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News tagged packaging
  • Last update: Wednesday 20 January 2016 [444 news items]

Global IC packaging and testing industry looks to double-digit growth in 2010, says SPIL chairman

Feb 4, 12:26

The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...

SPIL chairman Bough Lin

ASE secures packaging order for MediaTek GSM/GPRS single chip

Feb 2, 11:56

Advanced Semiconductor Engineering (ASE) has said it recently landed a multi-row QFN (quad-flat-pack-no lead) packaging order from MediaTek, and has become the sole packaging supplier...

ASE aQFN

Chipbond, IST merger may complete ahead of schedule

Newswatch - Jan 20, 12:17

LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...

Ledtech posts profit for 2009

Jan 14, 16:02

LED packaging house Ledtech Electronics has announced consolidated revenues of NT$1.33 billion (US$41.86 million) for 2009, with profit before tax of NT$138 million, 38.5% gross margin...

Most LED players in Taiwan see revenues decline in December

Jan 11, 15:55

LED chipmakers Epistar, Tekcore and Formosa Epitaxy (FOREPI) and LED packaging houses Everlight Electronics, Bright LED Electronics and Harvatek have reported mixed results for December...

PTI revenues hit all-time high in December

Jan 7, 12:11

Powertech Technology (PTI), a major backend service provider for Elpida Memory and Toshiba, has announced revenues for December 2009 grew 13.2% on year to a record high of NT$2.94...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

PTI chairman denies merger rumors

Dec 30, 13:37

Powertech Technology (PTI) chairman DK Tsai has denied rumors that the memory IC packaging and testing house plans to merge with Orient Semiconductor Electronics (OSE), a memory card...

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

ChipMOS loses DRAM packaging patent lawsuit against Walton

Dec 24, 10:20

Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...

Everlight and Unity Opto to hike 2010 capex

Dec 18, 15:14

LED packaging houses Everlight Electronics and Unity Opto Technology have raised their capex goals for 2010 amid growing demand for LED-backlight applications, according to market...

Unity Opto partners with China consumer electronics player for LED lighting

Dec 17, 15:28

Taiwan-based LED packaging houses Unity Opto Technology has signed an agreement with China-based Potevio's consumer electronic subsidiary to set up a LED lighting joint venture in...

Everlight aims at 3% LED TV backlight market share in 2010

Dec 15, 15:33

LED packaging house Everlight Electronics aims to take 3% of the global LCD TV-use LED backlight market in 2010, according to the company.

LED chipmakers and packaging houses see growth in November revenues

Dec 10, 15:52

LED chipmakers Epistar, Formosa Epitaxy (FOREPI) and Huga Optotech have all seen their revenues grow more than double on year for November, while packaging houses Everlight Electronics...

Mixed November sales results for Taiwan LED players

Dec 8, 12:20

LED players Unity Opto Technology, I-Chiun Precision Industry and Tekcore have reported mixed results for November, as Unity Opto saw its revenues drop over 10% sequentially, while...

Chipbond and IST announce merger

Dec 7, 17:00

Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.

IC packaging and testing companies experiencing strong orders for December 09 and 1Q10

Dec 7, 14:05

Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...

DRAM backend supplier FATC revenues down 3% in November 2009, but sees growth ahead

Dec 4, 11:03

Formosa Advanced Technologies (FATC), a major packaging and testing service provider for DRAM makers Nanya Technology and Inotera Memories, saw November 2009 revenues drop slightly...

Lextar to maintain vertical partnership with LightHouse and Wellypower

Dec 4, 10:51

Lextar Electronics president and COO David Su has noted that the company currently has no plans to merge with LightHouse Technology and Wellypower Optronics and will instead maintain...

Lextar Electronics president and COO David Su

LCD driver IC supply may tighten in 1Q10

Newswatch - Dec 3, 15:28

LCD driver IC makers are likely to see supply interrupted by tight capacity at backend service suppliers and material shortages during the first quarter of 2010, as current orders...

I-Chiun dismisses report about 2010 outlook

Stockwatch - Dec 1, 16:34

LED leadframe maker I-Chiun Precision Industry has maintained that it has not released any forecast for 2010, in response to a Chinese language Commercial Times report that...

Amtran reportedly to invest in Everlight

Nov 26, 14:11

Taiwan-based LCD TV maker Amtran Technology reportedly has picked LED packaging house Everlight Electronics for its planned LED investment, according to market sources.

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Spirox sees no risk of overspending by foundries and IC backend suppliers in 2010

Nov 18, 16:36

Taiwan-based Spirox, which provides integrated solutions from IC design through manufacturing for the semiconductor and TFT LCD high-tech industries, has commented that there will...

ChipMOS expects 4Q09 revenues to stay flat or drop slightly on quarter

Nov 12, 12:17

Packaging and testing house ChipMOS Technologies has said revenues for the fourth quarter of 2009 may remain flat or drop by single-digits compared to the third quarter. Demand for...

LED chipmakers see October revenues increase

Nov 11, 16:32

LED chipmakers saw their October revenues increase on the high demand for high-brightness blue LEDs, while LED packaging houses saw sequential drop for October revenues.

LED companies post mixed October revenues

Nov 10, 10:11

LED packaging house Ledtech Electronics and LED chipmaker Tekcore have both posted record revenues for October, while LED packaging house Unity Opto Technology saw a 4.77% sequential...

Chipbond and IST 4Q09 revenues to drop 20% on quarter

Nov 5, 16:23

Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...

C-Tech said to have obtained battery pack orders for use in HP, Apple products

Oct 29, 17:15

Taiwan-based battery pack maker C-Tech United has landed orders from battery cell players LG Chem and Samsung SDI for battery packs that will eventually be used in notebook products...

PTI raises 2009 capex; chairman bullish on 2010 memory market

Oct 28, 14:22

Memory packaging and testing house Powertech Technology (PTI) has raised its capex for 2009 to NT$7 billion (US$216 million) on optimism about the recent market rebound, according...

PTI chairman DK Tsai

DRAM backend supplier FATC nears full utilization

Oct 27, 16:41

Formosa Advanced Technologies (FATC), a Taiwan-based memory packaging and testing service provider, has seen its capacity reach almost full utilization thanks to increased demand...

Camera module maker AOET ready for LED chip production

Oct 27, 14:11

Camera lens and module maker Ability Opto-Electronics Technology (AOET), a subsidiary of Foxconn Electronics (Hon Hai Precision Industry), has reportedly entered the production of...

Packaging material and equipment supplier Laser Tek positive about 4Q09

Newswatch - Oct 20, 16:00

Laser Tek, a major supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment in Taiwan, has reported clearer order visibility for LED packagers and laser...

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

444 items [9/13]
  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

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2015 China smartphone panel trend forecast

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