 million (US$4.67 million) or NT$0.34 per share for 2011. It also reported consolidated revenues of NT$650...
PTI 1Q12 sales to drop up to 10%, says chairman
Feb 10, 01:30
Memory packaging and testing specialist Powertech Technology (PTI) now expects its sales to decrease up to 10% sequentially in the first quarter of 2012, company chairman DK Tsai...
ASE, SPIL post sales drops in January
Feb 9, 01:40
IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...
Packaging and testing firms to post 5-10% drop in 1Q12
Jan 20, 01:05
Revenues at semiconductor packaging and testing houses will likely register a 5-10% sequential decrease in the first quarter of 2012, affected by fewer working days, according to...
Chang Wah seeing orders for driver IC-use packaging materials surge
Jan 19, 17:00
Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects orders for COF (chip-on-film) packaging materials...
LED chipmakers and packaging firms suffer revenue declines in December
Jan 10, 15:58
Affected by seasonal factors, most Taiwan-based LED chipmakers and LED packaging companies have posted declines in revenues for December, with the setbacks suffered by upstream chipmakers...
Jan 5, 01:00
Taiwan-based Shenmao Technology, which manufactures solder materials for IC assembly, has set up an office in Japan with the aim to cut into the supply chain of the country's first-tier...
PTI buys Nexx tool for advanced packaging
Jan 4, 15:49
IC packaging and testing house Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems. The Nexx Stratus will be used for copper...
Solder material maker Shenmao expects drop in 1Q12 sales
Jan 3, 13:48
Shenmao Technology expects its consolidated revenues to decrease 5-10% sequentially in the first quarter of 2012, citing seasonal factors as well as fewer working days due to Lunar...
Walton 1Q12 sales to decrease 5-10%
Jan 3, 01:10
Memory-IC packaging and testing specialist Walton Advanced Engineering expects its revenues to drop by another 5-10% sequentially in the first quarter following an almost 20% sequential...
Dec 30, 16:48
Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, has stepped into high-end packaging of multiple LED chips, according to company vice...
Rohm reportedly places backend orders with Taiwan firms
Dec 29, 15:02
Rohm has released orders to ChipMOS Technologies and other Taiwan-based mid-scale packaging and testing firms over the last two months to avoid supply-chain disruptions caused by...
PTI looking to become world No. 4 packaging, testing firm
Dec 26, 12:13
Powertech Technology's (PTI) plan to acquire a controlling stake in Greatek Electronics will further expand its backend service offerings and production capacity for the logic IC...
LCD market to rebound in 2Q12, says Chipbond
Dec 22, 01:05
Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...
IC packaging materials market to reach US$25.7 billion by 2015, says SEMI
Dec 16, 13:58
The market for semiconductor packaging materials, including thermal interface materials, is expected to reach US$22.8 billion in 2011 and grow to US$25.7 billion by 2015, according...
Copper pillar bump penetration of FC packaging to rise
Nov 29, 12:25
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...
ChipMOS to expand logic IC business
Nov 24, 01:05
Packaging and testing firm ChipMOS Technologies has revealed plans to place a greater emphasis on logic chips, expecting sales ratio for the segment to expand to 20-25% within the...
Taiwan LED packaging houses outperform chipmakers in October
Nov 16, 15:00
Total revenues of Taiwan-based publicly traded LED firms in October 2011 reached NT$7.69 billion (US$255 million), a 3.47% decrease on month and 10.2% decrease on year. The revenue...
STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper
Newswatch - Nov 14, 16:40
STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...
Laser Tek expects November, December revenues to fall
Nov 10, 16:14
Laser Tek, a supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment, expects to report on-month drops in revenues for November and December. Passive...
Price of LED packaging may reach 1,000lm/US$ in 2015
Nov 10, 15:40
The LED lighting industry has been targeting a price for LED packaging to reach 500lm/US$ in 2012 and hit the threshold of 1,000lm/US$ in 2015. This target is five years ahead of...
PTI to reduce reliance on PC DRAM
Oct 28, 01:20
Packaging and testing house Powertech Technology (PTI) plans to lower the proportion of standard DRAM products in company revenues to less than 70% in the first quarter of 2012, and...
