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News tagged packaging
  • Last update: Wednesday 3 December 2014 [417 news items]

Walsin Lihwa and KAAI to co-develop integrated light source packaging solutions

Mar 23, 15:48

Taiwan-based Walsin Lihwa has signed a cooperation agreement with the US-based KAAI for the joint development of integrated light source packaging solutions. The three-year program...

LED packaging house Ligitek sees order visibility extend to May

Mar 22, 17:03

LED packaging company Ligitek Electronics has seen its order visibility extend to May and the company expects its revenues in March to reach NT$80 million (US$2.52 million) and exceed...

Harvatek set to declare net profit for 2009

Mar 21, 15:33

Taiwan-based LED packaging house Harvatek is expected to report net profits of NT$180 million (US$5.67 million) for 2009 with an EPS of NT$0.98, according to market observers. The...

Bright LED to issue NT$1.9 billion in bonds; Delta to take NT$720 million

Mar 12, 14:46

The board of directors of LED packaging house Bright LED Electronics has decided to issue convertible bonds worth NT$1.9 billion (US$59.79 million), of which Delta's board of directors...

Bright LED to see backlighting business account for up to 40% of total revenues in 2010

Mar 5, 15:37

LED packaging house Bright LED Electronics expects backlighting business to account for 30-40% of its total revenues in 2010, up from 18% in 2009, according to company chairman Liaw...

Taiwan LED-backend equipment makers see positive 2010

Feb 23, 11:04

Chroma Ate, All Ring Tech and Single Well Industrial, which supply equipment for LED backend production, have all said demand from customers for 2010 appears much stronger than last...

LED packaging houses Bright LED and Harvatek post mixed results for January

Feb 11, 17:04

LED packaging house Bright LED Electronics saw an on-month revenues decline of about 11.18% in January, while Harvatek had an on-month growth of about 39.52%.

Major IC backend houses report stronger-than-expected revenues for January

Feb 9, 11:34

IC packaging specialist Advanced Semiconductor Engineering (ASE) saw consolidated revenues remain almost flat on month in January, whereas rival Siliconware Precision Industries (SPIL)...

Global IC packaging and testing industry looks to double-digit growth in 2010, says SPIL chairman

Feb 4, 12:26

The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...

SPIL chairman Bough Lin

ASE secures packaging order for MediaTek GSM/GPRS single chip

Feb 2, 11:56

Advanced Semiconductor Engineering (ASE) has said it recently landed a multi-row QFN (quad-flat-pack-no lead) packaging order from MediaTek, and has become the sole packaging supplier...

ASE aQFN

Chipbond, IST merger may complete ahead of schedule

Newswatch - Jan 20, 12:17

LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...

Ledtech posts profit for 2009

Jan 14, 16:02

LED packaging house Ledtech Electronics has announced consolidated revenues of NT$1.33 billion (US$41.86 million) for 2009, with profit before tax of NT$138 million, 38.5% gross margin...

Most LED players in Taiwan see revenues decline in December

Jan 11, 15:55

LED chipmakers Epistar, Tekcore and Formosa Epitaxy (FOREPI) and LED packaging houses Everlight Electronics, Bright LED Electronics and Harvatek have reported mixed results for December...

PTI revenues hit all-time high in December

Jan 7, 12:11

Powertech Technology (PTI), a major backend service provider for Elpida Memory and Toshiba, has announced revenues for December 2009 grew 13.2% on year to a record high of NT$2.94...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

PTI chairman denies merger rumors

Dec 30, 13:37

Powertech Technology (PTI) chairman DK Tsai has denied rumors that the memory IC packaging and testing house plans to merge with Orient Semiconductor Electronics (OSE), a memory card...

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

ChipMOS loses DRAM packaging patent lawsuit against Walton

Dec 24, 10:20

Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...

Everlight and Unity Opto to hike 2010 capex

Dec 18, 15:14

LED packaging houses Everlight Electronics and Unity Opto Technology have raised their capex goals for 2010 amid growing demand for LED-backlight applications, according to market...

