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News tagged packaging
  • Last update: Friday 23 September 2016 [468 news items]

Gold price increase spurs adoption of copper-wire bonding

Dec 8, 01:50

With gold futures climbing to an historical high and copper prices relatively stable, IC packaging houses could see their gross margins eroded. The price difference between gold-wire...

Wellypower posts 5% sequential sales increase for November 2011

Dec 7, 01:40

Wellypower Optronics has reported NT$807 million (US$26.78 million) in November 2010 consolidated revenues, up 5.66% sequentially. The Taiwan-based company's LED chip packaging and...

Edison launches new high-power customized LED lighting product

Nov 26, 14:23

High-power LED chip packaging house Edison Opto has introduced a series of high-power LED lighting components, the EdiPower II, which offers customized solutions based on different...

Second-tier IC packagers 4Q10 sales to decline amid seasonal factors

Nov 25, 01:40

Second-tier Taiwan-based IC packaging and testing companies Greatek Electronics, Lingsen Precision Industries and Taiwan IC Packaging (TICP) will likely see their revenues for the...

Greatek denies rumor of Amkor acquisition

Stockwatch - Nov 25, 01:10

Taiwan's Greatek Electronics, a packaging and testing house specializing in consumer ICs, has denied local media reports indicating that it will be acquired by Amkor Technology of...

ASE grabs copper wirebonding orders from second-tier players

Nov 24, 01:10

With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...

ChipMOS posts profitable 3Q10

Nov 17, 01:30

IC packaging house ChipMOS Technologies has reported NT$4.717 billion (US$155.908 million) in revenues for the third quarter of 2010, up 4.9% sequentially on sales of Mask ROM and...

Edison to list on TSE mainboard

Nov 11, 02:00

High-power LED packaging house Edison Opto will list on the mainboard of the Taiwan Stock Exchange (TSE) on November 12.

Chipbond cautious about 4Q10

Nov 4, 01:50

Chipbond Technology believes its October 2010 sales may have dropped sequentially. The driver-IC packaging and testing firm also estimated total orders for November may be similar...

LED packaging houses Everlight, Harvatek, Bright LED see profit drop in 3Q10

Nov 1, 12:06

Taiwan-based LED packaging houses Everlight Electronics, Harvatek and Bright LED Electronics saw net profit for the third quarter drop sequentially by 20%, 45% and 13.86%, respecti...

Packaging and testing sector to see 7-13% growth in 2011, says SPIL chairman

Oct 28, 02:10

Siliconware Precision Industries (SPIL) chairman Bough Lin expects the packaging and testing sector to see a 7-13% rise in 2011, and the overall chip market to show stable growth.

SPIL chairman Bough Lin

Chip packagers expect currency volatility to erode 4Q10 revenues by 1-3%

Oct 20, 14:45

Taiwan-based chip packaging and testing houses are predicting the US dollar to NT dollar exchange rate to reach 1:30.50 by the end of 2010, which could erode their fourth-quarter...

Packaging material supplier Chang Wah expects flat growth for 4Q10

Oct 14, 14:02

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects flat revenue growth sequentially in the fourth quarter...

PTI, Walton 3Q10 sales up over 5% on quarter

Stockwatch - Oct 8, 01:35

Powertech Technology, which mainly provides backend services for DRAM and NAND flash memory, saw consolidated revenues rise 5.9% on quarter to NT$9.84 billion (US$321 million) in...

IC back-end firms 4Q10 gross margins likely hurt by strong NT dollar, rising material costs

Oct 5, 14:08

Soaring gold and copper prices, as well as losses resulting from the appreciation of the NT dollar, are likely to affect packaging and testing firms' gross margins in the fourth quarter...

ASP for DRAM packaging and testing set to fall in 4Q10

Sep 30, 01:20

ASPs for standard DRAM packaging and testing are set to fall by 2-3%, or even more, sequentially in the fourth quarter of 2010, according to industry sources. The estimated price...

Kinsus to commence operation of China plant

Sep 28, 01:00

Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...

