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News tagged packaging
  • Last update: Wednesday 25 May 2016 [458 news items]

Taiwan backend firms seeing robust orders from HiSilicon

May 25, 11:10

Demand for HiSilicon's chips has been robust, according to sources at Taiwan-based IC backend firms, which have identified the China-based fabless IC vendor as one of their important...

Lextar to move part of Taiwan LED packaging capacity to China

May 23, 11:20

Vertically-integrated LED firm Lextar Electronics will move part of LED packaging capacity at its factory in Taiwan to its factory in Suzhou, eastern China, to reduce production cost,...

STATS ChipPAC fan-out wafer-level packaging shipments exceed 1 billion units

May 11, 14:45

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company...

PTI to buy factory building from Epistar for NT$620 million

Stockwatch - May 5, 21:51

IC packaging and testing company Powertech Technology (PTI) has announced the acquisition of a factory building and related facilities from LED chipmaker Epistar for a total of NT$620...

Driver-IC backend houses lower quotes to woo orders

Apr 26, 22:32

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies have both decided to lower their quotes following in the footsteps of their China- and South...

Price competition among LCD driver IC firms heating up

Taiwan university develops aluminum ball bonding technology

Apr 25, 10:42

While copper wire is considered a cheaper alternative to gold wire for ball wire bonding used in semiconductor packaging, a process based on aluminum wire has been developed by Taiwan's...

Aluminum wire developed for use in semiconductor packaging

China backend houses expand into advanced-process segment

Apr 1, 13:58

China-based IC packaging and testing houses are vying for more orders, particularly those requiring advanced technologies, from Taiwan-based IC design houses, according to industry...

ASE fails to gain antitrust approval for SPIL bid

Mar 17, 11:57

Advanced Semiconductor Engineering (ASE) will be unable to win antitrust approval in Taiwan by March 17 - the deadline of its tender offer for another 24.71% stake in Siliconware...

Cadence launches complete IC packaging design and analysis solutions for fan-out WLCSP

Mar 16, 11:03

Cadence Design Systems has announced the availability of foundry-proven IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and...

New Kinpo to start trial production at Brazil NAND flash plant in May

Mar 14, 14:33

Taiwan-based New Kinpo Group expects construction of a NAND flash packaging factory in Brazil to complete by the end of March with trial production to begin in May, according to the...

Xintec February revenues rise 30% on month

Mar 14, 11:38

Taiwan-based Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...

MLS to extend packaging from LEDs to ICs, says president

Mar 1, 15:52

The largest China-based LED packaging service provider MLS will extend business operations to IC packaging and testing services, according to company president Lawrence Lin.

MLS president Lawrence Lin

SPIL to deal out cash dividend per share of NT$3.80 for 2015

Feb 25, 13:58

IC packager Siliconware Precision Industries (SPIL) has decided to distribute a cash dividend per share of NT$3.80 (US$0.11) for 2015, according to a resolution passed by the company's...

Digitimes Research: IC manufacturers to cross into packaging industry

Feb 19, 15:38

With IT products such as smartphone and Internet of Things (IoT) devices being designed with considerations of high performance, low cost, low power consumption and small form factor,...

ASE, SPIL set to report robust profits for 2015

Jan 20, 14:44

Advanced Semiconductor Engineering (ASE) is expected to see its 2015 profits hit the second-highest level in the company's history, while fellow packaging and testing company Siliconware...

ChipMOS to expand production capacity for LCD driver ICs

Dec 24, 15:15

Packaging and testing company ChipMOS Technologies is expected to expand production capacity for LCD driver ICs during 2016 as the company is positive about Ultra HD TV demand, according...

Advanced semiconductor packaging drives materials consumption through 2019, says SEMI

Dec 15, 15:54

The US$18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC...

TSMC to provide backend InFO packaging technology for Apple chips, says report

Newswatch - Dec 11, 10:48

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apple will be among the first wave of...

TSMC raises holdings in affiliate Xintec

Stockwatch - Nov 27, 10:06

Taiwan Semiconductor Manufacturing Company (TSMC) has hiked its holdings in affiliate Xintec to more than 51%, as a result of the addition of two new subsidiaries to TSMC, Xintec...