Xilinx shipping new FPGA built on TSMC 28nm process
Oct 27, 10:12
Xilinx has announced the first shipments of its Virtex-7 2000T FPGA, the first product using 2.5D IC stacked packaging technology. The chip is built on TSMC's 28nm HPL (low power...
SPIL sees 4-8% decline in 4Q11 revenues on lower utilization
Oct 27, 01:00
Semiconductor packaging and testing company Silicon Precision Industries (SPIL) has forecast revenues will decrease 4-8% sequentially in the fourth quarter of 2011, citing slowing...
Integration a must for packaging and testing industry, says ASE chairman
Oct 24, 15:04
If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits, according to Jason Chang, chairman...
North America fab tool book-to-bill slips in April 2012, says SEMI
Bits + chips | 18min ago
TSMC 3Q12 revenues to grow at a slower pace than expected, say sources
Bits + chips | 1h 7min ago
Taiwan April unemployment rate slightly down
IT + CE | 3h 5min ago
China market: Energy-saving subsidies expected to boost sales of LCD TVs
Displays | 3h 14min ago
New e-book readers face production issues with front light panel
Displays | 3h 23min ago
China and Taiwan LED firms sign agreement in Zhengzhou China
LED | 3h 40min ago
China government focuses on illegal imports of waste materials that carry polysilicon
Green energy | 3h 48min ago
HiSilicon licenses ARM Mali GPUs for smart connected devices
Bits + chips - Newswatch | 3h 52min ago
IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...
Photo: Company, Oct 13.
Applied Producer InVia dielectric deposition system
Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...
Photo: Company, Mar 31.
Samsung 0.6mm-thick multi-chip memory package
Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...
Photo: Company, Nov 10.
Finetech Japan 2009: Ito Electronics' water-proof OLED display
Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.
Photo: Jessie Lin, Digitimes, Apr 21.
Profitability more important than ranking: Q&A with UTAC president and CEO JC Lee
Being one of the top-ten IC packaging and testing companies in terms of sales, United Test and Assembly Center (UTAC) stresses the importance of profitability rather than ranking,...
- June TV panel prices to be flat
- Asustek, Acer to see 10% of notebook shipments in 2012 feature touchscreen panels
- LED industry enjoys high capacity utilization rates in 2Q12
- Solar wafer firms inclined to follow solar cell firms to increase quotes
- Compal lands notebook ODM orders from Samsung
- 3M announces commercial availability of FTB3 barrier film
- Linde expands TFT-LCD footprint in China with gas contract for Samsung in Suzhou
- Weltrend expects to turn into profitability in 2Q12
- Silicon Power Computer & Communications to list on OTC
- Eris Technology to list on OTC at the end of June
- AMD prepares low-voltage CPUs for Windows 8 tablet PCs
- Some China solar cell makers looking for Taiwan partnerships
- Taiwan solar firms fear turning into OEM firms for China
- GET refutes production suspension of thin-film solar products
- Packaging and testing firms see mobile DRAM orders rise
- Rexchip shares at stake between Micron-Elpida deal, say sources
- Taiwan market: WiMAX operator Global Mobile obtains NT$640 million loan
- Acer, Asustek to launch netbooks with upgraded Atom processor in 3Q12
- CMI, AUO see decreasing production costs due to declining equipment depreciation costs
- Intel pushes new battery solutions to reduce ultrabook cost
- Mighty Bright showcasing LED lighting lineup at the National Stationery Show in New York
- International smartphones vendors worried about insufficient LTE chip supply
- Taiwan LED manufacturers to use silicon substrates for producing LED chips
- China TV makers to further expand products abroad
- China market: 6.8 million iPhones shipped in 1Q12, says Digitimes Research
- Digitimes Research: Embedded and standalone integration in NFC IC development
- Digitimes Research: Solar spot prices in Greater China freeze before final verdict of anti-dumping and anti-subsidy investigation
- Digitimes Research: Solar spot prices in Greater China remain flat despite continuous demand from Europe
- Digitimes Research: April 1 solar FIT cuts in Germany to negatively impact solar spot prices
- Releases
- White papers
- Bulletin
- iPV Tracker: TOPPER SUN's intelligent solar tracking system that adjusts the position of PV modules automatically to track the sun can increase the power yield by 30-40%
