Taipei, Thursday, July 24, 2014 10:23 (GMT+8)
mostly cloudy
Taipei
30°C
News tagged packaging
  • Last update: Friday 6 June 2014 [403 news items]

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

PTI chairman denies merger rumors

Dec 30, 13:37

Powertech Technology (PTI) chairman DK Tsai has denied rumors that the memory IC packaging and testing house plans to merge with Orient Semiconductor Electronics (OSE), a memory card...

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

ChipMOS loses DRAM packaging patent lawsuit against Walton

Dec 24, 10:20

Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...

Everlight and Unity Opto to hike 2010 capex

Dec 18, 15:14

LED packaging houses Everlight Electronics and Unity Opto Technology have raised their capex goals for 2010 amid growing demand for LED-backlight applications, according to market...

Unity Opto partners with China consumer electronics player for LED lighting

Dec 17, 15:28

Taiwan-based LED packaging houses Unity Opto Technology has signed an agreement with China-based Potevio's consumer electronic subsidiary to set up a LED lighting joint venture in...

Everlight aims at 3% LED TV backlight market share in 2010

Dec 15, 15:33

LED packaging house Everlight Electronics aims to take 3% of the global LCD TV-use LED backlight market in 2010, according to the company.

LED chipmakers and packaging houses see growth in November revenues

Dec 10, 15:52

LED chipmakers Epistar, Formosa Epitaxy (FOREPI) and Huga Optotech have all seen their revenues grow more than double on year for November, while packaging houses Everlight Electronics...

Mixed November sales results for Taiwan LED players

Dec 8, 12:20

LED players Unity Opto Technology, I-Chiun Precision Industry and Tekcore have reported mixed results for November, as Unity Opto saw its revenues drop over 10% sequentially, while...

Chipbond and IST announce merger

Dec 7, 17:00

Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.

IC packaging and testing companies experiencing strong orders for December 09 and 1Q10

Dec 7, 14:05

Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...

DRAM backend supplier FATC revenues down 3% in November 2009, but sees growth ahead

Dec 4, 11:03

Formosa Advanced Technologies (FATC), a major packaging and testing service provider for DRAM makers Nanya Technology and Inotera Memories, saw November 2009 revenues drop slightly...

Lextar to maintain vertical partnership with LightHouse and Wellypower

Dec 4, 10:51

Lextar Electronics president and COO David Su has noted that the company currently has no plans to merge with LightHouse Technology and Wellypower Optronics and will instead maintain...

Lextar Electronics president and COO David Su

LCD driver IC supply may tighten in 1Q10

Newswatch - Dec 3, 15:28

LCD driver IC makers are likely to see supply interrupted by tight capacity at backend service suppliers and material shortages during the first quarter of 2010, as current orders...

I-Chiun dismisses report about 2010 outlook

Stockwatch - Dec 1, 16:34

LED leadframe maker I-Chiun Precision Industry has maintained that it has not released any forecast for 2010, in response to a Chinese language Commercial Times report that...

Amtran reportedly to invest in Everlight

Nov 26, 14:11

Taiwan-based LCD TV maker Amtran Technology reportedly has picked LED packaging house Everlight Electronics for its planned LED investment, according to market sources.

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Spirox sees no risk of overspending by foundries and IC backend suppliers in 2010

Nov 18, 16:36

Taiwan-based Spirox, which provides integrated solutions from IC design through manufacturing for the semiconductor and TFT LCD high-tech industries, has commented that there will...

ChipMOS expects 4Q09 revenues to stay flat or drop slightly on quarter

Nov 12, 12:17

Packaging and testing house ChipMOS Technologies has said revenues for the fourth quarter of 2009 may remain flat or drop by single-digits compared to the third quarter. Demand for...

LED chipmakers see October revenues increase

Nov 11, 16:32

LED chipmakers saw their October revenues increase on the high demand for high-brightness blue LEDs, while LED packaging houses saw sequential drop for October revenues.

LED companies post mixed October revenues

Nov 10, 10:11

LED packaging house Ledtech Electronics and LED chipmaker Tekcore have both posted record revenues for October, while LED packaging house Unity Opto Technology saw a 4.77% sequential...

Chipbond and IST 4Q09 revenues to drop 20% on quarter

Nov 5, 16:23

Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...

C-Tech said to have obtained battery pack orders for use in HP, Apple products

Oct 29, 17:15

Taiwan-based battery pack maker C-Tech United has landed orders from battery cell players LG Chem and Samsung SDI for battery packs that will eventually be used in notebook products...

