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TSMC to offer 12-inch solder bumping in 2Q 2002

Janet Wang, Hsinchu; Noah Sauve, DIGITIMES Asia Thursday 8 March 2001 0

TSMC plans to invest approximately NT$1.9 billion dollars to install new production lines for 12-inch wafer solder bumping this year, expecting to reach a volume output of 15,000 wafers a month in the second quarter of 2002.

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