Taipei, Tuesday, October 13, 2015 16:38 (GMT+8)
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News tagged packaging
  • Last update: Wednesday 23 September 2015 [436 news items]

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

ChipMOS loses DRAM packaging patent lawsuit against Walton

Dec 24, 10:20

Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...

Everlight and Unity Opto to hike 2010 capex

Dec 18, 15:14

LED packaging houses Everlight Electronics and Unity Opto Technology have raised their capex goals for 2010 amid growing demand for LED-backlight applications, according to market...

Unity Opto partners with China consumer electronics player for LED lighting

Dec 17, 15:28

Taiwan-based LED packaging houses Unity Opto Technology has signed an agreement with China-based Potevio's consumer electronic subsidiary to set up a LED lighting joint venture in...

Everlight aims at 3% LED TV backlight market share in 2010

Dec 15, 15:33

LED packaging house Everlight Electronics aims to take 3% of the global LCD TV-use LED backlight market in 2010, according to the company.

LED chipmakers and packaging houses see growth in November revenues

Dec 10, 15:52

LED chipmakers Epistar, Formosa Epitaxy (FOREPI) and Huga Optotech have all seen their revenues grow more than double on year for November, while packaging houses Everlight Electronics...

Mixed November sales results for Taiwan LED players

Dec 8, 12:20

LED players Unity Opto Technology, I-Chiun Precision Industry and Tekcore have reported mixed results for November, as Unity Opto saw its revenues drop over 10% sequentially, while...

Chipbond and IST announce merger

Dec 7, 17:00

Driver IC packaging houses Chipbond Technology and International Semiconductor Technology (IST) today (December 7) announced a merger through a stock swap.

IC packaging and testing companies experiencing strong orders for December 09 and 1Q10

Dec 7, 14:05

Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...

DRAM backend supplier FATC revenues down 3% in November 2009, but sees growth ahead

Dec 4, 11:03

Formosa Advanced Technologies (FATC), a major packaging and testing service provider for DRAM makers Nanya Technology and Inotera Memories, saw November 2009 revenues drop slightly...

Lextar to maintain vertical partnership with LightHouse and Wellypower

Dec 4, 10:51

Lextar Electronics president and COO David Su has noted that the company currently has no plans to merge with LightHouse Technology and Wellypower Optronics and will instead maintain...

Lextar Electronics president and COO David Su

LCD driver IC supply may tighten in 1Q10

Newswatch - Dec 3, 15:28

LCD driver IC makers are likely to see supply interrupted by tight capacity at backend service suppliers and material shortages during the first quarter of 2010, as current orders...

I-Chiun dismisses report about 2010 outlook

Stockwatch - Dec 1, 16:34

LED leadframe maker I-Chiun Precision Industry has maintained that it has not released any forecast for 2010, in response to a Chinese language Commercial Times report that...

Amtran reportedly to invest in Everlight

Nov 26, 14:11

Taiwan-based LCD TV maker Amtran Technology reportedly has picked LED packaging house Everlight Electronics for its planned LED investment, according to market sources.

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Spirox sees no risk of overspending by foundries and IC backend suppliers in 2010

Nov 18, 16:36

Taiwan-based Spirox, which provides integrated solutions from IC design through manufacturing for the semiconductor and TFT LCD high-tech industries, has commented that there will...

ChipMOS expects 4Q09 revenues to stay flat or drop slightly on quarter

Nov 12, 12:17

Packaging and testing house ChipMOS Technologies has said revenues for the fourth quarter of 2009 may remain flat or drop by single-digits compared to the third quarter. Demand for...

LED chipmakers see October revenues increase

Nov 11, 16:32

LED chipmakers saw their October revenues increase on the high demand for high-brightness blue LEDs, while LED packaging houses saw sequential drop for October revenues.

LED companies post mixed October revenues

Nov 10, 10:11

LED packaging house Ledtech Electronics and LED chipmaker Tekcore have both posted record revenues for October, while LED packaging house Unity Opto Technology saw a 4.77% sequential...

Chipbond and IST 4Q09 revenues to drop 20% on quarter

Nov 5, 16:23

Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...

C-Tech said to have obtained battery pack orders for use in HP, Apple products

Oct 29, 17:15

Taiwan-based battery pack maker C-Tech United has landed orders from battery cell players LG Chem and Samsung SDI for battery packs that will eventually be used in notebook products...

PTI raises 2009 capex; chairman bullish on 2010 memory market

Oct 28, 14:22

Memory packaging and testing house Powertech Technology (PTI) has raised its capex for 2009 to NT$7 billion (US$216 million) on optimism about the recent market rebound, according...

PTI chairman DK Tsai

DRAM backend supplier FATC nears full utilization

Oct 27, 16:41

Formosa Advanced Technologies (FATC), a Taiwan-based memory packaging and testing service provider, has seen its capacity reach almost full utilization thanks to increased demand...

Camera module maker AOET ready for LED chip production

Oct 27, 14:11

Camera lens and module maker Ability Opto-Electronics Technology (AOET), a subsidiary of Foxconn Electronics (Hon Hai Precision Industry), has reportedly entered the production of...

Packaging material and equipment supplier Laser Tek positive about 4Q09

Newswatch - Oct 20, 16:00

Laser Tek, a major supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment in Taiwan, has reported clearer order visibility for LED packagers and laser...

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

Everlight to issue common stock to raise about NT$3 billion

Oct 13, 12:27

Taiwan-based LED packaging house Everlight Electronics on October 12 announced that the board of directors has approved for issuing common stock to raise an estimated capital of NT$3.33...

Lite-On, Bright LED and Harvatek see year-high revenues in September

Oct 9, 16:52

LED packaging houses Lite-On Technology, Bright LED Electronics and Harvatek have all reported year-high revenues for September 2009.

Plant fire at KYEC affiliate ACE, reports paper

Newswatch - Oct 7, 16:57

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a...

PTI posts revenues high in September 2009

Oct 7, 15:25

Memory packaging and testing house Powertech Technology (PTI) has announced revenues for September 2009 rose 1.8% on year to NT$2.75 billion (US$85 million), replacing its previous...

3D IC packaging to be mature within 3 years, says ASE chief officer

Oct 2, 17:10

Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...

SoC and SiP

Topoint shipping micro drill bits to Japan

Oct 1, 17:03

Taiwan-based drill bit maker Topoint Technology has begun shipping its micro drill bits to three Japan-based IC substrate makers, which will help boost the company's market share...

SanDisk reportedly seeking extra NAND flash controllers and packaging support from Taiwan makers

Oct 1, 12:20

SanDisk is reportedly seeking additional supplies of NAND flash controller chips and support for backend packaging capacity from Taiwan makers for the production of microSD cards,...

SPIL and OSE microSD card packaging to run at full capacity on Samsung orders

Sep 28, 16:39

Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...

436 items [9/13]
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View more
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

Western China Import Expo & International Investment Fair
Taiwan server shipment forecast and industry analysis, 2015

13-Oct-2015 markets closed


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