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News tagged packaging
  • Last update: Wednesday 25 March 2015 [424 news items]

I-Chiun dismisses report about 2010 outlook

Stockwatch - Dec 1, 16:34

LED leadframe maker I-Chiun Precision Industry has maintained that it has not released any forecast for 2010, in response to a Chinese language Commercial Times report that...

Amtran reportedly to invest in Everlight

Nov 26, 14:11

Taiwan-based LCD TV maker Amtran Technology reportedly has picked LED packaging house Everlight Electronics for its planned LED investment, according to market sources.

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

One too many LCD driver IC backend service providers in Taiwan, says Chipbond

Nov 19, 14:22

Taiwan-based Chipbond Technology has commented that reducing the number of the local LCD driver IC packaging and testing houses to three through acquisitions or mergers will help...

Spirox sees no risk of overspending by foundries and IC backend suppliers in 2010

Nov 18, 16:36

Taiwan-based Spirox, which provides integrated solutions from IC design through manufacturing for the semiconductor and TFT LCD high-tech industries, has commented that there will...

ChipMOS expects 4Q09 revenues to stay flat or drop slightly on quarter

Nov 12, 12:17

Packaging and testing house ChipMOS Technologies has said revenues for the fourth quarter of 2009 may remain flat or drop by single-digits compared to the third quarter. Demand for...

LED chipmakers see October revenues increase

Nov 11, 16:32

LED chipmakers saw their October revenues increase on the high demand for high-brightness blue LEDs, while LED packaging houses saw sequential drop for October revenues.

LED companies post mixed October revenues

Nov 10, 10:11

LED packaging house Ledtech Electronics and LED chipmaker Tekcore have both posted record revenues for October, while LED packaging house Unity Opto Technology saw a 4.77% sequential...

Chipbond and IST 4Q09 revenues to drop 20% on quarter

Nov 5, 16:23

Chipbond Technology and International Semiconductor Technology (IST) may see sequential revenue drops of almost 20% in the fourth quarter of 2009, in accordance with driver IC design...

C-Tech said to have obtained battery pack orders for use in HP, Apple products

Oct 29, 17:15

Taiwan-based battery pack maker C-Tech United has landed orders from battery cell players LG Chem and Samsung SDI for battery packs that will eventually be used in notebook products...

PTI raises 2009 capex; chairman bullish on 2010 memory market

Oct 28, 14:22

Memory packaging and testing house Powertech Technology (PTI) has raised its capex for 2009 to NT$7 billion (US$216 million) on optimism about the recent market rebound, according...

PTI chairman DK Tsai

DRAM backend supplier FATC nears full utilization

Oct 27, 16:41

Formosa Advanced Technologies (FATC), a Taiwan-based memory packaging and testing service provider, has seen its capacity reach almost full utilization thanks to increased demand...

Camera module maker AOET ready for LED chip production

Oct 27, 14:11

Camera lens and module maker Ability Opto-Electronics Technology (AOET), a subsidiary of Foxconn Electronics (Hon Hai Precision Industry), has reportedly entered the production of...

Packaging material and equipment supplier Laser Tek positive about 4Q09

Newswatch - Oct 20, 16:00

Laser Tek, a major supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment in Taiwan, has reported clearer order visibility for LED packagers and laser...

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

Everlight to issue common stock to raise about NT$3 billion

Oct 13, 12:27

Taiwan-based LED packaging house Everlight Electronics on October 12 announced that the board of directors has approved for issuing common stock to raise an estimated capital of NT$3.33...

Lite-On, Bright LED and Harvatek see year-high revenues in September

Oct 9, 16:52

LED packaging houses Lite-On Technology, Bright LED Electronics and Harvatek have all reported year-high revenues for September 2009.

Plant fire at KYEC affiliate ACE, reports paper

Newswatch - Oct 7, 16:57

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a...

PTI posts revenues high in September 2009

Oct 7, 15:25

Memory packaging and testing house Powertech Technology (PTI) has announced revenues for September 2009 rose 1.8% on year to NT$2.75 billion (US$85 million), replacing its previous...

3D IC packaging to be mature within 3 years, says ASE chief officer

Oct 2, 17:10

Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...

SoC and SiP

Topoint shipping micro drill bits to Japan

Oct 1, 17:03

Taiwan-based drill bit maker Topoint Technology has begun shipping its micro drill bits to three Japan-based IC substrate makers, which will help boost the company's market share...

SanDisk reportedly seeking extra NAND flash controllers and packaging support from Taiwan makers

Oct 1, 12:20

SanDisk is reportedly seeking additional supplies of NAND flash controller chips and support for backend packaging capacity from Taiwan makers for the production of microSD cards,...

SPIL and OSE microSD card packaging to run at full capacity on Samsung orders

Sep 28, 16:39

Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...

Para Light expects revenue growth on China LED streetlamp orders

Sep 22, 15:01

Taiwan-based LED packaging house Para Light Electronics expects orders for LED streetlamps from Nanjing and Lianyuangang in Jiangsu province, China will start benefiting its revenues...

LED chipmakers and packaging houses expect strong demand in 4Q09

Sep 21, 17:10

LED chipmakers and packaging houses are unlikely to see seasonal decline in the fourth quarter, expecting revenues to remain at the levels seen in the third-quarter peak season due...

