System vendors are seeking capacity support from IC analysis laboratories for 2024 through their contracted IP service providers, as they foresee high demand for advanced packaging,...
IC materials distributors have enjoyed a ramp-up in orders for heat sinks, thanks to strong advanced packaging demand for HPC chips, according to industry sources.
LED packaging house Harvatek is unlikely to see its revenue grow as strong as expected in the second half as its US-based clients were conservative about demand during the peak season,...
One of AMD CEO Lisa Su's priorities for her planned mid-July visit to Taiwan will be securing TSMC's available CoWoS packaging capacity, according to sources with knowledge of the...
Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
IC verification lab Materials Analysis Technology (MA-tek) plans to allocate NT$1.2 billion (US$38.6 million) in capital expenditures for 2023, of which nearly 80% will be used to...
As the geopolitical tensions between the US and China are leading to reshaping the global supply chain landscape, China-based JCET is looking to grab a bigger pie of the rising Chinese...
Niching Industrial, which distributes IC packaging materials, has seen a steady recovery in demand for display driver ICs (DDI) and a significant rise in demand for vapor chambers...
As semiconductor firms such as IDM Intel and OSAT ASE Technology increase their local investments, packaging and testing supply chains are expanding in Eastern Europe and Southeast...
The production of AI server chips necessitates not only advanced process fabrication but also the packaging used for high-end HPC processors; however, the supply of advanced packaging...
Nvidia CEO Jensen Huang's exclamation of the arrival of "AI's iPhone moment" sparked an explosive demand for AI HPC (high-performance computing) chips. For 2.5D advanced packaging...
Universal Scientific Industrial (USI), a wholly-owned subsidiary of ASE Technology (ASEH), has disclosed that it is committed to integrating the production of powertrain systems,...
IC leadframe demand is expected to grow sharply in the next several years, as a result of expansions of packaging capacity. Texas Instruments (TI), for example, has recently announced...
Micron Technology Inc. is close to an agreement to commit at least $1 billion toward setting up a semiconductor packaging factory in India, according to people with knowledge of the...
Siliconware Precision Industries (SPIL) with its 2.5D and fan-out packaging technology has cut into the supply chain of network processor vendor Marvell, according to industry sour...
