Bits + chips
Qualcomm, ASE, Brazil government sign MOU to build IC testing/packaging plant in Brazil, says paper
Commercial Times, March 23; Steve Shen, DIGITIMES

Advanced Semiconductor Engineering (ASE), Qualcomm and the Brazil government reportedly have signed a MOU to jointly invest US$200 million initially to establish an IC testing/packaging plant in Sao Paulo, according to Chinese-language Commercial...

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