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News tagged packaging
  • Last update: Wednesday 22 November 2017 [551 news items]

ASE aims at global market share of 25-30% in 2014

Jun 29, 01:00

IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) aims to hike its global market share from 17-18% in 2010 to 25-30% in 2014, COO Tien Wu said at the...

Harvatek and TCL to jointly build LED packaging facility in China

Jun 28, 01:15

Taiwan-based LED packaging house, Harvatek, will be cooperating with China-based TCL Corporation to set up an LED packaging facility in Huizhou, China. The facility will begin production...

SPIL turning focus to SiP packaging, IDM orders

Jun 23, 01:30

Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...

Elpida develops 4-layer DRAM package with 0.8mm thickness

Jun 22, 10:13

Elpida Memory and its subsidiary, Akita Elpida Memory, have announced development of a four-layer 0.8mm DRAM package. The thin package consists of four low-power consumption 2Gb DDR2...

Ta-I shipping LED heat sink substrates to Everlight, Delta

Jun 17, 10:08

Ta-I Technology reportedly has cut into the supply chain of LED packaging house Everlight Electronics and lighting system manufacturer Delta Electronics with its LED heat sink substrates,...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

Taiwan battery makers say no impact from HP recall

May 31, 01:30

With Hewlett-Packard (HP) recently announcing a recall to some notebook batteries due to overheating and being a fire hazard, Taiwan-based notebook battery makers pointed out that...

Packaging material supplier Chang Wah eyeing solar, touch panel applications

May 23, 15:46

Chang Wah Electromaterials is looking to venture into the solar- and touch panel-use material sectors to sustain future growth, according to company chairman Chia-neng Huang.

Packaging material supplier Chang Wah sees growth in 2Q11 sales

May 9, 16:00

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects sales to grow sequentially in the second quarter...

Tong Hsing sees flat growth in 2Q11 revenues

May 5, 01:05

Taiwan's Tong Hsing Electronic Industries now expects second-quarter revenues to stay flat sequentially, compared with its previous estimate of sequential growth through the last...

Baseband processors still essential, says Petrov Group

May 3, 17:02

With the proliferation of tablets and smartphones application processors are in the limelight, but another group of mobile processors, basebands, deserve attention too, according...

PTI beats 1Q11 guidance, gives positive outlook

Apr 29, 01:35

Powertech Technology (PTI) on April 28 reported better-than-expected results for its first-quarter performance. The memory packaging and testing service provider also gave a rosy...

PTI chairman DK Tsai

IC testing firm Thailin to control packaging house ChipMOS Shanghai

Apr 25, 15:58

IC testing house Thailin Semiconductor will spend US$39.95 million to take up the control of ChipMOS Technologies (Shanghai) through the purchase of Modern Mind Technology, which...

IC packager ASE steps up investment in China

Apr 21, 01:20

Taiwan-based IC packaging and testing firm Advanced Semiconductor Engineering (ASE) has revealed plans to invest a total of US$1.2 billion on manufacturing facilities in Shanghai,...

IC backend 2Q11 sales likely affected by material shortages

Apr 14, 15:18

IC packaging and testing firms including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to provide a cautious outlook for the second...

Elpida says packaging and testing unit affected by earthquake

Apr 8, 14:32

Japan-based memory chip supplier Elpida Memory has disclosed the impact of the earthquake that occurred in northeast Japan on April 7 on its business operations.

Chipbond remains cautious about 2Q11

Apr 8, 11:28

LCD driver IC packaging and testing firm Chipbond Technology has remained cautious about the outlook for the second quarter due to low order visibility. The company expects to report...

Packaging and testing house Sigurd breaks ground for new factory, says report

Newswatch - Mar 31, 14:32

IC packaging and testing house Sigurd Microelectronics has broken ground on a new factory building located next to its existing production site in Hsinchu, northern Taiwan, according...

BT resin supply expected to return to normal in May

Mar 31, 01:00

Recovery work at Mitsubishi Gas Chemical's (MGC) Fukushima facility is progressing more quickly than expected, sources at Taiwan-based chip packaging and testing houses have claimed...

