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News tagged packaging
  • Last update: Friday 27 November 2015 [440 news items]

IC packaging and testing houses turn conservative over 3Q10 outlook

Jul 15, 16:08

Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue growth for the traditional peak season,...

Japan TV vendors come to Taiwan to secure LED supply

Jun 25, 15:17

Amid the surging demand for LED-backlit LCD TVs, Japanese TV vendors recently visited Taiwan to secure LED supplies. LED packaging houses including Everlight Electronics, Unity Opto...

Unity Opto expects 70% sequential growth in revenues for 2Q10

Jun 25, 13:59

LED packaging house Unity Opto Technology expects second-quarter 2010 revenues to increase 70% sequentially with NT$760-800 million projected for June and sales for the full year...

Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season

Jun 23, 11:00

Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...

IC packaging and testing house KYEC looks to modest revenue gains in 3Q10

Jun 18, 15:57

IC packaging and testing house King Yuan Electronics (KYEC) expects its revenues to grow at a single-digit rate in the third quarter of 2010 due to a high base recorded in the second...

Everlight, Epistar and TPV to form LED packaging JV in China

Jun 17, 11:57

LED chipmaker and packager Everlight Electronics will establish a joint venture with Epistar and TPV Technology in Fuzhou City in China's Fujian Province for LED chip packaging and...

ChipSiP partners with Zoran for PoP packaging

Jun 15, 11:58

Taiwan-based SiP solution provider ChipSiP Technology and Zoran have announced that they have collaborated to produce a new slim package solution for the compact digital camera market...

ASE, SPIL May revenues up on month

Jun 8, 14:23

Chip packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) saw their consolidated revenues for May 2010 grow 5.7% and 2.9%...

Amtran, Everlight, and LG Display to form LED packaging JV for LCD TV market

Jun 4, 02:00

Taiwan-based LCD TV maker Amtran Technology has announced a plan to form an LED packaging joint venture in China with LED packager Everlight Electronics and TFT LCD panel maker LG...

Chip backend houses to see strong 3Q10

Newswatch - May 25, 17:01

Chip packaging and testing houses are expected to generate sequential revenue growth through the third quarter, judging from their foundry partners' high utilization rates, according...

Chip packagers reportedly to raise quotes on gold costs

May 19, 11:44

Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...

LED prices likely to go up 5-10%

May 13, 15:31

LED backlight products may see their prices increase by 5-10% as both upstream LED chip and epitaxial wafer prices will rise soon due to strong market demand, according to sources...

LED chipmakers, packaging houses report mixed results for 1Q10

May 10, 10:02

Players in Taiwan's LED industry have reported mixed results for the first quarter of 2010.

Everlight, Bright LED April revenues up, Lite-On Tech down sequentially

May 7, 12:22

LED packaging houses Everlight Electronics and Bright LED saw their April revenues increase by 1.6% and 17.79% on month, respectively. Meanwhile, Lite-On Technology saw its April...

LED players see April revenues rise

May 6, 16:06

LED chipmaker Formosa Epitaxy (FOREPI) and LED packaging house Unity Opto Technology both saw 20% on-month growth in April revenues with LED chipmaker Tyntek and LED leadframe maker...

LED companies see revenue growth in 1Q10

Apr 29, 15:19

LED packaging houses Everlight Electronics, Unity Opto Technology and Ledtech Electronics, and LED chipmaker Formosa Epitaxy (FOREPI) have all reported growth in their first-quarter...

Passive component material suppliers Laser Tek and Leatec to see 10% sequential revenue growth in 2Q10

Apr 27, 15:26

Laser Tek, which mainly produces SMD (surface-mount-device) packaging materials, and chip-resistor substrate supplier Leatec Fine Ceramics are expected to see second-quarter revenues...

Chipbond sees profits in 1Q10

Apr 23, 15:37

LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...