- Glacialight is pleased to expand its Navi Series LED Flood Light Line into DC
- Advantech Makes Testing More Effective, Advancing Intelligent Vehicle Inspection
- Digi-Key launches new website for Israel
- Kick-off for the latest LED technology from Osram Opto Semiconductors
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Fujitsu converts Fujitsu Toshiba Mobile Communications into a wholly owned subsidiary
- NEC reaks the speed barriers of microwave transmission with ultra high modulations
- ATO Solution to launch 256Mb SLC NAND Flash - for the first time in fabless industry
- LSI completes acquisition of SandForce
- NEC develops super-resolution technologies for fine magnification of surveillance camera images
23-May-2012 markets closed
| Last | Change |
| TAIEX (TSE) | 7147.75 | -127.14 | -1.75% |
| TSE electronic | 271.94 | -5.69 | -2.05% |
| GTSM (OTC) | 103.29 | -1.28 | -1.22% |
| OTC electronic | 132.45 | -1.69 | -1.26% |
- Thousands protest Taiwan leader's inauguration (May 19) - AP (via Google)
- 40% of employees in Asia/Pacific will be mobile workers by 2015, says IDC (May 14) - IDC
- Globalfoundries welcomes President Barack Obama (May 4) - Company release
- India gives 4G to Qualcomm at last (May 8) - Tech Eye.net
- Abu Dhabi fund Mubadala plans US$5.5 billion spending in 2012 (May 9) - Reuters
- French, Greek voters say no to austerity (May 7) - Washington Post
- SK Hynix won't bid for Elpida (May 3) - Wall Street Journal
- Google, authors go head to head over digital books (May 3) - Reuters
Photo: Company, May 21.
Photo: Company, May 21.
Photo: Company, May 17.
Photo: Company, May 17.
Photo: Company, May 11.
Photo: Michael McManus, May 10.
Maxim's Chris Neil, senior VP, Industrial and Medical Solutions Group
Photo: Michael McManus, May 10.
Ravi Subramanian, CEO of EDA firm Berkeley Design Automation
Photo: Michael McManus, May 10.
Algotochip CTO Satish Padmanabhan and company VP of operations Mike Hong
Photo: Michael McManus, May 10.
Photo: Company, May 4.
Photo: Company, May 4.
Photo: Company, May 2.
- Commentary: A Micron-Elpida merger would improve DRAM industry health
- Simon Sze and his invention of floating-gate NVM
- Commentary: Long-term solar material supply contracts increase losses during industry downturns
- Commentary: Grid parity in India may happen sooner than expected
- Commentary: US protectionism on domestic solar industry may backfire
Keeping industrial interesting: Q&A with analog and mixed signal solution provider Maxim
According to analog and mixed-signal semiconductor maker Maxim Integrated Products, the industrial...
Over the next 30 years, the world's middle class (defined as per capita income of more than US$8,000...
Turning C code into silicon in 8-16 weeks: Q&A with semi startup Algotochip
Silicon Valley startup Algotochip specializes in architecting and implementing all aspects of a complete...
The rise of China Star Optoelectronics Technology: Q&A with CEO He Chengming
The ramping-up of 8.5G production at China-based BOE Technology and China Star Optoelectronics Technology...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- Taiwan motherboard industry overview - Jun 2011
The motherboard industry began 2010 with optimism and expected to see a reversal of the previous two years' declines in revenues and shipments as the impact of...
- Taiwan DRAM module industry overview - Jun 2011
The year 2010 represented a peak in recent years for the DRAM module industry. Optimism surfaced in the second half of 2009 thanks to a return of demand on the...
- Overview of the Greater China small- to medium-size TFT LCD industry
This DIGITIMES Research Special Report provides a comprehensive overview of the players and market direction of panel makers in the Greater China region, as well as outlining the potential market influence of OLEDs.
- Standards and scale of Asia LED lighting markets
Digitimes Research projects marked growth in LED markets across Asia over the next five years. This Digitimes Research Special Report provides an overview of the standards in the major LED lighting markets in Asia.
- Development of electronics manufacturing bases in China central and western regions
The recently published 12th Five Year Plan clearly states the intention to reform the industrial structure. Central government policy has succeeded in making the central and western regions the most important manufacturing sites for the coming decade.