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News tagged packaging
  • Last update: Monday 28 July 2014 [404 news items]

Topoint shipping micro drill bits to Japan

Oct 1, 17:03

Taiwan-based drill bit maker Topoint Technology has begun shipping its micro drill bits to three Japan-based IC substrate makers, which will help boost the company's market share...

SanDisk reportedly seeking extra NAND flash controllers and packaging support from Taiwan makers

Oct 1, 12:20

SanDisk is reportedly seeking additional supplies of NAND flash controller chips and support for backend packaging capacity from Taiwan makers for the production of microSD cards,...

SPIL and OSE microSD card packaging to run at full capacity on Samsung orders

Sep 28, 16:39

Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...

Para Light expects revenue growth on China LED streetlamp orders

Sep 22, 15:01

Taiwan-based LED packaging house Para Light Electronics expects orders for LED streetlamps from Nanjing and Lianyuangang in Jiangsu province, China will start benefiting its revenues...

LED chipmakers and packaging houses expect strong demand in 4Q09

Sep 21, 17:10

LED chipmakers and packaging houses are unlikely to see seasonal decline in the fourth quarter, expecting revenues to remain at the levels seen in the third-quarter peak season due...

VisEra announces new LED packaging technology

Sep 17, 11:29

VisEra Technologies, a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), has announced a new high-power LED packaging technology based on 8-inch silicon wafer, which...

VisEra 8-inch wafer silicon based high-power LED packaging technology

Taiwan LED players post 7% revenues growth for August, says LEDinside

Sep 14, 17:09

Taiwan's listed LED manufacturers recorded total revenues of NT$6.41 billion (US$196.25 million) in August 2009, a 7.2% growth from July and a 8.3% growth on year, according to LEDinside...

Taiwan LED packaging houses post growth in August revenues

Sep 10, 16:26

Power supply vendor and LED packaging house Lite-On Technology has reported August consolidated revenue of NT$8.39 billion (US$256.94 million), dropping 1.64% from NT$8.53 billion...

Huga, Edison post record revenues for August

Sep 9, 14:13

Taiwan-based LED chipmaker Huga Optotech and LED packaging house Edison Opto both have reported record revenues for August.

Edison to expand high-power LED packaging capacity in China

Sep 2, 15:39

Taiwan LED packaging house Edison Opto will expand its packaging capacity for high-power LED chips at its plant in Yangzhou, China at the end of the third quarter or early in the...

Edison reports net profit of NT$118 million for 1H09

Sep 1, 12:11

Taiwan LED packaging house Edison Opto has posted net profit of NT$118.19 million (US$3.6 million) on revenues of NT$644.25 million for the first half of 2009, with operating income...

Ledtech aims at 90% of Taiwan low-temperature LED lighting market in 2010, says chairman

Aug 27, 16:22

LED packaging house Ledtech Electronics expects its share of Taiwan's low-temperature LED lighting market to rise from 60% currently to 90% in 2010, according to company chairman...

Ledtech low-temperature LED light bars

Taiwan IC foundry production value hikes 91.8% in 2Q09, says IEK

Aug 19, 11:11

Taiwan's IC-manufacturing production value grew 69.2% on quarter to NT$136.2 billion (US$4.13 billion) in the second quarter of 2009, with the IC foundry service segment up by 91.8%,...

LED packaging houses order visibility expands on increasing demand

Aug 18, 16:42

Taiwan-based LED packaging houses have seen their order visibility expand to 5-6 weeks from a previous four weeks amid increasing demand for high brightness (HB) LEDs used in large-size...

LED packaging house Everlight to expand capacity in 2H09

Aug 14, 15:54

Taiwan LED packaging house Everlight Electronics plans to expand its monthly capacity for high-power LEDs and SMD LEDs to five million units and 1.2 billion units respectively in...

IC material distributor Niching Industrial to enjoy sales growth through 4Q09

Aug 12, 14:45

Niching Industrial is expected to post sequential revenue growth of 10-15% sequentially in the third and fourth quarters of 2009, according to market watchers. The semiconductor material...

ASE and SPIL continue to see sales recovery

Aug 11, 16:46

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential revenue increases from February through July 2009, with smaller on-year...

Unity Opto July revenues up over 70% on year

Aug 6, 14:36

Taiwan-based LED packaging house Unity Opto Technology has announced revenues of NT$402.57 million (US$12.3 million) for July, up 18.37% from NT$340.1 million for June and up 70.41%...

