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News tagged packaging
  • Last update: Wednesday 24 May 2017 [501 news items]

ASE lands FOWLP packaging orders from Infineon, says paper

Newswatch - May 24, 12:08

Advanced Semiconductor Engineering (ASE) has reportedly secured orders for providing fan-out wafer-level packaging (FOWLP) service for Infineon Technologies' power management (PWM)...

ASE, SPIL get US antitrust approval

May 17, 14:36

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have received approval from US antitrust regulators for their proposed merger, according to the...

Packaging material distributor Chang Wah posts high EPS for 1Q17

Newswatch - May 16, 15:11

Semiconductor and packaging material and equipment supplier Chang Wah Electromaterials (CWE) has reported net profits of NT$334 million (US$11.095 million) for the first quarter of...

TSMC obtains 12nm chip orders from fabless firms

May 11, 11:59

Taiwan Semiconductor Manufacturing Company (TSMC) has secured 12nm chip orders from Nvidia, MediaTek, Silicon Motion Technology and HiSilicon for the fabless firms' different chip...

PTI April revenues increase

May 8, 23:00

Packaging and testing company Powertech Technology (PTI) has reported consolidated revenues of NT$4.36 billion (US$144.4 million) for April 2017, up 20.7% on year and 2.1% sequenti...

ASE posts profit decrease in 1Q17

May 2, 10:59

Packaging and testing company Advanced Semiconductor Engineering (ASE) saw its profits fall to a 4-year low in the first quarter of 2017.

Cree to set up LED packaging joint venture with San'an Optoelectronics

Apr 27, 12:03

Cree has announced it is forming a joint venture with San’an Optoelectronics to produce and deliver to market high-performing, mid-power lighting class LED packaged products.

SPIL posts profit drop in 1Q17

Apr 27, 11:10

IC packager Siliconware Precision Industries (SPIL) has reported net profits of NT$996 million (US$33.1 million) for the first quarter of 2017, down 64.8% sequentially and 37.9% on...

Micron talks about its integrated global operations

Apr 26, 15:37

Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...

Wayne Allan, VP of global manufacturing at Micron

PTI looks to sequential revenue growth through 4Q17

Apr 26, 11:09

Packaging and testing company Powertech Technology (PTI) expects to post mid single-digit sequential growth in revenues for the second quarter of 2017, said company president JY Hung...

PTI to enjoy robust demand for NAND flash

Apr 20, 10:25

Robust demand for NAND flash memory will boost revenues at packaging and testing company Powertech Technology (PTI) in the second half of 2017, according to industry sources.

Global semiconductor materials market grows 2.4% in 2016, says SEMI

Apr 5, 14:24

The global semiconductor materials market increased 2.4% in 2016 compared to 2015 while worldwide semiconductor revenues grew 1.1%, according to SEMI.

Greatek building high-end packaging capacity

Mar 28, 16:05

Logic IC packaging firm Greatek Electronics will start production for bumping and wafer-level CSP in July 2017 which will further buoy its sales performance for the year, according...

ASE says no plan to set up local site in US for packaging services

Mar 23, 21:09

Advanced Semiconductor Engineering (ASE) has a site in the US for IC testing, and has no plans to expand the site or build another locally for packaging services, according to company...

ase

ASE, KYEC to see sales pick up in 2Q17

Mar 14, 22:11

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and King Yuan Electronics (KYEC) will see their sales pick up starting in April, as shipments to their main...

SPIL February revenues fall

Mar 7, 11:46

IC packaging specialist Siliconware Precision Industries (SPIL) has announced consolidated revenues of NT$6 billion (US$193.9 million) for February 2017, down 12.8% sequentially and...

SPIL to enjoy another year of record revenues

Feb 8, 10:41

IC packaging specialist Siliconware Precision Industries (SPIL) will likely see its 2017 revenues hit a record high for the second consecutive year, according to market watchers.

Amkor to buy fellow packaging company Nanium

Feb 8, 10:39

Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to...

ASE orders equipment for NT$500 million

Stockwatch - Feb 3, 14:02

Packaging and testing company Advanced Semiconductor Engineering (ASE) has purchased equipment from Towa for a total of NT$500.44 million (US$16.1 million), according to a company...

