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News tagged packaging
  • Last update: Wednesday 3 December 2014 [417 news items]

Kinsus to commence operation of China plant

Sep 28, 01:00

Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...

Chipbond likely to miss revenue guidance for 3Q10

Sep 24, 01:05

Chipbond Technology will likely see revenues for the third quarter of 2010 remain flat on quarter, missing its guidance of 5-10% growth, according to market watchers. The driver-IC...

Taiwan Oasis to break even in 3Q10

Sep 21, 01:50

LED chip packaging house Taiwan Oasis Technology has continued to unwind holdings in unprofitable investments and could break even in the third quarter of 2010. The company posted...

Memory backend houses to see slight or flat sequential growth in 4Q10 revenues

Sep 15, 14:44

Although DRAM makers are improving production yields, which should raise demand for backend services, the possible drop in memory packaging quotes is expected to slow Taiwan-based...

SPIL enters LED packaging market

Sep 14, 15:26

Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...

Taiwan LED packagers, chipmakers report sequential drop in August revenues

Sep 7, 11:35

LED chip packaging house Unity Opto Technology saw August revenues slip 4.6% sequentially but up 58% on year to NT$670 million (US$20.979 million). Revenues from January through August...

Demand rebound for large-size panels to move back from August to October, says Chipbond chairman

Sep 1, 15:38

A demand rebound for large-size LCD panels will take place in the first two weeks of October instead of August as previously expected, Fei-Jain Wu, chairman of driver-IC packaging...

IC material distributor Niching sees sequential revenue growth in 2H10

Aug 31, 14:05

IC material distributor Niching Industrial has remarked that its revenue outlook for the second half of 2010 remains positive, buoyed by new orders from the memory sector and growing...

LED packaging houses Everlight and Harvatek announce strong profits for 1H10

Aug 26, 11:36

LED packager Everlight Electronics has posted NT$8.3 billion (US$259.3 million) in consolidated revenues for the first half of 2010, up 75.35% on year. First-half after-tax profit...

Unity Opto to increase capital and issue bonds to expand capacity

Aug 12, 12:04

The board of LED packaging company Unity Opto Technology, on August 11, approved plans to issue convertible bonds worth NT$1.5 billion (US$47.1 million) with a conversion price set...

IC packaging and testing firms post revenue gains in July

Aug 6, 12:14

Several major Taiwan-based packaging and testing companies have reported sequential revenue gains for July 2010.

Chipbond sees moderate growth in 3Q10

Jul 21, 11:37

LCD driver IC packaging and testing house Chipbond Technology expects July revenues to slightly decrease from June, but overall demand will pick up again in August and September....

IC packaging and testing houses turn conservative over 3Q10 outlook

Jul 15, 16:08

Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue growth for the traditional peak season,...

Japan TV vendors come to Taiwan to secure LED supply

Jun 25, 15:17

Amid the surging demand for LED-backlit LCD TVs, Japanese TV vendors recently visited Taiwan to secure LED supplies. LED packaging houses including Everlight Electronics, Unity Opto...

Unity Opto expects 70% sequential growth in revenues for 2Q10

Jun 25, 13:59

LED packaging house Unity Opto Technology expects second-quarter 2010 revenues to increase 70% sequentially with NT$760-800 million projected for June and sales for the full year...

Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season

Jun 23, 11:00

Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...

IC packaging and testing house KYEC looks to modest revenue gains in 3Q10

Jun 18, 15:57

IC packaging and testing house King Yuan Electronics (KYEC) expects its revenues to grow at a single-digit rate in the third quarter of 2010 due to a high base recorded in the second...

Everlight, Epistar and TPV to form LED packaging JV in China

Jun 17, 11:57

LED chipmaker and packager Everlight Electronics will establish a joint venture with Epistar and TPV Technology in Fuzhou City in China's Fujian Province for LED chip packaging and...

ChipSiP partners with Zoran for PoP packaging

Jun 15, 11:58

Taiwan-based SiP solution provider ChipSiP Technology and Zoran have announced that they have collaborated to produce a new slim package solution for the compact digital camera market...

ASE, SPIL May revenues up on month

Jun 8, 14:23

Chip packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) saw their consolidated revenues for May 2010 grow 5.7% and 2.9%...