Packaging material supplier Chang Wah to hand out NT$6 cash dividends for 2009

Apr 16, 16:19

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has decided to deal out dividends of NT$6 in cash for 2009, based on the pre-tax profits of NT$564 million...

STATS ChipPAC intros 300mm embedded WLB wafer manufacturing

Apr 13, 12:00

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...

All Ring says 2Q10 revenues to grow sequentially

Apr 6, 16:14

All Ring Tech, which makes equipment used in the production of LCD panels, passive components as well as IC packaging, expects revenues for the second quarter to be higher than the...

Everlight expects LED demand from large-size products to be 6-7 times larger than handset

Apr 1, 16:14

LED packaging house Everlight Electronics expects LED demand from large-size products such as notebooks, LCD monitors and LCD TVs will be 6-7 times larger than the handset segment's...

LED players expect revenues to grow significantly starting March

Apr 1, 15:56

LED packaging houses Unity Opto Technology, Everlight Electronics and Ligitek Electronics all expect their revenues to grow strongly in March, with a chance of hitting record levels,...

Walsin Lihwa and KAAI to co-develop integrated light source packaging solutions

Mar 23, 15:48

Taiwan-based Walsin Lihwa has signed a cooperation agreement with the US-based KAAI for the joint development of integrated light source packaging solutions. The three-year program...

LED packaging house Ligitek sees order visibility extend to May

Mar 22, 17:03

LED packaging company Ligitek Electronics has seen its order visibility extend to May and the company expects its revenues in March to reach NT$80 million (US$2.52 million) and exceed...

Harvatek set to declare net profit for 2009

Mar 21, 15:33

Taiwan-based LED packaging house Harvatek is expected to report net profits of NT$180 million (US$5.67 million) for 2009 with an EPS of NT$0.98, according to market observers. The...

Bright LED to issue NT$1.9 billion in bonds; Delta to take NT$720 million

Mar 12, 14:46

The board of directors of LED packaging house Bright LED Electronics has decided to issue convertible bonds worth NT$1.9 billion (US$59.79 million), of which Delta's board of directors...

Bright LED to see backlighting business account for up to 40% of total revenues in 2010

Mar 5, 15:37

LED packaging house Bright LED Electronics expects backlighting business to account for 30-40% of its total revenues in 2010, up from 18% in 2009, according to company chairman Liaw...

Taiwan LED-backend equipment makers see positive 2010

Feb 23, 11:04

Chroma Ate, All Ring Tech and Single Well Industrial, which supply equipment for LED backend production, have all said demand from customers for 2010 appears much stronger than last...

LED packaging houses Bright LED and Harvatek post mixed results for January

Feb 11, 17:04

LED packaging house Bright LED Electronics saw an on-month revenues decline of about 11.18% in January, while Harvatek had an on-month growth of about 39.52%.

Major IC backend houses report stronger-than-expected revenues for January

Feb 9, 11:34

IC packaging specialist Advanced Semiconductor Engineering (ASE) saw consolidated revenues remain almost flat on month in January, whereas rival Siliconware Precision Industries (SPIL)...

Global IC packaging and testing industry looks to double-digit growth in 2010, says SPIL chairman

Feb 4, 12:26

The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...

SPIL chairman Bough Lin

ASE secures packaging order for MediaTek GSM/GPRS single chip

Feb 2, 11:56

Advanced Semiconductor Engineering (ASE) has said it recently landed a multi-row QFN (quad-flat-pack-no lead) packaging order from MediaTek, and has become the sole packaging supplier...


Chipbond, IST merger may complete ahead of schedule

Newswatch - Jan 20, 12:17

LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...

Ledtech posts profit for 2009

Jan 14, 16:02

LED packaging house Ledtech Electronics has announced consolidated revenues of NT$1.33 billion (US$41.86 million) for 2009, with profit before tax of NT$138 million, 38.5% gross margin...

440 items [8/13]
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  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Intel strategies in the mobile device market
Wireless broadband developments in Southeast Asia markets

1-Dec-2015 markets closed


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    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

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    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.