SPIL posts EPS of NT$3.19 for 2016

Jan 24, 21:58

Siliconware Precision Industries (SPIL) saw its net profits increase 13.4% on year to NT$9.93 billion (US$316 million) in 2016 with EPS reaching NT$3.19. Non-operating gains led to...

Packaging material supplier Chang Wah secures syndicated loans

Newswatch - Jan 23, 10:19

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) and its LED leadframe subsidiary Chang Wah Technology (CWTC) have separately signed a syndicated loan with...

EIH cooperates with Texen to offer smart cosmetics packaging solution

Jan 20, 11:03

E Ink Holdings (EIH) has offered a smart packaging solution for cosmetics in cooperation with Texen, a France-based provider of luxury and beauty products. The smart solution integrates...

Smart cosmetics packaging solution jointly developed by EIH and Texen

TSMC collaborates with Mentor Graphics enabling design and verification tools for new InFO technology variants

Jan 12, 21:04

TSMC has extended its collaboration with Mentor Graphics on the Xpedition Enterprise platform in conjunction with the Calibre platform for the design and verification of TSMC's integrated...

PTI buys equipment from Disco

Stockwatch - Dec 27, 16:09

Powertech Technology (PTI), which provides backend services for the manufacture of memory chips as well as logic ICs, has purchased packaging equipment and spare parts from Disco...

China LED packaging service providers to keep expanding capacities in 2017

Dec 16, 11:11

China-based LED packaging service providers, in view of significantly growing demand for LED lighting, large-size LED displays and LED automotive lighting, will continue expanding...

PTI to enjoy particularly strong 1Q17

Dec 14, 21:42

Packaging and testing company Powertech Technology (PTI) is expected to enjoy a particularly strong first quarter of 2017 thanks to robust demand for DRAM and NAND flash chips, and...

ASE, VisEra obtain packaging orders for under-glass fingerprint sensors from Synaptics, says report

Newswatch - Nov 25, 16:06

Taiwan-based Advanced Semiconductor Engineering (ASE) and VisEra Technologies have both landed packaging orders for under-glass fingerprint sensors from Synaptics, according to a...

Packaging material supplier Chang Wah 3Q16 profits rise 68%

Nov 15, 15:08

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has reported net profits of NT$152 million (US$4.8 million) for the third quarter of 2016, up 67.8% sequentially,...

ASE ready to enter volume production of fan-out wafer-level packaging

Oct 26, 11:54

Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set...

PTI expects another quarter of record revenues

Oct 26, 11:46

Powertech Technology (PTI) expects its revenues to increase by a low single-digit percentage point sequentially in the fourth quarter of 2016, which will mark the second consecutive...

Digitimes Research: Nichia tops LED packaging service providers in 1H16 revenues

Oct 14, 11:16

Among LED packaging service providers around the world, Japan-based Nichia ranked first in LED revenues for the first half of 2016 with JPY126.58 billion (US$1.248 billion), followed...

E Ink Holdings, HTC, Palladio cooperate to develop smart packaging solution for pharmaceuticals

Oct 5, 15:19

EPD (electrophoretic display) maker E Ink Holdings (EIH), smartphone vendor HTC and Italy-based packaging solution provider Palladio Group have announced a jointly-developed smart...

Smart packaging solution for pharmaceuticals developed by EIH, HTC, Palladio

PTI buys wafer-level packaging equipment

Stockwatch - Sep 28, 14:08

Packaging and testing company Powertech Technology has purchased wafer-level packaging equipment from Ultratech SE Asia for NT$544 million (US$17 million), according to a company...

Cadence delivers integrated system design solution for TSMC InFO packaging technology

Sep 23, 10:55

Cadence Design Systems has announced the immediate availability of an integrated system design solution for TSMC's advanced wafer-level integrated fan-out (InFO) packaging technology,...

Applied Materials, IME to advance R&D in fan-out wafer-level packaging

Sep 20, 00:46

Applied Materials and the Institute of Microelectronics (IME), a research institute under Singapore's Agency for Science, Technology and Research, have announced a five-year extension...

501 items [1/15]
Realtime news
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    Before Going to Press | 11h 45min ago

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    Before Going to Press | 11h 48min ago

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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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24-May-2017 09:45 (GMT+8)

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