Wellypower announced corrected financial result for 2010

Mar 29, 01:20

CCFL supplier and LED chip packaging company Wellypower Optronics has announced the corrected finical result for 2010 of NT$548 million (US$18.6 million) for consolidated profit before...

Outsourced IC backend growth accelerating, says Digitimes Research

Mar 25, 15:11

The total market for semiconductor packaging and testing services grew 17.7% to US$44.755 billion in 2010, according to Digitimes Research. This represents the largest growth since...

Digitimes Insight: Japan earthquake impact on IC packaging industry

Mar 22, 14:10

Though several major IC packaging material suppliers have resumed operations at their earthquake-affected plants, there is still growing concern that production will be hampered by...

Global IC packaging production value, 2002-2010

Elpida says packaging and testing unit back in operation

Mar 17, 12:35

Elpida Memory has announced that Akita Elpida Memory, a packaging and testing subsidiary of Elpida, has resumed production on restoration of electricity supply.

Elpida likely to seek support from PTI for packaging and testing

Mar 15, 15:34

With plant operations disrupted due to power shortages, Japan-based Elpida Memory may ask for assistance from its packaging and testing partner Powertech Technology (PTI), industry...

Taiwan packaging and testing firms post sequential drops in February

Mar 8, 14:07

All major Taiwan-based chip packaging and testing firms saw sequential declines in consolidated sales in February 2011.

LED packager Lustrous expects to ship 1 million high-voltage units in 2011

Mar 4, 14:10

High-power LED packaging house Lustrous Technology expects shipments to reach one million units in 2011 as shipments are expected to increase significantly in the second half of the...

Chipbond, KYEC team up for power IC packaging and testing

Mar 3, 01:05

LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...

Oxford Instruments and ITRI jointly establish research center for WLP and LED packaging development

Feb 24, 10:35

Oxford Instruments and Industry Technology Research Institute (ITRI) have jointly set up a research center for wafer-level packaging (WLP) process in high-brightness LED and micro...

LED packaging houses expect 10% sequential growth in 1Q11 revenues, chipmakers expect revenues to remain flat

Feb 23, 01:35

Benefiting from the recovering demand for TV backlighting and general lighting, LED players expect strong performance in the first quarter of 2011 despite seasonality, and some packaging...

SPIL expects to outpace industry growth in 2011, says chairman

Jan 27, 01:40

Siliconware Precision Industries (SPIL) expects its sales growth to outperform the industry average in 2011, company chairman Bough Lin said at an investors meeting on January 26.

PTI expects 2011 revenues to rise 10-15%

Jan 26, 01:10

Memory packaging and testing firm Powertech Technology (PTI) expects 2011 revenues to rise 10-15% over 2009 thanks to strong mobile DRAM demand from the smartphone and tablet PC sectors,...

Walton expects double-digit revenue growth for 2011

Jan 21, 01:55

Memory packaging and testing firm Walton Advanced Engineering expects to enjoy double-digit growth in its 2011 revenues, and is eyeing a 20% gross margin, according to company president...

Renesas to set up procurement center in China

Jan 20, 01:00

Japan-based Renesas Electronics has revealed plans to establish its second international procurement center in Shanghai in April 2011. The move will allow it to work closely with...

Memory packager Walton expects 1Q11 utilization to fall to 70-80%

Jan 18, 01:15

Memory testing and packaging house Walton Advanced Engineering could see capacity utilization fall to 70-80% in the first quarter of 2011 versus 90% in the previous quarter, the company...

Commentary: Taiwan IC packaging and testing houses await AMD to increase outsourcing of processor backend processing

Jan 12, 01:15

With the recent chief executive change by AMD, sources from Taiwan's IC packaging and testing houses are hoping that the US-based company will change its policy and increase outsourcing...

551 items [9/16]
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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Global notebook shipment forecast, 2017 and beyond
China AMOLED panel capacity expansion forecast, 2016-2020

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.