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News tagged packaging
  • Last update: Monday 18 September 2017 [538 news items]

Demand for COB packaging used in high-power LED lighting to grow fast, says Lextar

Apr 2, 20:53

As high-power LED lighting for commercial purposes is significantly on the rise, demand for COB (chip on board) packaging of high-power LED chips used in lighting will grow fast in...

Intel to keep LGA as mainstream packaging until 1H15, say Taiwan motherboard makers

Mar 22, 10:53

Intel's latest roadmap for desktop platform development indicates that LGA will be maintained as the mainstream packaging for processors, accounting for 95% of all packaging, at least...

Packaging material supplier Chang Wah to post double-digit revenue growth in 2Q13

Mar 20, 14:19

Packaging material supplier Chang Wah Electromaterials is expected to post a double-digit growth in revenues in the second quarter of 2013, powered by increasing orders for flip chip...

Greatek looks to improved profitability on copper wire bonding lines

Mar 13, 13:51

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

Newswatch - Mar 4, 12:18

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Scientech deepens development of 3D IC, wafer-level packaging equipment

Jan 31, 16:04

Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin

Spreadtrum adopts STATS ChipPAC eWLB packaging for smartphone ICs

Jan 24, 12:36

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones...

Walton to cut 2013 capex, provides cautious outlook

Jan 22, 21:50

Walton Advanced Engineering, which provides packaging and testing services for memory chips, has expressed caution about its business outlook for 2013. Filling under-utilized capacity...

Chipbond, ChipMOS 2013 capex to stay flat

Jan 22, 19:58

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.

Unity Opto expects 1Q13 LED lighting packaging shipments to reach 200,000 units

Jan 9, 22:13

As LED lighting is expected to boom, firms have been looking into adopting automated production. Nan Ya Photonics, a Taiwan-based joint venture between LED chipmaker Epistar and the...

STATS ChipPAC raises 4Q12 revenue outlook

Jan 4, 14:49

STATS ChipPAC, a semiconductor test and packaging service provider, has revised upward its fourth-quarter revenue guidance to a 16-18% sequential increase from the 2-8% growth estimated...

ASE reportedly lands small-volume orders for Apple processors

Dec 27, 21:00

Taiwan-based Advanced Semiconductor Engineering (ASE), an IC packaging and testing services provider, reportedly has begun to fulfill small-volume orders for Apple's A-series proce...

Packaging material supplier Chang Wah looks to strong sales in 4Q12

Dec 18, 15:48

Packaging material supplier Chang Wah Electromaterials is expected to continue to post strong sales in the fourth quarter of 2012 thanks to brisk demand coming from the handset and...

iPhone 5 yield rates improving, say sources

Dec 5, 14:44

Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...

Digitimes Research: China LED packaging houses Refond, Jufei, Z-Light to continue capacity growth in 2013

Nov 27, 11:45

Refond Optoelectronics, Jufei Optoelectronics, and Z-Light Optoelectronics are medium-size LED packaging firms in China. These firms have relatively low capital compared to Nationstar...

Solder material maker Shenmao strengthening deployment in China

Nov 26, 22:10

Taiwan-based Shenmao Technology, which manufactures solder materials for IC packaging, plans to set up new plants in China in order to sustain future growth, according to the compa...

Taiwan IC backend production value to dip in 4Q12, says IEK

Nov 20, 13:45

The production value of Taiwan's IC packaging and testing industry sectors registered sequential growth of 2% and 2.3%, respectively, in the third quarter of 2012, according to data...

IC substrate makers develop coreless substrates for thin-profile mobile devices

Oct 26, 13:59

Major Taiwan-based IC substrate suppliers, including Nanya PCB (NPC) and Unimicron Technology, have developed coreless IC substrates for use in thin-profile mobile devices, and already...

Chipbond 4Q12 sales likely to drop 5%

Oct 18, 22:14

LCD-driver-IC packaging and testing house Chipbond Technology is expected to post a sales drop of about 5% sequentially in the fourth quarter of 2012, compared to the double-digit...

STATS ChipPAC cuts 3Q12 outlook

Sep 21, 01:25

STATS ChipPAC, a semiconductor test and packaging service provider, now expects its third-quarter sales to decrease 3-5% on quarter. The firm previously estimated flat sequential...

Chipbond 12-inch gold bumping lines to operate at full capacity in September

Sep 11, 16:33

LCD driver IC packaging and testing firm Chipbond Technology will see its 12-inch gold bumping lines operate at full capacity in September thanks to orders from Renesas Electronics,...

SPTS announces dry etch process technology for via reveal applications

Sep 6, 13:50

SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...

Demand for copper wirebonding packaging to peak in 2014

Sep 6, 13:36

Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...

Taiwan IC backend firms look to expand in Korea

Sep 4, 01:00

Recent moves by Advanced Semiconductor Engineering (ASE) and Ardentec suggest that Taiwan-based IC packaging and testing houses are looking to expand their presence in South Korea,...

Taiwan copper wirebonding production value to rise

Sep 3, 12:11

The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.

Tong Hsing raises 2012 capex

Aug 24, 11:51

Tong Hsing Electronic Industries, which provides assembly and test services for niche ICs and produces ceramic substrates for the manufacture of LEDs, has budgeted more than NT$2...

Tong Hsing president Henry Liu

Taiwan IC packaging materials market to see 5% shipment rise in 3Q12

Aug 24, 10:39

Taiwan's semiconductor packaging materials industry is expected to generate NT$23.78 billion (US$794 million) in production value in the third quarter of 2012, with shipments up 5%...

Chipbond 3Q12 sales driven by demand for small-size panel driver ICs

Aug 21, 01:15

Consolidated revenues at Chipbond Technology are set to increase 5-10% sequentially in the third quarter of 2012, driven by strong demand for its 12-inch bumping services used for...

Quanta aiming to move all notebook production lines to Chongqing by 2014

Aug 16, 01:25

Quanta Computer is aiming to move all its notebook production lines except those for Apple's products to Chongqing, China within two years and estimates that its notebook shipments...

Walton expects flat or slight growth in 3Q12 sales

Aug 10, 01:35

Walton Advanced Engineering, which provides packaging and testing services for memory chips, expects its third-quarter revenues to be flat or rise slightly on quarter. The firm indicated...

Walton president Yu Hong-chi says company will focus on niche-market DRAM and mobile DRAM markets

Chipbond 3Q12 sales to grow up to 5%

Jul 13, 12:03

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...

Packaging material supplier Chang Wah 3Q12 shipments to rise

Jul 4, 13:43

Chang Wah Electromaterials is forecast to post shipment growth of more than 10% sequentially in the third quarter of 2012 as its IC customers including Advanced Semiconductor Engineering...

China-based LED chipmaker obtains certification from Taiwan-based packaging houses

Jul 2, 11:27

China-based LED chipmaker Sanan Optoelectronics may enter Taiwan's LED supply chain in third-quarter 2012. The firm has been certified by packaging houses such as Everlight and Unity...

Epistar

Greatek remains focused on shift to copper wire bonding

Jun 29, 01:20

IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...

538 items [6/16]
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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

UMC
China AMOLED panel capacity expansion forecast, 2016-2020

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.