Taipei, Monday, May 25, 2015 22:39 (GMT+8)
mostly cloudy
Taipei
23°C
News tagged wafer-level packaging
  • Last update: Thursday 21 May 2015 [25 news items]

Xintec profits soar in 1Q15

Stockwatch - May 21, 21:23

Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...

TSMC InFO-WLP technology to generate significant revenues starting 2016

May 5, 22:25

Taiwan Semiconductor Manufacturing Company's (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry's...

Altera, TSMC develop UBM-free WLCSP packaging

Apr 7, 21:30

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...

Xintec 12-inch wafer-level CSP ready for volume production in 2H15, says chairman

Mar 17, 20:01

Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...

Xintec chairman Robert Kuan

TSMC to offer InFO-WLP technology for 16nm chips, eyeing Apple orders

Feb 4, 13:45

Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple's...

UTAC said to set up 12-inch wafer-level packaging line in Taiwan

Dec 23, 15:13

United Test and Assembly Center (UTAC), a Singapore-based assembly and test company, will continue its investment in Taiwan in 2015 by setting up a 12-inch wafer-level packaging line,...

High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive

Jul 9, 15:53

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

Kevin Yu, Amkor sales director for Greater China

STATS ChipPAC to pump another US$500 million into expansion in Singapore

May 29, 11:19

STATS ChipPAC has unveiled plans to invest another US$500 million to expand its operations in Singapore, where the IC backend house is headquartered.

Scientech deepens development of 3D IC, wafer-level packaging equipment

Jan 31, 16:04

Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...

ChipMOS expects sales growth in 2012

Mar 19, 16:15

Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...

Aptos expanding 12-inch wafer level packaging business

Mar 14, 14:30

Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...

STATS ChipPAC intros new 3D eWLB PoP solutions

Mar 7, 11:35

STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...

STATS ChipPAC breaks ground for new factory

Jan 6, 01:20

STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...

Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Nov 21, 13:48

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...

STATS ChipPAC CEO Tan Lay Koon

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

ASE aims at global market share of 25-30% in 2014

Jun 29, 01:00

IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) aims to hike its global market share from 17-18% in 2010 to 25-30% in 2014, COO Tien Wu said at the...

STATS ChipPAC expands WLP offering with 12-inch manufacturing in Taiwan

Jan 18, 12:00

STATS ChipPAC has announced the expansion of its wafer-level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsinchu...

ASE to budget US$700 million in capex for 2011, says paper

Newswatch - Oct 4, 17:00

IC packaging and testing house Advanced Semiconductor Engineering (ASE) plans to budget US$700 million in capex for 2011, flat on year, an unnamed company executive has been cited...

STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing

Sep 15, 15:33

STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...

SPIL enters LED packaging market

Sep 14, 15:26

Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...

Aptos invests in ACE to enhance wafer-level package offering

Nov 30, 16:51

Aptos Technology, a 20%-held packaging and testing affiliate of Phison Electronics, has announced it recently acquired an 87% stake in wafer-level packaging (WLP) house Advanced Chip...

Plant fire at KYEC affiliate ACE, reports paper

Newswatch - Oct 7, 16:57

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a...

STATS ChipPAC expanding capacity for wafer-level packaging

Jun 17, 14:35

STATS ChipPAC has announced it is expanding capacity for full turnkey wafer-level packaging in its Singapore operation. The IC packaging and testing service provider said it is on...

Integrated handheld solutions driving demand for wafer-level packaging, says ASE

Apr 13, 16:00

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...

Realtime news
  • HMI EPS for 2015 to rise

    Bits + chips - Stockwatch | 34min ago

  • New iPhone uses smaller LED backlight unit, say Taiwan makers

    LED | 34min ago

  • Taiwan makers promoting PERC polycrystalline solar cells

    Green energy | 40min ago

  • Hans von Mangoldt Taiwan establishing new plants in Taiwan

    Before Going to Press | 38min ago

  • Samsung to invest in Wuxi, China for polarizer factory

    Before Going to Press | 39min ago

  • CES Asia: Haier to partner with Intel for wireless charging technology

    Before Going to Press | 39min ago

  • Zhen Ding and Flexium to see strong 2015 EPS thanks to iPhone orders

    Before Going to Press | 1h 24min ago

  • Merry Electronics needs a step to become iPhone supply chain maker

    Before Going to Press | 1h 25min ago

  • Foxconn, Pegatron not to be replaced for OEM production of iPhone, say Taiwan makers

    Before Going to Press | 1h 26min ago

  • Apple said to shift battery orders for next-generation iPhone away from Simplo

    Before Going to Press | 1h 26min ago

  • China market: Smartisan to launch 5.5-inch smartphone

    Before Going to Press | 2h 23min ago

  • Samsung expected to lead in Ultra HD TV sales in Taiwan during 2015

    Before Going to Press | 2h 25min ago

  • Taiwan LCD driver IC firms eyeing orders from Apple, Samsung

    Before Going to Press | 2h 25min ago

  • Hisense launches new 4K ULED TVs

    Before Going to Press | 2h 26min ago

  • Computex 2015: Smart living gaining attention from vendors

    Before Going to Press | 2h 26min ago

Pause
 | 
View more
Taiwan server shipment forecast and industry analysis, 2015
Trends and forecasts for the China FPD industry, 2014-2017

25-May-2015 markets closed

 LastChange

TAIEX (TSE)9638.8+60.24+0.63% 

TSE electronic377.01+2.38+0.64% 

GTSM (OTC)139.71+0.71+0.51% 

OTC electronic184.19+1.01+0.55% 

The transition to 4k TV - UHD TV market forecast, 2014-2017
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.