Memory backend house PTI sales up on demand for DDR3 and NAND flash

Aug 6, 12:09

Memory packaging and testing service provider Powertech Technology (PTI) has announced its revenues for July climbed to NT$2.65 billion (US$81.04 million), up 5.8% sequentially and...

Memory backend house PTI upbeat about 3Q09; raises capex

Jul 31, 14:07

Powertech Technology (PTI) has increased its 2009 capex to NT$5 billion (US$151.97 million) to fund new backend equipment purchases, revising its original plan of NT$3 billion, according...

PTI chairman DK Tsai

SPIL chairman anticipates rising demand from emerging markets in 3Q09

Jul 30, 10:46

Following a better-than-expected second quarter financial report, IC packaging and testing firm Siliconware Precision...

SPIL chairman Bough Lin

Packaging material supplier Laser Tek to see 30% sales growth in July

Jul 29, 15:54

Taiwan-based Laser Tek is likely to see July 2009 revenues up 30% sequentially, primarily driven by its equipment product lines, according to company sources. Specializing in SMD...

IC backend firms expect 10% revenue decline in 4Q09

Jul 27, 16:37

IC packaging and testing houses estimate revenues will peak in the third quarter of 2009, and decline 10% in the fourth. Shipment forecasts from foundries show that fourth-quarter...

LED packaging house Everlight to see expanded revenues in July, not yet decided to expand capacity

Jul 27, 12:04

Everlight Electronics expects its revenues for July 2009 to grow significantly from NT$908 million (US$27.5 million) recorded in June thanks to growing demand for LED backlight units...

All Ring Tech to rely on LED packaging equipment for revenue growth

Jul 21, 15:32

All Ring Tech, a Taiwan-based maker of equipment used in production of passive components and TFT-LCD panels as well as IC packaging, has extended its production to LED packaging...

Harvatek expects July and August revenues to recover

Jul 16, 16:35

Taiwan-based LED packaging house Harvatek expects its revenues in July and August to recover to the April level at around NT$231 million (US$7.01 million), its highest in 2009, according...

Packaging material distributor Chang Wah profits up 117% in 2Q09

Newswatch - Jul 15, 14:23

Chang Wah Electromaterials (CWE), a Taiwan-based distributor of packaging material and equipment, has announced profits for second-quarter 2009 jumped 116.8% sequentially to NT$124...

Consumer-IC backend supplier Greatek sales up 62% in 2Q09

Newswatch - Jul 15, 14:15

Greatek Electronics saw revenues for the second quarter of 2009 climb 62.4% sequentially, thanks to increased demand for consumer electronics ICs, network chips and power management...

SPIL 2Q09 sales up more than 50%

Jul 8, 15:53

Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...

IC testing house KYEC ups capex for 2009

Jul 2, 12:16

King Yuan Electronics Company (KYEC) has adjusted upward its capex budget for 2009 by 50% to NT$3 billion (US$91.66 million), which will be utilized for purchases of new test equipment...

SPIL to merge with wholly-owned investment subsidiary

Newswatch - Jun 26, 14:38

Siliconware Precision Industries (SPIL) plans to merge with its 100%-owned subsidiary, Siliconware Investment Company, in order to simplify the group's structure and reduce its management...

ASE seeing almost full utilization, 2Q09 sales to beat guidance

Jun 26, 14:13

Advanced Semiconductor Engineering (ASE) has seen almost full utilization rates at its Kaohsiung and Shanghai plants amid demand for leadframe packaging from emerging markets, according...

ASE COO Tien Wu

Memory backend supplier FATC to more than double LED packaging capacity

Jun 24, 10:25

Formosa Advanced Technologies (FATC) plans to invest more than NT$1 billion (US$30.51 million) to more than double capacity of its LED chip packaging line in the second half of 2009,...

Equipment supplier GPM says orders for IC packaging recovering

Newswatch - Jun 17, 16:57

Taiwan's Gallant Precision Machining (GPM) has seen order visibility for IC packaging extend to the third quarter of 2009, according to the company, which said its IC backend customers...

IC substrate maker Kinsus says high-margin products to sustain growth for 2H09

Jun 17, 16:26

Kinsus Interconnect Technology is expected to manage sequential revenue growth from July through December 2009, driven by growing sales of its high-margin product lines, according...

Kinsus chairman
404 items [9/12]
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  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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