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ASE expands into IC substrate

Max Wang, Taipei; Heidi Chu, DIGITIMES Asia Monday 30 April 2001 0

On April 26, Joseph HS Tung, CFO and vice president of Advanced Semiconductor Engineering (ASE) group, pointed out that IC substrate accounts for 60-80% and 30-50% of the cost of advanced flip-chip and ball-grid array (BGA) packaging, respectively....

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