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NEWS TAGGED PACKAGING
Monday 27 November 2023
India's Kaynes SemiCon plans first OSAT line in April, eyes advanced packaging tech partnerships
India's efforts to build a semiconductor manufacturing ecosystem have seen numerous companies enter the semiconductor packaging segment. One of them, Kaynes SemiCon, has revealed...
Thursday 23 November 2023
CMOS packaging specialist Tong Hsing expects modest growth in 4Q23
CMOS image sensor (CIS) packaging house Tong Hsing Electronic expects modest sequential shipment growth in the fourth quarter of 2023, as communication module and car sales momentum...
Monday 20 November 2023
Samsung jumps into AI, set to unveil cutting-edge 3D packaging tech in 2024
With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024,...
Wednesday 15 November 2023
IC packaging material distributors see demand pick up
Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee Industrial, among others, have observed an increase in demand for IC packaging materials and are generally...
Monday 13 November 2023
Taiwanese equipment makers venture into OHT market to serve thriving backend houses
As the material handling in each production process of semiconductor factories is moving toward intelligent transportation, Taiwanese equipment manufacturers have evolved from mature...
Thursday 9 November 2023
Chinese chip packaging leader JCET observes a resurgence in smartphone market
The shipment volume of smartphones in China has been continuously decreasing for ten consecutive quarters. The latest reports from various research institutions, including TechInsights,...
Thursday 9 November 2023
Semco set to complete new plant for advanced chips packaging substrates in May 2024
Samsung Electro-Mechanics (Semco) is poised to strengthen its position in the semiconductor industry with the construction of a new plant at its Sejong manufacturing base in South...
Friday 3 November 2023
TSMC modifies new fab projects in Taiwan, sources say
TSMC has made changes to its new fab projects in Taiwan, including the suspension of a planned advanced packaging fab in the Hsinchu Science Park (HSP) Tongluo site, according to...
Thursday 2 November 2023
Equipment supplier Contrel secures orders for microLED, panel-level packaging
Contrel Technology, an LCD equipment specialist, has received orders for microLED and panel-level packaging from Taiwan's top-two panel makers, AUO and Innolux, which will drive revenue...
Tuesday 31 October 2023
TSMC fab investments buoying STSP revenue
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
Tuesday 31 October 2023
JCET sees growth accelerate in 3Q23
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Monday 30 October 2023
Winbond upbeat about 2024 prospects
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...
Friday 27 October 2023
Intel expects 4Q23 revenue to return to on-year growth
Intel is optimistic that for the first time in two years, fourth-quarter 2023 revenue will return to positive year-over-year growth, and that the PC market, which accounts for the...
Friday 27 October 2023
IC backend houses see AI chips, CPO stimulate advanced packaging demand
AI chips and co-packaged optics (CPO) will stimulate demand for advanced packaging in 2024, during which the semiconductor industry is expected to rebound.
Thursday 26 October 2023
Substrate-based packaging for chiplet designs gaining popularity
Substrate-based packaging for chiplet designs is gaining favor among AI HPC customers, according to sources at OSATs.