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AI and HPC chips boost the verification and analysis business

Julian Ho, Taipei; Julie Chang, DIGITIMES Asia Tuesday 12 September 2023 0

Credit: DIGITIMES

Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat dissipation characteristics in HPC chips packaged through advanced techniques...

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