Chipbond likely to miss revenue guidance for 3Q10

Sep 24, 01:05

Chipbond Technology will likely see revenues for the third quarter of 2010 remain flat on quarter, missing its guidance of 5-10% growth, according to market watchers. The driver-IC...

Taiwan Oasis to break even in 3Q10

Sep 21, 01:50

LED chip packaging house Taiwan Oasis Technology has continued to unwind holdings in unprofitable investments and could break even in the third quarter of 2010. The company posted...

Memory backend houses to see slight or flat sequential growth in 4Q10 revenues

Sep 15, 14:44

Although DRAM makers are improving production yields, which should raise demand for backend services, the possible drop in memory packaging quotes is expected to slow Taiwan-based...

SPIL enters LED packaging market

Sep 14, 15:26

Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...

Taiwan LED packagers, chipmakers report sequential drop in August revenues

Sep 7, 11:35

LED chip packaging house Unity Opto Technology saw August revenues slip 4.6% sequentially but up 58% on year to NT$670 million (US$20.979 million). Revenues from January through August...

Demand rebound for large-size panels to move back from August to October, says Chipbond chairman

Sep 1, 15:38

A demand rebound for large-size LCD panels will take place in the first two weeks of October instead of August as previously expected, Fei-Jain Wu, chairman of driver-IC packaging...

IC material distributor Niching sees sequential revenue growth in 2H10

Aug 31, 14:05

IC material distributor Niching Industrial has remarked that its revenue outlook for the second half of 2010 remains positive, buoyed by new orders from the memory sector and growing...

LED packaging houses Everlight and Harvatek announce strong profits for 1H10

Aug 26, 11:36

LED packager Everlight Electronics has posted NT$8.3 billion (US$259.3 million) in consolidated revenues for the first half of 2010, up 75.35% on year. First-half after-tax profit...

Unity Opto to increase capital and issue bonds to expand capacity

Aug 12, 12:04

The board of LED packaging company Unity Opto Technology, on August 11, approved plans to issue convertible bonds worth NT$1.5 billion (US$47.1 million) with a conversion price set...

IC packaging and testing firms post revenue gains in July

Aug 6, 12:14

Several major Taiwan-based packaging and testing companies have reported sequential revenue gains for July 2010.

Chipbond sees moderate growth in 3Q10

Jul 21, 11:37

LCD driver IC packaging and testing house Chipbond Technology expects July revenues to slightly decrease from June, but overall demand will pick up again in August and September....

IC packaging and testing houses turn conservative over 3Q10 outlook

Jul 15, 16:08

Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue growth for the traditional peak season,...

Japan TV vendors come to Taiwan to secure LED supply

Jun 25, 15:17

Amid the surging demand for LED-backlit LCD TVs, Japanese TV vendors recently visited Taiwan to secure LED supplies. LED packaging houses including Everlight Electronics, Unity Opto...

Unity Opto expects 70% sequential growth in revenues for 2Q10

Jun 25, 13:59

LED packaging house Unity Opto Technology expects second-quarter 2010 revenues to increase 70% sequentially with NT$760-800 million projected for June and sales for the full year...

Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season

Jun 23, 11:00

Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...

IC packaging and testing house KYEC looks to modest revenue gains in 3Q10

Jun 18, 15:57

IC packaging and testing house King Yuan Electronics (KYEC) expects its revenues to grow at a single-digit rate in the third quarter of 2010 due to a high base recorded in the second...

Everlight, Epistar and TPV to form LED packaging JV in China

Jun 17, 11:57

LED chipmaker and packager Everlight Electronics will establish a joint venture with Epistar and TPV Technology in Fuzhou City in China's Fujian Province for LED chip packaging and...

ChipSiP partners with Zoran for PoP packaging

Jun 15, 11:58

Taiwan-based SiP solution provider ChipSiP Technology and Zoran have announced that they have collaborated to produce a new slim package solution for the compact digital camera market...

468 items [8/14]
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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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27-Sep-2016 markets closed

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TAIEX (TSE)9194.52-90.10-0.97% 

TSE electronic376.4-5.12-1.34% 

GTSM (OTC)131.1-0.66-0.5% 

OTC electronic171.02-0.98-0.57% 

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