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NEWS TAGGED PACKAGING
Tuesday 26 September 2023
Niching sees clear order visibility for heat sinks
Niching Industrial, a distributor of IC packaging materials, sees clear order visibility for heat sinks thanks to brisk demand for midrange and high-end logic IC packaging.
Friday 22 September 2023
SKC invests in US startup Chipletz to strengthen packaging capability
SKC, the specialized materials manufacturer under the SK Group is poised to invest in Chipletz, a US IC packaging startup, to enhance its capability in IC packaging.
Wednesday 20 September 2023
Taiwan OSATs step up SiPh deployment
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Tuesday 19 September 2023
TSMC and Arizona discussing advanced chip packaging investment
Taiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity to the chipmaker's plants in the state, Governor Katie Hobbs...
Tuesday 19 September 2023
Packaging material distributors see stable demand for automotive, advanced packaging
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
Tuesday 19 September 2023
Intel gearing up for glass substrate production for advanced packaging
Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.
Friday 15 September 2023
IC leadframe suppliers brace for profit decrease in 2023
IC packaging leadframe suppliers are bracing for on-year profit decreases in 2023, as demand for automotive chips cannot offset the impact of diminishing consumer chip demand, according...
Wednesday 13 September 2023
Chip packaging is the next battleground for tech lead, CEO says
The US should invest more in cutting-edge semiconductor packaging to ensure it leads in emerging technologies such as artificial intelligence, Cadence Design Systems Inc. Chief Executive...
Wednesday 13 September 2023
IC backend houses to see demand recovery in 2024
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Tuesday 12 September 2023
AI and HPC chips boost the verification and analysis business
Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat...
Tuesday 12 September 2023
Samsung, SK Hynix to catch up with TSMC in IC packaging with government help
According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...
Tuesday 12 September 2023
Next US export ban against China could target advanced packaging
In light of the fact that Chinese foundries can still obtain used equipment and consumables for process technology upgrades despite the US ban, the US could target advanced packaging...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Monday 11 September 2023
Advanced packaging and testing takes step in four major sectors, showcasing several high-end test interfaces
Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...
Friday 8 September 2023
IC packaging material suppliers to capitalize on CoWoS surge
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
Research Report Database
Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research