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NEWS TAGGED ASE
Wednesday 30 October 2024
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
Tuesday 29 October 2024
TSMC's go-to partner for AI demand: ASE's SPIL invests US$13 million to boost CoWoS capacity
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Tuesday 22 October 2024
Bright future ahead: advanced packaging takes center stage as traditional OSAT providers pivots
AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...
Friday 11 October 2024
ASE to boost advanced packaging capacity with new K28 plant
Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking...
Friday 6 September 2024
ASE establishes SiPhIA consortium, CEO Tien Wu sees accelerated progress in silicon photonics
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Wednesday 4 September 2024
SEMICON Taiwan 2024 forums to highlight CoWoS, FOPLP, SiPh
SEMICON Taiwan 2024 is set to take place from September 4 to 6 and will feature over 20 forums.
Tuesday 3 September 2024
Golden age of semiconductors has arrived, says ASEH COO
The semiconductor industry has entered its golden era, necessitating collaboration across the supply chain to overcome bottlenecks, according to Tien Wu, COO for OSAT ASE Technology...
Friday 30 August 2024
Global OSAT industry, 2024

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Friday 30 August 2024
Three issues remain following ASE's plans in Kyushu
Taiwan-based OSAT, ASE, signed a tentative contract with the government of Kitakyushu in Kyushu, Japan, to buy land in Kitakyushu's Wakamatsu-ku where they would attempt to expand...
Friday 30 August 2024
G2C+ alliance expects robust demand for advanced packaging
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
Tuesday 6 August 2024
Infineon completes sale of Philippines and South Korea backend sites to ASE
Infineon Technologies has completed the sale of its two backend manufacturing sites, one in Cavite, Philippines, and one in Cheonan, South Korea, to two fully owned subsidiaries of...
Friday 2 August 2024
ASEH to set up advanced packaging fab in Japan, say sources
ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources.
Monday 29 July 2024
OSATs expect sales growth in 2H24
Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.
Friday 26 July 2024
TSMC Foundry 2.0 illustrates growing importance of IC backend, says ASEH
OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...
Wednesday 24 July 2024
FOPLP steps forward as foundries compete for packaging talents
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research