Last update: Thursday 31 January 2013 [17 news items]
Scientech deepens development of 3D IC, wafer-level packaging equipment
Jan 31, 16:04
Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...
ChipMOS expects sales growth in 2012
Mar 19, 16:15
Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...
Aptos expanding 12-inch wafer level packaging business
Mar 14, 14:30
Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...
STATS ChipPAC intros new 3D eWLB PoP solutions
Mar 7, 11:35
STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...
STATS ChipPAC breaks ground for new factory
Jan 6, 01:20
STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...
Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon
Nov 21, 13:48
Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...
STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper
Newswatch - Nov 14, 16:40
STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...
PTI developing advanced packaging technologies
Jul 1, 01:10
Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...
ASE aims at global market share of 25-30% in 2014
Jun 29, 01:00
IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) aims to hike its global market share from 17-18% in 2010 to 25-30% in 2014, COO Tien Wu said at the...
STATS ChipPAC expands WLP offering with 12-inch manufacturing in Taiwan
Jan 18, 12:00
STATS ChipPAC has announced the expansion of its wafer-level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsinchu...
ASE to budget US$700 million in capex for 2011, says paper
Newswatch - Oct 4, 17:00
IC packaging and testing house Advanced Semiconductor Engineering (ASE) plans to budget US$700 million in capex for 2011, flat on year, an unnamed company executive has been cited...
STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing
Sep 15, 15:33
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
SPIL enters LED packaging market
Sep 14, 15:26
Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...
Aptos invests in ACE to enhance wafer-level package offering
Nov 30, 16:51
Aptos Technology, a 20%-held packaging and testing affiliate of Phison Electronics, has announced it recently acquired an 87% stake in wafer-level packaging (WLP) house Advanced Chip...
Plant fire at KYEC affiliate ACE, reports paper
Newswatch - Oct 7, 16:57
Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a...
STATS ChipPAC expanding capacity for wafer-level packaging
Jun 17, 14:35
STATS ChipPAC has announced it is expanding capacity for full turnkey wafer-level packaging in its Singapore operation. The IC packaging and testing service provider said it is on...
Integrated handheld solutions driving demand for wafer-level packaging, says ASE
Apr 13, 16:00
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Taiwan market: LG launches waterproof smartphone
Mobile + telecom | 4h 27min ago
Hermes to see revenues grow higher than 10% sequentially in 2Q13
Bits + chips | 4h 39min ago
Foxconn able to produce carbon nanotube touch panel sizes up to 10-inch
Displays | 4h 54min ago
Buynow expects EPS of at least NT$4.50 for 2013
IT + CE | 4h 56min ago
Elan shipping touchscreen controller ICs for new Nexus 7
Bits + chips | 4h 58min ago
Samsung showcases new displays at SID 2013
Displays | 5h 40min ago
E Ink unveils low temperature matrix electronic paper display for freezers
Displays | 5h 51min ago
UMC Singapore unit expands and puts focus on R&D
Bits + chips | 5h 57min ago
E Ink launches 3 pigment electronic paper display
Displays | 5h 59min ago
HannStar to reach 95% utilization in 2Q13
Displays | 6h 1min ago
Windows 8 expected to take up 5-8% of global tablet shipments in 2013, say Taiwan makers
IT + CE | 6h 4min ago
Supplies of NAND flash to be tight in July-August, says Phison
Before Going to Press | 6h 24min ago
TPK to see orders bump up in 3Q13
Before Going to Press | 6h 37min ago
Wintek expects to see positive turnaround in July 2013, says chairman
Before Going to Press | 6h 41min ago
Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon
Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...
