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News tagged packaging
  • Last update: Tuesday 26 April 2016 [454 news items]

PTI 1Q12 sales to drop up to 10%, says chairman

Feb 10, 01:30

Memory packaging and testing specialist Powertech Technology (PTI) now expects its sales to decrease up to 10% sequentially in the first quarter of 2012, company chairman DK Tsai...

ASE, SPIL post sales drops in January

Feb 9, 01:40

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...

Packaging and testing firms to post 5-10% drop in 1Q12

Jan 20, 01:05

Revenues at semiconductor packaging and testing houses will likely register a 5-10% sequential decrease in the first quarter of 2012, affected by fewer working days, according to...

Chang Wah seeing orders for driver IC-use packaging materials surge

Jan 19, 17:00

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects orders for COF (chip-on-film) packaging materials...

LED chipmakers and packaging firms suffer revenue declines in December

Jan 10, 15:58

Affected by seasonal factors, most Taiwan-based LED chipmakers and LED packaging companies have posted declines in revenues for December, with the setbacks suffered by upstream chipmakers...

Shenmao tapping Japan market

Jan 5, 01:00

Taiwan-based Shenmao Technology, which manufactures solder materials for IC assembly, has set up an office in Japan with the aim to cut into the supply chain of the country's first-tier...

Shenmao chairman San Lian Lee

PTI buys Nexx tool for advanced packaging

Jan 4, 15:49

IC packaging and testing house Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems. The Nexx Stratus will be used for copper...

Solder material maker Shenmao expects drop in 1Q12 sales

Jan 3, 13:48

Shenmao Technology expects its consolidated revenues to decrease 5-10% sequentially in the first quarter of 2012, citing seasonal factors as well as fewer working days due to Lunar...

Walton 1Q12 sales to decrease 5-10%

Jan 3, 01:10

Memory-IC packaging and testing specialist Walton Advanced Engineering expects its revenues to drop by another 5-10% sequentially in the first quarter following an almost 20% sequential...

SPIL steps into LED packaging

Dec 30, 16:48

Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, has stepped into high-end packaging of multiple LED chips, according to company vice...

Rohm reportedly places backend orders with Taiwan firms

Dec 29, 15:02

Rohm has released orders to ChipMOS Technologies and other Taiwan-based mid-scale packaging and testing firms over the last two months to avoid supply-chain disruptions caused by...

PTI looking to become world No. 4 packaging, testing firm

Dec 26, 12:13

Powertech Technology's (PTI) plan to acquire a controlling stake in Greatek Electronics will further expand its backend service offerings and production capacity for the logic IC...

LCD market to rebound in 2Q12, says Chipbond

Dec 22, 01:05

Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...

IC packaging materials market to reach US$25.7 billion by 2015, says SEMI

Dec 16, 13:58

The market for semiconductor packaging materials, including thermal interface materials, is expected to reach US$22.8 billion in 2011 and grow to US$25.7 billion by 2015, according...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

ChipMOS to expand logic IC business

Nov 24, 01:05

Packaging and testing firm ChipMOS Technologies has revealed plans to place a greater emphasis on logic chips, expecting sales ratio for the segment to expand to 20-25% within the...

ChipMOS chairman and CEO SJ Cheng

Taiwan LED packaging houses outperform chipmakers in October

Nov 16, 15:00

Total revenues of Taiwan-based publicly traded LED firms in October 2011 reached NT$7.69 billion (US$255 million), a 3.47% decrease on month and 10.2% decrease on year. The revenue...

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

Laser Tek expects November, December revenues to fall

Nov 10, 16:14

Laser Tek, a supplier of SMD (surface-mount-device) packaging materials and semiconductor equipment, expects to report on-month drops in revenues for November and December. Passive...

Price of LED packaging may reach 1,000lm/US$ in 2015

Nov 10, 15:40

The LED lighting industry has been targeting a price for LED packaging to reach 500lm/US$ in 2012 and hit the threshold of 1,000lm/US$ in 2015. This target is five years ahead of...