Unity Opto partners with China consumer electronics player for LED lighting

Dec 17, 15:28

Taiwan-based LED packaging houses Unity Opto Technology has signed an agreement with China-based Potevio's consumer electronic subsidiary to set up a LED lighting joint venture in...

Everlight aims at 3% LED TV backlight market share in 2010

Dec 15, 15:33

LED packaging house Everlight Electronics aims to take 3% of the global LCD TV-use LED backlight market in 2010, according to the company.

LED chipmakers and packaging houses see growth in November revenues

Dec 10, 15:52

LED chipmakers Epistar, Formosa Epitaxy (FOREPI) and Huga Optotech have all seen their revenues grow more than double on year for November, while packaging houses Everlight Electronics...

Mixed November sales results for Taiwan LED players

Dec 8, 12:20

LED players Unity Opto Technology, I-Chiun Precision Industry and Tekcore have reported mixed results for November, as Unity Opto saw its revenues drop over 10% sequentially, while...

Chipbond and IST announce merger

Dec 7, 17:00

Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.

IC packaging and testing companies experiencing strong orders for December 09 and 1Q10

Dec 7, 14:05

Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...

DRAM backend supplier FATC revenues down 3% in November 2009, but sees growth ahead

Dec 4, 11:03

Formosa Advanced Technologies (FATC), a major packaging and testing service provider for DRAM makers Nanya Technology and Inotera Memories, saw November 2009 revenues drop slightly...

Lextar to maintain vertical partnership with LightHouse and Wellypower

Dec 4, 10:51

Lextar Electronics president and COO David Su has noted that the company currently has no plans to merge with LightHouse Technology and Wellypower Optronics and will instead maintain...

Lextar Electronics president and COO David Su

LCD driver IC supply may tighten in 1Q10

Newswatch - Dec 3, 15:28

LCD driver IC makers are likely to see supply interrupted by tight capacity at backend service suppliers and material shortages during the first quarter of 2010, as current orders...

I-Chiun dismisses report about 2010 outlook

Stockwatch - Dec 1, 16:34

LED leadframe maker I-Chiun Precision Industry has maintained that it has not released any forecast for 2010, in response to a Chinese language Commercial Times report that...

Amtran reportedly to invest in Everlight

Nov 26, 14:11

Taiwan-based LCD TV maker Amtran Technology reportedly has picked LED packaging house Everlight Electronics for its planned LED investment, according to market sources.

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Spirox sees no risk of overspending by foundries and IC backend suppliers in 2010

Nov 18, 16:36

Taiwan-based Spirox, which provides integrated solutions from IC design through manufacturing for the semiconductor and TFT LCD high-tech industries, has commented that there will...

ChipMOS expects 4Q09 revenues to stay flat or drop slightly on quarter

Nov 12, 12:17

Packaging and testing house ChipMOS Technologies has said revenues for the fourth quarter of 2009 may remain flat or drop by single-digits compared to the third quarter. Demand for...

LED chipmakers see October revenues increase

Nov 11, 16:32

LED chipmakers saw their October revenues increase on the high demand for high-brightness blue LEDs, while LED packaging houses saw sequential drop for October revenues.

417 items [8/12]
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    Before Going to Press | Dec 18, 21:29

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    Before Going to Press | Dec 18, 21:28

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    Before Going to Press | Dec 18, 21:27

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    Before Going to Press | Dec 18, 21:26

  • Some China PV module makers replace Taiwan-made solar cells with Southeast Asia-made models

    Before Going to Press | Dec 18, 21:26

  • LED light bulb prices fall in Europe, China markets

    Before Going to Press | Dec 18, 21:24

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    Before Going to Press | Dec 18, 21:23

  • Global Ultra HD TV penetration to rise to 14.2%, says WitsView

    Before Going to Press | Dec 18, 21:23

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    Before Going to Press | Dec 18, 21:22

  • Digitimes Research: Top-3 China based server vendors may ship 2 million units in 2015

    Before Going to Press | Dec 18, 21:21

  • US final anti-dumping, anti-subsidization taxation excludes solar-grade wafers

    Before Going to Press | Dec 18, 21:20

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    Photo: Company, Oct 13.

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    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

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    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

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    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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OTC electronic171.97+0.57+0.33% 

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