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News tagged packaging
  • Last update: Wednesday 8 February 2017 [485 news items]

Walton expects double-digit revenue growth for 2011

Jan 21, 01:55

Memory packaging and testing firm Walton Advanced Engineering expects to enjoy double-digit growth in its 2011 revenues, and is eyeing a 20% gross margin, according to company president...

Renesas to set up procurement center in China

Jan 20, 01:00

Japan-based Renesas Electronics has revealed plans to establish its second international procurement center in Shanghai in April 2011. The move will allow it to work closely with...

Memory packager Walton expects 1Q11 utilization to fall to 70-80%

Jan 18, 01:15

Memory testing and packaging house Walton Advanced Engineering could see capacity utilization fall to 70-80% in the first quarter of 2011 versus 90% in the previous quarter, the company...

Commentary: Taiwan IC packaging and testing houses await AMD to increase outsourcing of processor backend processing

Jan 12, 01:15

With the recent chief executive change by AMD, sources from Taiwan's IC packaging and testing houses are hoping that the US-based company will change its policy and increase outsourcing...

Sigurd posts sequential drop for December revenues

Jan 11, 01:35

IC packaging and testing house Sigurd Microelectronics reported self-evaluated consolidated revenues of NT$383 million (US$13.09 million) for December, down 2.3% sequentially due...

PTI, Walton enjoy record December sales

Jan 7, 01:40

Memory packaging and testing firm Powertech Technology (PTI) saw consolidated revenues reach NT$3.355 billion (US$115 million) in December 2010, up 0.12% from the previous monthly...

LED chip packaging company Unity Opto sees revenues up 30% on year in December

Jan 6, 01:50

LED chip packaging company Unity Opto Technology has recorded revenues of NT$510 million (US$17.51 million) for December 2010, declining 8.9% sequentially but increasing 30% from...

Ledtech aims for 50% revenue growth in 2011

Jan 5, 02:00

LED packaging house Ledtech Electronics will focus on the indoor lighting and low-temperature lighting market in 2011, and aims for 50% revenue growth on year, which is about NT$2.6...

IC packagers see stronger-than-expected 1Q11

Jan 4, 13:56

IC packaging and testing houses will see demand for the first quarter of 2011 stronger than the same period in previous years, when revenues were usually dragged down by 10-15% sequentially,...

FATC December revenues up 12% sequentially

Jan 4, 01:00

Memory packaging and testing company Formosa Advanced Technologies (FATC) has posted NT$1.19 billion (US$40.9 million) in December revenues, up 11.94% on month and 26.7% on year and...

Outsourcing of IC backend services growing

Dec 30, 12:38

IDMs including Microchip Technology, NXP Semiconductors, STMicroelectronics and Texas Instruments (TI) have all increased outsourcing for their backend production since the fourth...

Everlight may go to Beijing

Dec 17, 01:05

LED packaging company Everlight Electronics is expected to land a cooperation agreement from Beijing as the city needs about twenty LED production lines to supply demand from BOE...

Chipbond expects sales to start recovering in December

Dec 16, 01:05

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, expects December 2010 revenues to grow sequentially after having seen on-month drops over the...

IC packaging houses see little impact from strong NT dollar in 4Q10, less certain about 1Q11

Dec 15, 01:35

The NT dollar began to strengthen against the US dollar at the end of the third quarter of 2010, and on December 14, the US dollar-to-NT dollar exchange rate temporarily fell below...

Logic IC and memory companies demand 5% reduction in packaging quotes for 1Q11

Dec 15, 01:25

Taiwan-based IC packaging houses have begun quote negotiations for the first quarter of 2011, and due to rising cost pressure, logic IC and memory companies are demanding packagers...

Memory packaging house reports November results

Dec 15, 01:20

Powertech Technologies posted November 2010 revenues of NT$3.351 billion (US$112.023 million), up modestly from the previous month. The company indicated that though its client Elpida...

IC packager Lingsen to expand capacity for MEMS, says paper

Newswatch - Dec 13, 15:46

Taiwan-based IC packaging and testing firm Lingsen Precision Industries is considering further expanding its capacity for MEMS components, such as accelerometers, microphones, gyroscopes...