Amtran, Everlight, and LG Display to form LED packaging JV for LCD TV market

Jun 4, 02:00

Taiwan-based LCD TV maker Amtran Technology has announced a plan to form an LED packaging joint venture in China with LED packager Everlight Electronics and TFT LCD panel maker LG...

Chip backend houses to see strong 3Q10

Newswatch - May 25, 17:01

Chip packaging and testing houses are expected to generate sequential revenue growth through the third quarter, judging from their foundry partners' high utilization rates, according...

Chip packagers reportedly to raise quotes on gold costs

May 19, 11:44

Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...

LED prices likely to go up 5-10%

May 13, 15:31

LED backlight products may see their prices increase by 5-10% as both upstream LED chip and epitaxial wafer prices will rise soon due to strong market demand, according to sources...

LED chipmakers, packaging houses report mixed results for 1Q10

May 10, 10:02

Players in Taiwan's LED industry have reported mixed results for the first quarter of 2010.

Everlight, Bright LED April revenues up, Lite-On Tech down sequentially

May 7, 12:22

LED packaging houses Everlight Electronics and Bright LED saw their April revenues increase by 1.6% and 17.79% on month, respectively. Meanwhile, Lite-On Technology saw its April...

LED players see April revenues rise

May 6, 16:06

LED chipmaker Formosa Epitaxy (FOREPI) and LED packaging house Unity Opto Technology both saw 20% on-month growth in April revenues with LED chipmaker Tyntek and LED leadframe maker...

LED companies see revenue growth in 1Q10

Apr 29, 15:19

LED packaging houses Everlight Electronics, Unity Opto Technology and Ledtech Electronics, and LED chipmaker Formosa Epitaxy (FOREPI) have all reported growth in their first-quarter...

Passive component material suppliers Laser Tek and Leatec to see 10% sequential revenue growth in 2Q10

Apr 27, 15:26

Laser Tek, which mainly produces SMD (surface-mount-device) packaging materials, and chip-resistor substrate supplier Leatec Fine Ceramics are expected to see second-quarter revenues...

Chipbond sees profits in 1Q10

Apr 23, 15:37

LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...

Packaging material supplier Chang Wah to hand out NT$6 cash dividends for 2009

Apr 16, 16:19

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has decided to deal out dividends of NT$6 in cash for 2009, based on the pre-tax profits of NT$564 million...

STATS ChipPAC intros 300mm embedded WLB wafer manufacturing

Apr 13, 12:00

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...

All Ring says 2Q10 revenues to grow sequentially

Apr 6, 16:14

All Ring Tech, which makes equipment used in the production of LCD panels, passive components as well as IC packaging, expects revenues for the second quarter to be higher than the...

Everlight expects LED demand from large-size products to be 6-7 times larger than handset

Apr 1, 16:14

LED packaging house Everlight Electronics expects LED demand from large-size products such as notebooks, LCD monitors and LCD TVs will be 6-7 times larger than the handset segment's...

LED players expect revenues to grow significantly starting March

Apr 1, 15:56

LED packaging houses Unity Opto Technology, Everlight Electronics and Ligitek Electronics all expect their revenues to grow strongly in March, with a chance of hitting record levels,...

417 items [7/12]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

  • Applied+Producer+InVia+dielectric+deposition+system

    Applied Producer InVia dielectric deposition system

    Applied Materials has added to its line of 3D chip packaging solutions with the launch of its Applied Producer InVia dielectric deposition system. Using a proprietary CVD process,...

    Photo: Company, Mar 31.

  • Samsung+0%2E6mm%2Dthick+multi%2Dchip+memory+package

    Samsung 0.6mm-thick multi-chip memory package

    Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package...

    Photo: Company, Nov 10.

  • Finetech+Japan+2009%3A+Ito+Electronics%27+water%2Dproof+OLED+display

    Finetech Japan 2009: Ito Electronics' water-proof OLED display

    Japan-based Ito Electronics showcased its water-proof OLED display at Finetech Japan 2009. With its packaging technology, Ito allows OLED to work under water.

    Photo: Jessie Lin, Digitimes, Apr 21.

2015 global notebook demand forecast
Trends and forecasts for the China FPD industry, 2014-2017

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