PTI raises 2009 capex; chairman bullish on 2010 memory market

Oct 28, 14:22

Memory packaging and testing house Powertech Technology (PTI) has raised its capex for 2009 to NT$7 billion (US$216 million) on optimism about the recent market rebound, according...

PTI chairman DK Tsai

DRAM backend supplier FATC nears full utilization

Oct 27, 16:41

Formosa Advanced Technologies (FATC), a Taiwan-based memory packaging and testing service provider, has seen its capacity reach almost full utilization thanks to increased demand...

Camera module maker AOET ready for LED chip production

Oct 27, 14:11

Camera lens and module maker Ability Opto-Electronics Technology (AOET), a subsidiary of Foxconn Electronics (Hon Hai Precision Industry), has reportedly entered the production of...

Packaging material and equipment supplier Laser Tek positive about 4Q09

Newswatch - Oct 20, 16:00

Laser Tek, a major supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment in Taiwan, has reported clearer order visibility for LED packagers and laser...

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

Everlight to issue common stock to raise about NT$3 billion

Oct 13, 12:27

Taiwan-based LED packaging house Everlight Electronics on October 12 announced that the board of directors has approved for issuing common stock to raise an estimated capital of NT$3.33...

Lite-On, Bright LED and Harvatek see year-high revenues in September

Oct 9, 16:52

LED packaging houses Lite-On Technology, Bright LED Electronics and Harvatek have all reported year-high revenues for September 2009.

Plant fire at KYEC affiliate ACE, reports paper

Newswatch - Oct 7, 16:57

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a...

PTI posts revenues high in September 2009

Oct 7, 15:25

Memory packaging and testing house Powertech Technology (PTI) has announced revenues for September 2009 rose 1.8% on year to NT$2.75 billion (US$85 million), replacing its previous...

3D IC packaging to be mature within 3 years, says ASE chief officer

Oct 2, 17:10

Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...

SoC and SiP

Topoint shipping micro drill bits to Japan

Oct 1, 17:03

Taiwan-based drill bit maker Topoint Technology has begun shipping its micro drill bits to three Japan-based IC substrate makers, which will help boost the company's market share...

403 items [8/12]
Realtime news
  • Vendors partner with Wintel to release US$199-249 notebooks for 2H14

    IT + CE | 11h 30min ago

  • Apple to become largest client for TSMC, say sources

    Bits + chips | 11h 33min ago

  • China market: Xiaomi launches new flagship smartphone

    Mobile + telecom | Jul 23, 21:53

  • Apple new iPhones to come with different time tables to avoid competition

    Mobile + telecom | Jul 23, 21:37

  • Delta expected to enjoy strong performance in 3Q14

    Before Going to Press | Jul 23, 21:53

  • Samsung suffering from infighting; may impact upcoming smartphone plans, says report

    Before Going to Press | Jul 23, 21:37

  • Han's Laser and Goodfeel to attend Touch Taiwan 2014

    Before Going to Press | Jul 23, 21:26

  • TCAS 2014: BenQ to promote short-distance projectors

    Before Going to Press | Jul 23, 21:04

  • Digitimes Research: CSOT to see increased influence in AMOLED industry

    Before Going to Press | Jul 23, 20:35

  • North America semiconductor equipment industry posts book-to-bill ratio of 1.09 in June, says SEMI

    Before Going to Press | Jul 23, 20:33

  • Chassis makers doubtful about rumors Samsung to release metal chassis smartphone

    Before Going to Press | Jul 23, 20:07

  • PTI reports EPS NT$1.96 for 1H14

    Before Going to Press | Jul 23, 19:39

  • Digitimes Research: Wi-Fi ecosystem keeps expanding

    Before Going to Press | Jul 23, 19:09

  • Google to incorporate NFC functionality into Android

    Before Going to Press | Jul 23, 18:53

  • Peak season TV demand expected to be flat on year

    Before Going to Press | Jul 23, 18:51

  • LCD monitor panel prices rise on tight supply, say Taiwan makers

    Before Going to Press | Jul 23, 18:49

Pause
 | 
View more
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

DIGITIMES Research Tracker Services
Media news email alerts

21-Jul-2014 markets closed

 LastChange

TAIEX (TSE)9400.97-7.27-0.08% 

TSE electronic370.47-0.65-0.18% 

GTSM (OTC)147.84-0.32-0.22% 

OTC electronic182.98-1.06-0.58% 

2014 global notebook demand forecast