VisEra announces new LED packaging technology

Sep 17, 11:29

VisEra Technologies, a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), has announced a new high-power LED packaging technology based on 8-inch silicon wafer, which...

VisEra 8-inch wafer silicon based high-power LED packaging technology

Taiwan LED players post 7% revenues growth for August, says LEDinside

Sep 14, 17:09

Taiwan's listed LED manufacturers recorded total revenues of NT$6.41 billion (US$196.25 million) in August 2009, a 7.2% growth from July and a 8.3% growth on year, according to LEDinside...

Taiwan LED packaging houses post growth in August revenues

Sep 10, 16:26

Power supply vendor and LED packaging house Lite-On Technology has reported August consolidated revenue of NT$8.39 billion (US$256.94 million), dropping 1.64% from NT$8.53 billion...

Huga, Edison post record revenues for August

Sep 9, 14:13

Taiwan-based LED chipmaker Huga Optotech and LED packaging house Edison Opto both have reported record revenues for August.

Edison to expand high-power LED packaging capacity in China

Sep 2, 15:39

Taiwan LED packaging house Edison Opto will expand its packaging capacity for high-power LED chips at its plant in Yangzhou, China at the end of the third quarter or early in the...

Edison reports net profit of NT$118 million for 1H09

Sep 1, 12:11

Taiwan LED packaging house Edison Opto has posted net profit of NT$118.19 million (US$3.6 million) on revenues of NT$644.25 million for the first half of 2009, with operating income...

Ledtech aims at 90% of Taiwan low-temperature LED lighting market in 2010, says chairman

Aug 27, 16:22

LED packaging house Ledtech Electronics expects its share of Taiwan's low-temperature LED lighting market to rise from 60% currently to 90% in 2010, according to company chairman...

Ledtech low-temperature LED light bars

Taiwan IC foundry production value hikes 91.8% in 2Q09, says IEK

Aug 19, 11:11

Taiwan's IC-manufacturing production value grew 69.2% on quarter to NT$136.2 billion (US$4.13 billion) in the second quarter of 2009, with the IC foundry service segment up by 91.8%,...

LED packaging houses order visibility expands on increasing demand

Aug 18, 16:42

Taiwan-based LED packaging houses have seen their order visibility expand to 5-6 weeks from a previous four weeks amid increasing demand for high brightness (HB) LEDs used in large-size...

LED packaging house Everlight to expand capacity in 2H09

Aug 14, 15:54

Taiwan LED packaging house Everlight Electronics plans to expand its monthly capacity for high-power LEDs and SMD LEDs to five million units and 1.2 billion units respectively in...

424 items [9/13]
Realtime news
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    Displays | 8h 27min ago

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    Mobile + telecom - Newswatch | 8h 34min ago

  • IHS comments on Intel potential acquisition of Altera

    Bits + chips | 8h 36min ago

  • Epistar to start production of integrated power drivers based on Si substrates

    LED | 9h 31min ago

  • CPT reports decline for 2014 performance

    Displays | 9h 35min ago

  • Giga Solar Materials to deal out 2014 dividend of NT$15.00

    Green energy | 9h 37min ago

  • Asustek hopes to globally ship 30 million smartphones in 2015, says chairman

    Before Going to Press | 9h 45min ago

  • Inventec to set server production plants in Southeast Asia and Japan, says chairman

    Before Going to Press | 9h 46min ago

  • Taiwan market: Gogoro to unveil first e-bike in summer 2015

    Before Going to Press | 10h 8min ago

  • Lenovo plans to launch smartphones in Japan, says Nikkei

    Before Going to Press | 10h 9min ago

  • New government-sponsored technology research facilities kick off

    Before Going to Press | 10h 10min ago

  • Motherboard players already not expected to achieve shipment targets for 2015

    Before Going to Press | 10h 12min ago

  • IC distributor ANStek revenues and profits climb to 3-year highs

    Before Going to Press | 10h 13min ago

  • Niching 2014 profits hit 3-year high

    Before Going to Press | 10h 13min ago

  • Sony Mobile executive to visit Taiwan smartphone ODMs to enhance cooperation

    Before Going to Press | 10h 13min ago

  • China government to halt investments for BOE 10.5G LCD facilities

    Before Going to Press | 10h 14min ago

  • Health care remains a focus for wearable vendors

    Before Going to Press | 10h 15min ago

  • China PV makers expect demand to rebound in 2Q15

    Before Going to Press | 10h 16min ago

  • Samsung Display looking to revamp OLED TV panel production

    Before Going to Press | 10h 17min ago

  • Foxconn nets NT$8.85 per share for 2014

    Before Going to Press | 10h 18min ago

  • UMC snatches high-end 28nm chip orders from TSMC clients

    Before Going to Press | 10h 19min ago

  • Demand from China picking up, say IC design houses

    Before Going to Press | 10h 20min ago

  • Foundry chipmaker Powerchip rolls out solutions for IoT

    Before Going to Press | 10h 21min ago

  • Simplo pushing new businesses

    Before Going to Press | 10h 21min ago

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  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

High-brightness LED market trends and forecast, 2015
Analysis of China revised domestic semiconductor industry goals

30-Mar-2015 markets closed

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