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News tagged packaging
  • Last update: Wednesday 24 May 2017 [501 news items]

KYEC, Tong Hsing gearing up for new CIS orders

May 29, 01:20

Packaging and testing firms King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries reportedly have landed new orders for CMOS image sensors (CIS) from OmniVision, with...

Packaging and testing firms see mobile DRAM orders rise

May 22, 14:07

Memory packaging and testing specialists including Powertech Technology (PTI) and Walton Advanced Engineering have both enjoyed a ramp-up in orders for mobile DRAM chips recently,...

LED lighting packaging price to drop nearly 10% in 2Q12

May 4, 16:58

Quoted prices for LED lighting packaging parts have dropped around 3% during the second quarter and could drop 10% due to packaging firms moving from backlighting applications to...

Tong Hsing expects revenue growth through 4Q12

Apr 24, 00:33

Tong Hsing Electronic Industries, which provides assembly and packaging services for niche ICs and produces ceramic substrates for the production of LED devices, has guided that its...

Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS

Apr 17, 14:55

LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...

Second-tier packaging and testing firms post sales growth in 1Q12

Apr 11, 14:16

Revenues at Taiwan's second-tier packaging-and-testing houses Giga Solution, Greatek Electronics, Lingsen Precision Industries and Thailin Semiconductor all registered single-digit...

Walton and FATC 1Q12 sales up, PTI down

Apr 10, 11:37

Memory IC packaging and testing firms have reported mixed results for the first quarter of 2012. Walton Advanced Engineering and Formosa Advanced Technologies (FATC) both saw their...

ASE, SPIL report slight decreases in 2011 revenues

Apr 3, 01:40

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) reported 2011 consolidated revenues that represented an on-year decrease of 1.8%...

Aptos expanding 12-inch wafer level packaging business

Mar 14, 14:30

Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...

Walton says 1Q12 revenues to hit bottom

Feb 17, 01:15

Walton Advanced Engineering expects sales to register sequential growth starting the second quarter after hitting bottom in the first. The memory-IC backend service provider has also...

Walton expects sales to see sequential growth starting 2Q12

South Korea-based LED makers beat out Taiwan makers in LED packaging market share

Feb 14, 15:40

Samsung LED, LG Innotek, Seoul Semiconductors, and other South Korea-based makers together occupied 26% of the global production value for LED packaging in 2011, higher than the 19%...

LED TVs

Lextar operates in the red in 2011

Feb 10, 11:01

Taiwan-based LED firm Lextar Electronics has reported net losses of NT$138 million (US$4.67 million) or NT$0.34 per share for 2011. It also reported consolidated revenues of NT$650...

Lextar

PTI 1Q12 sales to drop up to 10%, says chairman

Feb 10, 01:30

Memory packaging and testing specialist Powertech Technology (PTI) now expects its sales to decrease up to 10% sequentially in the first quarter of 2012, company chairman DK Tsai...

ASE, SPIL post sales drops in January

Feb 9, 01:40

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...

Packaging and testing firms to post 5-10% drop in 1Q12

Jan 20, 01:05

Revenues at semiconductor packaging and testing houses will likely register a 5-10% sequential decrease in the first quarter of 2012, affected by fewer working days, according to...

Chang Wah seeing orders for driver IC-use packaging materials surge

Jan 19, 17:00

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects orders for COF (chip-on-film) packaging materials...

LED chipmakers and packaging firms suffer revenue declines in December

Jan 10, 15:58

Affected by seasonal factors, most Taiwan-based LED chipmakers and LED packaging companies have posted declines in revenues for December, with the setbacks suffered by upstream chipmakers...

Shenmao tapping Japan market

Jan 5, 01:00

Taiwan-based Shenmao Technology, which manufactures solder materials for IC assembly, has set up an office in Japan with the aim to cut into the supply chain of the country's first-tier...

Shenmao chairman San Lian Lee

PTI buys Nexx tool for advanced packaging

Jan 4, 15:49

IC packaging and testing house Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems. The Nexx Stratus will be used for copper...

Solder material maker Shenmao expects drop in 1Q12 sales

Jan 3, 13:48

Shenmao Technology expects its consolidated revenues to decrease 5-10% sequentially in the first quarter of 2012, citing seasonal factors as well as fewer working days due to Lunar...

Walton 1Q12 sales to decrease 5-10%

Jan 3, 01:10

Memory-IC packaging and testing specialist Walton Advanced Engineering expects its revenues to drop by another 5-10% sequentially in the first quarter following an almost 20% sequential...

SPIL steps into LED packaging

Dec 30, 16:48

Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, has stepped into high-end packaging of multiple LED chips, according to company vice...

Rohm reportedly places backend orders with Taiwan firms

Dec 29, 15:02

Rohm has released orders to ChipMOS Technologies and other Taiwan-based mid-scale packaging and testing firms over the last two months to avoid supply-chain disruptions caused by...

PTI looking to become world No. 4 packaging, testing firm

Dec 26, 12:13

Powertech Technology's (PTI) plan to acquire a controlling stake in Greatek Electronics will further expand its backend service offerings and production capacity for the logic IC...

LCD market to rebound in 2Q12, says Chipbond

Dec 22, 01:05

Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...

IC packaging materials market to reach US$25.7 billion by 2015, says SEMI

Dec 16, 13:58

The market for semiconductor packaging materials, including thermal interface materials, is expected to reach US$22.8 billion in 2011 and grow to US$25.7 billion by 2015, according...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

ChipMOS to expand logic IC business

Nov 24, 01:05

Packaging and testing firm ChipMOS Technologies has revealed plans to place a greater emphasis on logic chips, expecting sales ratio for the segment to expand to 20-25% within the...

ChipMOS chairman and CEO SJ Cheng

Taiwan LED packaging houses outperform chipmakers in October

Nov 16, 15:00

Total revenues of Taiwan-based publicly traded LED firms in October 2011 reached NT$7.69 billion (US$255 million), a 3.47% decrease on month and 10.2% decrease on year. The revenue...

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

Laser Tek expects November, December revenues to fall

Nov 10, 16:14

Laser Tek, a supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment, expects to report on-month drops in revenues for November and December. Passive...

Price of LED packaging may reach 1,000lm/US$ in 2015

Nov 10, 15:40

The LED lighting industry has been targeting a price for LED packaging to reach 500lm/US$ in 2012 and hit the threshold of 1,000lm/US$ in 2015. This target is five years ahead of...

PTI to reduce reliance on PC DRAM

Oct 28, 01:20

Packaging and testing house Powertech Technology (PTI) plans to lower the proportion of standard DRAM products in company revenues to less than 70% in the first quarter of 2012, and...

PTI chairman DK Tsai

Xilinx shipping new FPGA built on TSMC 28nm process

Oct 27, 10:12

Xilinx has announced the first shipments of its Virtex-7 2000T FPGA, the first product using 2.5D IC stacked packaging technology. The chip is built on TSMC's 28nm HPL (low power...

Vincent Tong, company senior VP of worldwide quality and new product introduction

SPIL sees 4-8% decline in 4Q11 revenues on lower utilization

Oct 27, 01:00

Semiconductor packaging and testing company Silicon Precision Industries (SPIL) has forecast revenues will decrease 4-8% sequentially in the fourth quarter of 2011, citing slowing...

SPIL chairman Bough Lin
501 items [6/15]
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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

UMC
Global AP demand forecast, 2017-2020

24-May-2017 09:45 (GMT+8)

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