- China-based ARM-architecture IC designers to attend 2013 Computex Taipei
- Digitimes Research: Global LED tube light shipments to reach 220 million units in 2013
- Lextar expected to see 2Q13 gross margin rise to 13-14%
- Samsung to launch complete line up of notebooks in 2H13
- Taiwan panel industry output value worth US$7.86 billion in 1Q13, says IEK
- China market: B2C transaction value over CNY133 billion in 1Q13, says Analysys
- Taiwan market: Sony to launch Xperia Tablet Z
- Asustek, Chunghwa Telecom cooperate to provide cloud computing services
- Nanjing Z-Com developing 4G small cells for China market
- China market: Smartphone sales over 75 million units in 1Q13, says Analysys
- Imec, Globalfoundries team up for STT-MRAM
- Solar industry capex hits 7-year low in 2013, says IHS
- ACX sees earnings up over 60% sequentially in 1Q13
- Ilitek to post revenues of over NT$900 million in May
- Sharp to produce 3 types of IGZO LCD panels for notebooks
- 3M announces new development of quantum dot enhancement film
- NLT demonstrates latest display technologies, including projective capacitive touch panel technology
- New Vision Display exhibits PMVA color display based on Corning Willow Glass
- AMD falls to 4th rank MPU supplier in 2012, says IC Insights
- Touch screen IC, LED driver IC suppliers to post strong performance in May
- LED maker Epistar expects more revenues from lighting applications in 3Q13
- CSOT successfully produces 32-inch Oxide TFT LCD module
- Can Ultra HD TVs avoid the fate of 3D sets? asks IHS
- After a year of decline, global flat panel TV market sees marginal growth in 1Q13, says IHS
- Sharp announces new Ultra HD TVs
- Releases
- White papers
- Bulletin
- Carry Technology Highlights Thunderbolt and Wi-Fi Card Reader Series
- Imagination says third party IP becoming a key driving force for silicon vendors
- EverFocus launches ECOR960 X1 16CH with better image quality and more affordable price
- Leadtek to Show Total Cloud Solutions at Computex Taipei 2013
- Clientron to exhibit its latest Zero/Thin Client and POS solutions along with the full product line at Computex Taipei 2013
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
22-May-2013 markets closed
| Last | Change |
| TAIEX (TSE) | 8398.84 | +15.79 | +0.19% |
| TSE electronic | 317.55 | +0.70 | +0.22% |
| GTSM (OTC) | 120.71 | +0.33 | +0.27% |
| OTC electronic | 145.64 | +1.03 | +0.71% |
- Apple 'among largest tax avoiders in US' - Senate committee (May 21) - BBC News
- Weak eurozone growth hits euro (May 15) - The Financial Times
- German factory orders rise for second month (May 7) - Bloomberg
- Eurozone retail sales fall for second consecutive month (May 6) - BBC News
- China economy to stay commodity-oriented, says JPMorgan (April 16) - Bloomberg
- S Korea in US$15.3 billion stimulus bid to spur economic growth (April 16) - BBC News
- Gold hit by sharpest tumble in 30 years (April 16) - CNN
- FBI probes Boston 'terror' blasts (April 16) - BBC News
Photo: Company, Apr 30.
Photo: Company, Apr 16.
Photo: Company, Apr 12.
Photo: Company, Apr 10.
Photo: Company, Apr 10.
2013 Taiwan International Lighting Show: Edison Opto's cafe booth
Photo: Jackie Chang, DIGITIMES, Apr 8.
2013 Taiwan International Lighting Show: Delta LED light bulbs
Photo: Jackie Chang, DIGITIMES, Apr 8.
Photo: Jackie Chang, DIGITIMES, Apr 8.
Photo: Company, Apr 8.
2013 Taiwan Internationbal Lighting Show: Epistar applications for agricultural lighting
Photo: Jackie Chang, DIGITIMES, Mar 29.
2013 Taiwan International Lighting Show: Everlight residential LED lighting
Photo: Jackie Chang, DIGITIMES, Mar 29.
2013 Taiwan International Lighting Show: Edison Opto LED strip lamp
Photo: Jackie Chang, DIGITIMES, Mar 29.
Opportunity lies for MEMS energy harvesting: Q&A with Holst Centre general manager Bert Gyselinckx
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...
Returning with stronger competitiveness: Q&A with Lu Li-Cheng, Chaintech chairman
Chaintech, a motherboard/graphics card maker, which quit the market once and returned recently, has...
MEMS-enabled energy harvesting: Q&A with MIG executive director Karen Lightman
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...
Complete mobile platform solutions: Q&A with Broadcom executive VP Robert Rango
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- 2H 2012 global TFT panel market forecast
Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.
- Trends and shipment forecast for 2H 2012 smartphone market
Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.
- Trends in Asia LED chip manufacturing industry
Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.