PTI to reduce reliance on PC DRAM

Oct 28, 01:20

Packaging and testing house Powertech Technology (PTI) plans to lower the proportion of standard DRAM products in company revenues to less than 70% in the first quarter of 2012, and...

PTI chairman DK Tsai

Xilinx shipping new FPGA built on TSMC 28nm process

Oct 27, 10:12

Xilinx has announced the first shipments of its Virtex-7 2000T FPGA, the first product using 2.5D IC stacked packaging technology. The chip is built on TSMC's 28nm HPL (low power...

Vincent Tong, company senior VP of worldwide quality and new product introduction

SPIL sees 4-8% decline in 4Q11 revenues on lower utilization

Oct 27, 01:00

Semiconductor packaging and testing company Silicon Precision Industries (SPIL) has forecast revenues will decrease 4-8% sequentially in the fourth quarter of 2011, citing slowing...

SPIL chairman Bough Lin

Integration a must for packaging and testing industry, says ASE chairman

Oct 24, 15:04

If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits, according to Jason Chang, chairman...

ASE chairman Jason Chang

Packaging and testing firms see flat growth in 4Q11

Oct 21, 01:05

The global semiconductor packaging and testing industry will only see flat sequential growth in the fourth quarter of 2011, as it continues to feel the effects of the economic downturn,...

ASE looks to expand

Sep 23, 01:05

IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) expects its consolidated revenues to top US$30 billion in 2020, and is eyeing a 30% global market...

IC packaging house Sigurd lands large volume orders for 4Q11, says paper

Newswatch - Sep 22, 14:47

IC packaging and testing house Sigurd Microelectronics is expected to see its revenues grow 10% sequentially in the fourth quarter of 2011 due to increasing orders from four major...

ASE breaks ground on China headquarters

Sep 22, 01:00

Advanced Semiconductor Engineering (ASE) broke ground at the site of a regional headquarters in Zhangjiang, Shanghai on September 21. Operations are scheduled to commence in 2012,...

SEMICON Taiwan 2011: Companies announce job openings

Sep 8, 01:40

A number of Taiwan-based semiconductor companies including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), memory chipmakers...

TSMC high-end IC packaging impacts IC packaging/testing houses

Sep 6, 01:10

Taiwan Semiconductor Manufacturing Company (TSMC) has undertaken in-house high-end packaging of ICs produced by its foundry processes for fabless IC design houses in the US and Europe...

Tong Hsing expects revenues to peak in 4Q11

Sep 2, 11:37

Tong Hsing Electronic Industries, which provides assembly and packaging services for niche ICs and produces ceramic substrates for the production of LED devices, expects revenues...

ASE to compete for orders for low pin-count packaging from IDMs

Aug 30, 01:00

Taiwan-based Advanced Semiconductor Engineering (ASE), viewing that global outsourced production value for wire-bonding packaging of low pin-count ICs, including logic and discrete...

SPIL vying for CPU back-end orders from Apple

Aug 26, 11:07

Packaging and testing firm Siliconware Precision Industries (SPIL) is likely to snatch outsourcing orders for Apple's new processor dubbed A6, according to industry sources.

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

PTI, Walton look to lower revenues in 4Q11

Aug 18, 14:58

Memory packaging and testing firms Powertech Technology (PTI) and Walton Advanced Engineering both expect their fourth-quarter revenues to be lower than the levels recorded in the...

454 items [5/13]
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    Before Going to Press | 8h 53min ago

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    Before Going to Press | 9h ago

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    Before Going to Press | 9h 1min ago

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  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

UMC
Wireless broadband developments in Southeast Asia markets

4-May-2016 markets closed

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TAIEX (TSE)8294.12-83.78-1% 

TSE electronic324.08-4.27-1.3% 

GTSM (OTC)124.01-0.73-0.59% 

OTC electronic158.75-0.85-0.53% 

Analysis of China revised domestic semiconductor industry goals
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  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.