Commentary: Taiwan IC backend firms facing challenge from fast expanding China competitors

Nov 26, 16:23

A recent media report indicating that China-based Jiangsu Changjing Electronics Technology (JCET) has landed SiP (system-in-package) module orders from Apple could serve as a warning...

ASE to expand workforce at Chungli facility

Nov 26, 10:22

Advanced Semiconductor Engineering (ASE) will expand the workforce at its manufacturing site in Chungli, northern Taiwan to 15,000 from the current 9,000, as sales generated from...

ChipMOS to expand business in China

Nov 2, 10:39

Acknowledging robust demand from China-based panel makers including BOE Technology and China Star Optoelectronics Technology (CSOT), LCD driver IC backend houses such as ChipMOS Technologies...

Cadence offers design tools for TSMC InFO packaging

Sep 23, 15:58

Cadence Design Systems has announced that its Allegro system-in-package (SiP) and physical verification system (PVS) implementation technologies have been enabled for TSMC's integrated...

SPIL looks to effective results of SiP packaging development with Foxconn

Sep 2, 11:22

Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit...

SPIL chairman Bough Lin

SPIL 2Q15 revenues meet low-end guidance

Jul 6, 21:57

Packaging and testing house Silicon Precision Industries (SPIL) saw its second-quarter revenues increase 2.1% sequentially to NT$21.24 billion (US$686.6 million), which met the low-end...

SPIL chairman Bough Lin expects business to hit bottom in June-July

PTI set to post revenue growth in 3Q15

Jul 3, 14:43

Memory packaging and testing house Powertech Technology (PTI) is set to enjoy revenue growth sequentially in the third quarter of 2015, thanks to a pick-up in demand for memory chips,...

IC backend set for tepid growth in 2H15, says ASE COO

Jun 24, 12:28

The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according...

Niching May sales rise 18%

Jun 10, 10:46

Semiconductor packaging material and equipment distributor Niching Industrial has reported consolidated revenues of NT$95 million (US$3.1 million) for May 2015, up 18% on month but...

Computex 2015: ASE to showcase SiP solutions

Jun 1, 15:49

Advanced Semiconductor Engineering (ASE) has announced it will be showcasing system-in-package (SiP) solutions for consumer applications at the Computex Taipei 2015. These SiP applications...

Packaging material supplier Chang Wah to distribute cash dividend of NT$3.50 for 2014

May 14, 16:45

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has decided to deal out a cash dividend per share of NT$3.50 (US$0.11) for 2014.

SPIL to see sales rebound in May, says paper

May 13, 21:25

IC packaging and testing company Siliconware Precision Industries (SPIL), which saw its revenues decrease 6.6% sequentially in April, is expected to see its May revenues rebound,...

TSMC InFO-WLP technology to generate significant revenues starting 2016

May 5, 22:25

Taiwan Semiconductor Manufacturing Company's (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry's...

Altera, TSMC develop UBM-free WLCSP packaging

Apr 7, 21:30

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...

SEMI reports 2014 semiconductor materials sales of US$44.3 billion

Apr 7, 13:59

The global semiconductor materials market increased 3% in 2014 compared to 2013, while worldwide semiconductor revenues increased 10%, according to SEMI. Revenues of US$44.3 billion...

Xintec to list on Taiwan OTC on March 30

Mar 25, 21:53

Image sensor packaging house Xintec will be listed on the Taiwan over-the-counter (OTC) stock market at a tentative price of NT$42 (US$1.34) per share on March 30, according to the...

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Realtime news
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    Before Going to Press | May 31, 19:57

  • Elan fingerprint sensor shipments to reach 2 million units in 3Q16

    Before Going to Press | May 31, 19:56

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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Computex 2016
Display panels for wearable devices

27-May-2016 markets closed

 LastChange

TAIEX (TSE)8394.12+49.68+0.6% 

TSE electronic334.69+3.07+0.93% 

GTSM (OTC)125.99+0.53+0.42% 

OTC electronic159.16+1.27+0.8% 

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