As the demand for AI chips surges, and TSMC's capacity of CoWos is expected to remain tight until its Tongluo facility begins operation in 2027, other "CoWos-like suppliers" are expected...
LED leadframe specialist I-Chiun Precision Industry has stepped up efforts to improve its product mixes, with plans to enhance its heatspreader output for advanced packaging, according...
Amkor Technology is ramping up its capacity for advanced packaging production, with monthly output for 2.5D packaging expected to reach 5,000 wafers in the first half of 2024, up...
Semiconductor materials distributor Wah Lee Industrial has enjoyed robust orders catering to customers' advanced packaging needs, such as TSMC's CoWoS, as a result of the AI server...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...
AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...
Conventional wirebonding packaging demand remains sluggish, and OSATs are extremely cautious regarding the demand outlook for this year, according to industry sources.
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
Taiwan-based IC lead frame maker Chang Wah Technology (CWTC) expects to gain momentum for its automotive product segment in 2024, driven by major achievements in car chip developments...
High bandwidth memory (HBM) has become a hot keyword in the memory industry recently. As the demand for HBM is increasing due to the AI and HPC market expansion, HBM is likely to...
Tong Hsing Electronics, a major backend services provider for CMOS image sensors (CIS), expects the handset market to remain weak throughout 2023, with demand sliding faster than...
Taiwan-based ASIC manufacturer, Faraday Technology, has experienced a significant decline in profits in Q2 this year, influenced by the revenue decrease in its three major product...
TSMC is planning to invest nearly NT$90 billion (US$2.85 billion) to establish an advanced chip packaging plant in Miaoli, northern Taiwan with the facility scheduled to begin volume...
As GPUs become essential components for artificial intelligence (AI) computing, orders for Nvidia GPUs are also garnering attention. Recently, there have been reports that Nvidia...