Gold price increase spurs adoption of copper-wire bonding

Dec 8, 01:50

With gold futures climbing to an historical high and copper prices relatively stable, IC packaging houses could see their gross margins eroded. The price difference between gold-wire...

Wellypower posts 5% sequential sales increase for November 2011

Dec 7, 01:40

Wellypower Optronics has reported NT$807 million (US$26.78 million) in November 2010 consolidated revenues, up 5.66% sequentially. The Taiwan-based company's LED chip packaging and...

Edison launches new high-power customized LED lighting product

Nov 26, 14:23

High-power LED chip packaging house Edison Opto has introduced a series of high-power LED lighting components, the EdiPower II, which offers customized solutions based on different...

Second-tier IC packagers 4Q10 sales to decline amid seasonal factors

Nov 25, 01:40

Second-tier Taiwan-based IC packaging and testing companies Greatek Electronics, Lingsen Precision Industries and Taiwan IC Packaging (TICP) will likely see their revenues for the...

Greatek denies rumor of Amkor acquisition

Stockwatch - Nov 25, 01:10

Taiwan's Greatek Electronics, a packaging and testing house specializing in consumer ICs, has denied local media reports indicating that it will be acquired by Amkor Technology of...

ASE grabs copper wirebonding orders from second-tier players

Nov 24, 01:10

With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...

ChipMOS posts profitable 3Q10

Nov 17, 01:30

IC packaging house ChipMOS Technologies has reported NT$4.717 billion (US$155.908 million) in revenues for the third quarter of 2010, up 4.9% sequentially on sales of Mask ROM and...

Edison to list on TSE mainboard

Nov 11, 02:00

High-power LED packaging house Edison Opto will list on the mainboard of the Taiwan Stock Exchange (TSE) on November 12.

Chipbond cautious about 4Q10

Nov 4, 01:50

Chipbond Technology believes its October 2010 sales may have dropped sequentially. The driver-IC packaging and testing firm also estimated total orders for November may be similar...

LED packaging houses Everlight, Harvatek, Bright LED see profit drop in 3Q10

Nov 1, 12:06

Taiwan-based LED packaging houses Everlight Electronics, Harvatek and Bright LED Electronics saw net profit for the third quarter drop sequentially by 20%, 45% and 13.86%, respecti...

Packaging and testing sector to see 7-13% growth in 2011, says SPIL chairman

Oct 28, 02:10

Siliconware Precision Industries (SPIL) chairman Bough Lin expects the packaging and testing sector to see a 7-13% rise in 2011, and the overall chip market to show stable growth.

SPIL chairman Bough Lin

Chip packagers expect currency volatility to erode 4Q10 revenues by 1-3%

Oct 20, 14:45

Taiwan-based chip packaging and testing houses are predicting the US dollar to NT dollar exchange rate to reach 1:30.50 by the end of 2010, which could erode their fourth-quarter...

Packaging material supplier Chang Wah expects flat growth for 4Q10

Oct 14, 14:02

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects flat revenue growth sequentially in the fourth quarter...

PTI, Walton 3Q10 sales up over 5% on quarter

Stockwatch - Oct 8, 01:35

Powertech Technology, which mainly provides backend services for DRAM and NAND flash memory, saw consolidated revenues rise 5.9% on quarter to NT$9.84 billion (US$321 million) in...

IC back-end firms 4Q10 gross margins likely hurt by strong NT dollar, rising material costs

Oct 5, 14:08

Soaring gold and copper prices, as well as losses resulting from the appreciation of the NT dollar, are likely to affect packaging and testing firms' gross margins in the fourth quarter...

ASP for DRAM packaging and testing set to fall in 4Q10

Sep 30, 01:20

ASPs for standard DRAM packaging and testing are set to fall by 2-3%, or even more, sequentially in the fourth quarter of 2010, according to industry sources. The estimated price...

Kinsus to commence operation of China plant

Sep 28, 01:00

Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...

Chipbond likely to miss revenue guidance for 3Q10

Sep 24, 01:05

Chipbond Technology will likely see revenues for the third quarter of 2010 remain flat on quarter, missing its guidance of 5-10% growth, according to market watchers. The driver-IC...

485 items [8/14]
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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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